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Author:

Wang, Ruifeng (Wang, Ruifeng.) | Li, Ang (Li, Ang.) (Scholars:李昂) | Huang, Tianyu (Huang, Tianyu.) | Zhang, Bin (Zhang, Bin.) | Peng, Kunling (Peng, Kunling.) | Yang, Hengquan (Yang, Hengquan.) | Lu, Xu (Lu, Xu.) | Zhou, Xiaoyuan (Zhou, Xiaoyuan.) | Han, Xiaodong (Han, Xiaodong.) (Scholars:韩晓东) | Wang, Guoyu (Wang, Guoyu.)

Indexed by:

EI Scopus SCIE

Abstract:

An enhancement on thermoelectric performance of Cu2GeSe3 via simultaneously Ag-alloying on Cu sites and Ga-doping on Ge sites is achieved. The relatively high solubility (similar to 10%) of Ag on Cu sites allows for the strong point defect scattering for phonons, which causes remarkable reduction in lattice thermal conductivity. Ag-rich precipitates emerge when the amount of Ag is higher than the solubility on Cu site, which however do not have significant effect on the lattice thermal conductivity since it is already very close to the lower limit of kinetic theory. Ga-doping, an effective way to tune the hole concentration, leads to optimization of power factor in the whole temperature range. The maximal zT obtained in Cu1.9Ag0.1Ge0.997Ga0.003Se3 is 1.03@786 K, about 58% higher than that in previous report. In addition, the average zT in the temperature range from 320 K to 786 K is 0.58, implying great potential for fabrication of thermoelectric devices. (c) 2018 Elsevier B.V. All rights reserved.

Keyword:

Cu2GeSe3 Thermoelectrics Doping Alloying Precipitates

Author Community:

  • [ 1 ] [Wang, Ruifeng]Chinese Acad Sci, Chongqing Inst Green & Intelligent Technol, Chongqing 400714, Peoples R China
  • [ 2 ] [Huang, Tianyu]Chinese Acad Sci, Chongqing Inst Green & Intelligent Technol, Chongqing 400714, Peoples R China
  • [ 3 ] [Peng, Kunling]Chinese Acad Sci, Chongqing Inst Green & Intelligent Technol, Chongqing 400714, Peoples R China
  • [ 4 ] [Wang, Guoyu]Chinese Acad Sci, Chongqing Inst Green & Intelligent Technol, Chongqing 400714, Peoples R China
  • [ 5 ] [Li, Ang]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
  • [ 6 ] [Han, Xiaodong]Beijing Univ Technol, Beijing Key Lab Microstruct & Property Adv Mat, Beijing 100124, Peoples R China
  • [ 7 ] [Zhang, Bin]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 8 ] [Peng, Kunling]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 9 ] [Yang, Hengquan]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 10 ] [Lu, Xu]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 11 ] [Zhou, Xiaoyuan]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China
  • [ 12 ] [Wang, Ruifeng]Univ Chinese Acad Sci, Beijing 100044, Peoples R China
  • [ 13 ] [Huang, Tianyu]Univ Chinese Acad Sci, Beijing 100044, Peoples R China
  • [ 14 ] [Wang, Guoyu]Univ Chinese Acad Sci, Beijing 100044, Peoples R China

Reprint Author's Address:

  • [Wang, Guoyu]Chinese Acad Sci, Chongqing Inst Green & Intelligent Technol, Chongqing 400714, Peoples R China;;[Lu, Xu]Chongqing Univ, Coll Phys, Chongqing 401331, Peoples R China

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Source :

JOURNAL OF ALLOYS AND COMPOUNDS

ISSN: 0925-8388

Year: 2018

Volume: 769

Page: 218-225

6 . 2 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:260

JCR Journal Grade:1

Cited Count:

WoS CC Cited Count: 12

SCOPUS Cited Count: 14

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 8

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