To　explore　a　possibility　of　grinding　difficult-to-cut　materials　such　as　hardened　die-steel　SKD11　(HRC60)　by　using　high-quality　TiC　whiskers,　a　unique　TiC　whisker　grinding　wheel　was　developed,　in　which　the　whiskers　were　aligned　normally　to　the　grinding　wheel　surface.　In　this　paper,　grindabilities　of　TiC　whisker　grinding　wheel　are　investigated　and　compared　with　those　of　SiC　whisker　grinding　wheel　[1-5].　The　investigations　have　shown　that　TiC　whisker　grinding　wheel　has　very　high　grinding　ratio　(over　7000)　and　high　efficiency,　and　that　a　nanometer　level　ground　surface　with　roughness　values　of　Ra2.0nm　and　Ry25nm　can　be　achieved.