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Author:

Guan, Jia-Liang (Guan, Jia-Liang.) | Ma, Xin-Qiang (Ma, Xin-Qiang.) | Cao, Cheng-Guo (Cao, Cheng-Guo.) | Zhang, Xiao-Hui (Zhang, Xiao-Hui.) | Zhu, Lei (Zhu, Lei.)

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EI Scopus

Abstract:

This paper describes the analysis of the chip formation mechanism in mold machining process of large diameter Fresnel lens based on the ABAQUS finite element simulation software and modal test methods. Combined with the material constitutive relation and material failure criteria etc, a two-dimensional orthogonal cutting model was established and the chip derived from the simulation was compared with the chip from modal test, with a consequent verification of the feasibility of simulation chip model. The simulation contributes to an investigation into the effects of the cutting speed on chip formation process. The results show that: the material strength and plastic brittle have significant impact on chip morphology in the H62 brass mold processing, and material strength will improve with the increase of strain rate, the evolution process of the chip of material plastic reduction can be divided into: ribbon cuttings, serrated chips, cell chips. © (2014) Trans Tech Publications, Switzerland.

Keyword:

Strength of materials Optical instrument lenses Materials ABAQUS Engineering technology Testing Molds Finite element method Computer simulation Modal analysis

Author Community:

  • [ 1 ] [Guan, Jia-Liang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 2 ] [Ma, Xin-Qiang]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 3 ] [Cao, Cheng-Guo]Beijing Precision Machinery and Engineering Research Co., td, Beijing 101312, China
  • [ 4 ] [Zhang, Xiao-Hui]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China
  • [ 5 ] [Zhu, Lei]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing 100124, China

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ISSN: 1022-6680

Year: 2014

Volume: 912-914

Page: 732-735

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

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