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Author:

Guan, Jialiang (Guan, Jialiang.) | Zhang, Longyue (Zhang, Longyue.) | Liu, Shujun (Liu, Shujun.) | Yang, Yang (Yang, Yang.)

Indexed by:

EI Scopus SCIE

Abstract:

Aiming at the problem of poor processing performance and difficult processing in the process of aluminum-based diamond composites for electronic packaging, this paper uses electrolytic in-process dressing (ELID) grinding technology to grind the aluminum-based diamond composites. The quadratic orthogonal rotation combination method was used to investigate the influence law and degree of grinding depth, grinding wheel linear velocity, duty cycle and electrolysis current on surface roughness. The ELID grinding optimization process parameters of aluminum-based diamond composites obtained by LINGO software are: grinding depth 9.3 mu m, grinding wheel linear speed 36 m/s, duty cycle 63.7%, electrolysis current 11.5A. The surface of the aluminum-based diamond composite with a surface roughness of 125 nm was machined by this optimized process parameter combination.

Keyword:

Optimized process parameters Aluminum-based diamond composite ELID grinding Surface roughness Quadratic orthogonal rotation combination

Author Community:

  • [ 1 ] [Guan, Jialiang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Zhang, Longyue]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Liu, Shujun]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China
  • [ 4 ] [Yang, Yang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Zhang, Longyue]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing Key Lab Adv Mfg Technol, Beijing 100124, Peoples R China

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Source :

SCIENCE AND ENGINEERING OF COMPOSITE MATERIALS

ISSN: 0792-1233

Year: 2019

Issue: 1

Volume: 26

Page: 550-562

1 . 9 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:211

JCR Journal Grade:4

Cited Count:

WoS CC Cited Count: 2

SCOPUS Cited Count: 3

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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