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Author:

Liu, Zeng-Hua (Liu, Zeng-Hua.) (Scholars:刘增华) | Zhao, Ji-Chen (Zhao, Ji-Chen.) | Wu, Bin (Wu, Bin.) | He, Cun-Fu (He, Cun-Fu.) (Scholars:何存富)

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Abstract:

To achieve active health monitoring of plate-like objects, piezoelectric ceramic wafers bonded in the structures are applied for excitation and reception of guided wave modes and proper modes are optimized for identification and evaluation of the defects. According to the theoretical prediction, compared with A0 mode, S0 mode in a low frequency range with dominant in-plane displacement and low dispersion is suitable for defect detection in the aluminum plate. The piezoelectric ceramic wafers 11 mm in diameter and 0.4 mm in thickness are used for excitation and reception of S0 mode at 300 kHz, which is suitable for defect detection in aluminum plates with a thickness of 1 mm. Based on the experimental results, an artificial hole-like defect is machined in the plate for verifying the ability of defect detection using S0 mode, and the effect of the defect diameter on the amplitudes of received guided wave signals is further analyzed. Experimental results show that Lamb wave modes can be applied for defect detection in the aluminum plate using the pitch-catch method and defect characterization can be achieved based on the amplitudes of the received echoes.

Keyword:

Ultrasonic applications Structural health monitoring Aluminum Aluminum plating Piezoelectric ceramics Wafer bonding Guided electromagnetic wave propagation Dispersion (waves) Ultrasonic waves Defects Piezoelectricity Plates (structural components) Surface waves Ceramic materials

Author Community:

  • [ 1 ] [Liu, Zeng-Hua]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Zhao, Ji-Chen]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 4 ] [He, Cun-Fu]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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Source :

Journal of Beijing University of Technology

ISSN: 0254-0037

Year: 2011

Issue: 1

Volume: 37

Page: 27-32

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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