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Author:

Wu, B. (Wu, B..) | Wang, X. (Wang, X..) | Liu, X. (Liu, X..) (Scholars:刘晓) | Zhang, R. (Zhang, R..) | Xing, P. (Xing, P..) | He, C. (He, C..)

Indexed by:

Scopus PKU CSCD

Abstract:

To apply the micro-magnetic testing method to the induction hardened case depth evaluation, an integrated sensor was designed to synchronously detect the tangential magnetic field strength signal, the hysteresis curves and the Barkhausen noise. A total of eight features or parameters were extracted from the above mentioned three kinds of signals for induction hardened case depth characterization in steel rods. Stepwise regression method was employed to help select the parameters with a significant level lower than 0.07. Finally, the coercive force Hc, the amplitude of the three harmonics (A3), the distortion factor (K) of tangential magnetic field strength signal, and the parameter Hcm of the butterfly-like Barkhausen noise envelop were selected as the input of a multivariable linear regression model. The established linear regression model had an averaged prediction error of 3.87%. The developed experimental set-up together with the signal analysis method is expected to be applied to quantitative measurement of the induction hardened case depth in rod-like ferromagnetic components. © 2018, Editorial Department of Journal of Beijing University of Technology. All right reserved.

Keyword:

Induction hardened layer depth; Micro-magnetic test; Multivariable linear regression; Prediction model

Author Community:

  • [ 1 ] [Wu, B.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 2 ] [Wang, X.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 3 ] [Liu, X.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 4 ] [Zhang, R.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 5 ] [Xing, P.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China
  • [ 6 ] [He, C.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of Technology, Beijing, 100124, China

Reprint Author's Address:

  • 刘晓

    [Liu, X.]College of Mechanical Engineering and Applied Electronics Technology, Beijing University of TechnologyChina

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Source :

Journal of Beijing University of Technology

ISSN: 0254-0037

Year: 2018

Issue: 5

Volume: 44

Page: 687-692

Cited Count:

WoS CC Cited Count:

SCOPUS Cited Count: 7

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 0

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