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Author:

Wang, J. (Wang, J..) | Zhang, Y. (Zhang, Y..) | Zhu, X. (Zhu, X..) | Xia, G. (Xia, G..)

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Scopus

Abstract:

In this work, molecular dynamics simulation was employed to study the icing process on a platinum surface under the influence of the solid-water interfacial heat transfer. It is found that the heat transfer can play a significant role in the heterogeneous icing process, particularly for hydrophobic surfaces with weak interfacial bonding. The ice nucleation occurs slowly since the water molecules have to be cooled down by the interfacial heat transfer. However, the ice can grow faster on a surface with the effect of heat transfer, because the water molecules can be re-arranged in ice-like structure during the cooling period. As the interfacial bonding strength increases, the effect of interfacial heat transfer can be neglected, and the icing process can be enhanced, which is attributed to the high free energy barrier and weak diffusion effect. The findings in this paper provide an in-depth understanding of the effect of the interfacial bonding on the heterogeneous icing process. © 2025 Beijing University of Technology. All rights reserved.

Keyword:

heterogeneous icing interfacial heat transfer molecular dynamics simulation nucleation rate wettability solid-liquid bonding strength

Author Community:

  • [ 1 ] [Wang J.]Beijing Key Laboratory of Heat Transfer and Energy Conversion, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Zhang Y.]Beijing Key Laboratory of Heat Transfer and Energy Conversion, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Zhu X.]Beijing Key Laboratory of Heat Transfer and Energy Conversion, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Xia G.]Beijing Key Laboratory of Heat Transfer and Energy Conversion, Beijing University of Technology, Beijing, 100124, China

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Source :

Journal of Beijing University of Technology

ISSN: 0254-0037

Year: 2025

Issue: 2

Volume: 51

Page: 130-139

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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