Indexed by：
Abstract：
For the optically pumped semiconductor disk lasers, the thermal problem is the key to obtain the high out power. To solve this problem, we simulated the heat distribution of the gain chip by finite-element analysis method to discover the heat spread affected by the thickness of the substrate and found the outstanding heat spread result of the diamond chip.
Keyword：
Reprint Author's Address：
Email：
Source ：
Year： 2012
Page： 231-233
Language： English
Cited Count：
WoS CC Cited Count： 0
SCOPUS Cited Count：
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 8
Affiliated Colleges：
