In　this　paper,　thermally　aware　optimized　measurement　of　field　programmable　gate　array　(FPGA)-based　systems　using　ring　oscillator　(RO)-based　thermal　sensors　is　proposed　for　thermal　management.　The　sensor　array　was　distributed　uniformly　on　the　FPGA　in　a　novel　layout,　and　was　optimized　on　allocation　using　a　trade-off　between　sensor　number　and　measurement　resolution.　This　method　is　suitable　for　various　applications　on　FPGAs.　To　heat　the　chip　and　generate　hot　spots　and　large　temperature　gradients　for　measurement　validation,　a　self-heating　test　module　that　uses　the　FPGA　resources　is　also　presented.　©　2016　IEEE.