Multiple healing fatigue damage by laser shock peening for copper thin film - Details

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Abstract：

Multiple　healing　fatigue　damage　for　polycrystal　copper　film　was　investigated　by　laser　shock　peening　(LSP).　The　damaged　specimens　were　healed　several　times　under　the　optimal　laser　parameters.　The　relationship　among　the　fatigue　life,　healing　times　and　the　damage　degree　were　investigated.　The　experimental　results　showed　that　the　multiple　heal　based　on　LSP　can　maximize　fatigue　life　of　the　damaged　specimens　under　the　definite　optimal　condition　with　the　obtained　at　damage　degree　of　0.4　and　healing　times　of　3,　in　which　nearly　4.6　times　increase　in　residual　fatigue　life　for　the　damaged　specimens,　and　7.8　times　increase　in　the　accumulated　fatigue　life.　©　(2013)　Trans　Tech　Publications,　Switzerland.

Keyword：

Electronics engineering Information technology Fatigue damage Optimization

Author Community：

[ 1 ] [Jin, Jia]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
[ 2 ] [Shang, De-Guang]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
[ 3 ] [Liu, Xiao-Dong]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
[ 4 ] [Zhang, Li-Hong]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
[ 5 ] [Guo, Yu-Bo]Beijing University of Technology, College of Mechanical Engineering and Applied Electronics Technology, Beijing 100124, China
[ 6 ] [Chen, Tao]Beijing University of Technology, Institute of Laser Engineering, Beijing 100124, China

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Source ：

ISSN： 1022-6680

Year： 2013

Volume： 760-762

Page： 413-416

Language： English

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count：

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 10

Affiliated Colleges：

材料科学与工程学院本学院/部未明确归属的数据

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