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Author:

He, Cunfu (He, Cunfu.) (Scholars:何存富) | Yuan, Hongmei (Yuan, Hongmei.) | Wu, Bin (Wu, Bin.)

Indexed by:

EI Scopus PKU CSCD

Abstract:

The sealing of flexible packages plays an important role in product quality. Ultrasonic non-destructive testing technique is introduced to detect flexible package seal quality. The channel defects with diameters between 50 μm and 150 μm in the seal area of flexible packages are detected using backscattered echo envelope integral imaging method. The images are formed with an immersion spot focused 22.66 MHz ultrasound transducer scanning over a 2.98 mm1.5 mm rectangular gird. Theoretical analysis for the influence of the transducer lateral resolution on ultrasonic testing result is carried out while the scanning step size is less than lateral resolution of the transducer; and the relation between ultrasonic testing result and actual defect size is given in different scope of defect size. The results show that the channel defects in flexible packages can be effectively detected using ultrasonic backscattered echo envelope integral imaging method, and the size of defects on the ultrasonic image is larger than its actual size, which is correlated with the lateral resolution of the transducer. The experimental results are in good agreement with the theoretical analysis.

Keyword:

Nondestructive examination Seals Ultrasonic testing Packaging machines Transducers Ultrasonic imaging Packaging Defects Ultrasonic transducers

Author Community:

  • [ 1 ] [He, Cunfu]College of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Yuan, Hongmei]College of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Wu, Bin]College of Mechanical Engineering and Applied Electronic Technology, Beijing University of Technology, Beijing 100124, China

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Source :

Chinese Journal of Scientific Instrument

ISSN: 0254-3087

Year: 2009

Issue: 4

Volume: 30

Page: 750-755

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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