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Author:

Zhang, Yue-Zong (Zhang, Yue-Zong.) | Feng, Shi-Wei (Feng, Shi-Wei.) (Scholars:冯士维) | Zhang, Gong-Chang (Zhang, Gong-Chang.) | Wang, Cheng-Dong (Wang, Cheng-Dong.) | Lu, Chang-Zhi (Lu, Chang-Zhi.)

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Abstract:

Study the high temperature characteristics of the ohmic contact of Ti/Al/Ni/AuC 15 nm/220 nm/40 nm/50 nm) multiplayer contacts to n-type GaN(Nd=3.7 × 1017 cm-3, Nd=3.0 × 1018 cm-3), the experiment shows that the contact resistivity keeps unchanged and shows good temperature reliability when the storage temperature under 300°C during the storage time of 0-24 hours; but the ohmic contact has shown evident degeneration after the storage at 300°C for 24 hours and at 500°C for 24 hours respectively. Furthermore, the contact resisivity shows unrecoverable characteristic. The contact resistivity will increase with the measurement temperature, and the tendency of increasing is related to doping concentration, The higher the doping concentration, the slower of decreasing the contact resistivity with measurement temperature. Ti/Al/Ni/Au ohmic contact to heavy doping n-GaN better high temperature reliability.

Keyword:

Metallorganic chemical vapor deposition Doping (additives) Multilayers Electric conductivity Ohmic contacts Reliability Gallium nitride

Author Community:

  • [ 1 ] [Zhang, Yue-Zong]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 2 ] [Feng, Shi-Wei]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 3 ] [Zhang, Gong-Chang]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 4 ] [Wang, Cheng-Dong]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China
  • [ 5 ] [Lu, Chang-Zhi]College of Electronic Information and Control Engineering, Beijing University of Technology, Beijing 100022, China

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Source :

Journal of Beijing University of Technology

ISSN: 0254-0037

Year: 2007

Issue: 11

Volume: 33

Page: 1153-1157

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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