Solder Joint Structure of Sn-58Bi Solder Paste with Epoxy-based Flux - Details

Author：

Li, Qingyang (Li, Qingyang.) | Yang, Xiaojun (Yang, Xiaojun.) | Li, Chengfei (Li, Chengfei.)

Indexed by：

CPCI-S EI Scopus

Abstract：

Non-clean　soldering　technology　and　low　temperature　bonding　will　be　of　great　significant　for　applications　in　electronic　industry.　A　curable　solder　paste　containing　epoxy-based　flux　and　Sn-58Bi　solder　powder　was　developed.　The　solder　joint　covered　by　cured　epoxy　shell　can　be　obtained　by　soldering　process.　The　thermal-curing　process　of　the　curable　flux　was　monitored　by　DSC　to　ensure　the　wetting　and　metallurgical　connection　between　Sn-58Bi　and　Cu　substrate.　The　microstructure　characteristics　of　the　solder　joints　were　analyzed　by　metallurgical　analysis　and　SEM　observation.　The　factors　influencing　the　structure　of　the　solder　joints　were　analyzed　and　discussed.　©　Published　under　licence　by　IOP　Publishing　Ltd.

Keyword：

Soldering Low temperature operations Copper metallurgy Tin metallography Bismuth alloys Temperature Tin metallurgy Electronics industry Bismuth metallurgy Curing Binary alloys Tin alloys Copper metallography Lead-free solders Bismuth metallography

Author Community：

[ 1 ] [Li, Qingyang]College of Material Science and Engineering, Beijing University of Technology, Beijing, China
[ 2 ] [Yang, Xiaojun]College of Material Science and Engineering, Beijing University of Technology, Beijing, China
[ 3 ] [Li, Chengfei]College of Material Science and Engineering, Beijing University of Technology, Beijing, China

Reprint Author's Address：

[yang, xiaojun]college of material science and engineering, beijing university of technology, beijing, china

Email：

yangxj@bjut.edu.cn

Show more details

Related Keywords：

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Source ：

ISSN： 1742-6588

Year： 2020

Issue： 1

Volume： 1622

Language： English

Cited Count：

WoS CC Cited Count：

SCOPUS Cited Count： 3

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 4

Affiliated Colleges：

材料科学与工程学院本学院/部未明确归属的数据

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