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Author:

Yan, Zhaoyang (Yan, Zhaoyang.) | Chen, Shujun (Chen, Shujun.) (Scholars:陈树君) | Jiang, Fan (Jiang, Fan.) (Scholars:蒋凡) | Huang, Ning (Huang, Ning.) | Zhang, Suolai (Zhang, Suolai.)

Indexed by:

EI Scopus SCIE

Abstract:

Compound tracking was proposed to obtain the flow trajectory of aluminum keyhole molten pool in a successful and high quality welded joint. The Cu element was selected to form an easily distinguishable compound with Al matrix. Al-Cu distributions at each interface were obtained by slicing; 3D reconstruction was used to describe the flow behavior in the keyhole. The results showed that material flow in the leading side flowed to the rear-side along the keyhole wall without complex convection. It became complicated before keyhole closing phase. During weld formation, the metal in the center flowed toward the surface and the bottom, while the metal in the wall flowed toward the center (The center is the middle area along the thickness direction of the keyhole rear side). Material flow during the entire variable polarity plasma arc (VPPA) process can be clearly explained by this method.

Keyword:

Molten pool Keyhole welding Aluminum alloy Material flow

Author Community:

  • [ 1 ] [Yan, Zhaoyang]Beijing Univ Technol, Minist Educ, Engn Res Ctr Adv Mfg Technol Automot Components, Beijing 100124, Peoples R China
  • [ 2 ] [Chen, Shujun]Beijing Univ Technol, Minist Educ, Engn Res Ctr Adv Mfg Technol Automot Components, Beijing 100124, Peoples R China
  • [ 3 ] [Jiang, Fan]Beijing Univ Technol, Minist Educ, Engn Res Ctr Adv Mfg Technol Automot Components, Beijing 100124, Peoples R China
  • [ 4 ] [Huang, Ning]Beijing Spacecrafts Co Ltd, Beijing, Peoples R China
  • [ 5 ] [Zhang, Suolai]Beijing Spacecrafts Co Ltd, Beijing, Peoples R China

Reprint Author's Address:

  • 蒋凡

    [Jiang, Fan]Beijing Univ Technol, Minist Educ, Engn Res Ctr Adv Mfg Technol Automot Components, Beijing 100124, Peoples R China

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Source :

JOURNAL OF MANUFACTURING PROCESSES

ISSN: 1526-6125

Year: 2018

Volume: 36

Page: 480-486

6 . 2 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:156

Cited Count:

WoS CC Cited Count: 22

SCOPUS Cited Count: 23

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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