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学者姓名：代岩伟
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Abstract ：
PurposeThis study aims to characterize the mechanical properties of sintered nano-silver under various sintering processes by nano-indentation tests.Design/methodology/approachThrough microstructure observations and characterization, the influences of sintering process on the microstructure evolutions of sintered nano-silver were presented. And, the indentation load, indentation displacement curves of sintered silver under various sintering processes were measured by using nano-indentation test. Based on the nano-indentation test, a reverse analysis of the finite element calculation was used to determine the yielding stress and hardening exponent.FindingsThe porosity decreases with the increase of the sintering temperature, while the average particle size of sintered nano-silver increases with the increase of sintering temperature and sintering time. In addition, the porosity reduced from 34.88%, 30.52%, to 25.04% if the ramp rate was decreased from 25 degrees C/min, 15 degrees C/min, to 5 degrees C/min, respectively. The particle size appears more frequently within 1 mu m and 2 mu m under the lower ramp rate. With reverse analysis, the strain hardening exponent gradually heightened with the increase of temperature, while the yielding stress value decreased significantly with the increase of temperature. When the sintering time increased, the strain hardening exponent increased slightly.Practical implicationsThe mechanical properties of sintered nano-silver under different sintering processes are clearly understood.Originality/valueThis paper could provide a novel perspective on understanding the sintering process effects on the mechanical properties of sintered nano-silver.
Keyword ：
Microstructure evolution Microstructure evolution Nano-indentation Nano-indentation Elastoplastic behaviors Elastoplastic behaviors Sintered nano-silver Sintered nano-silver Sintering process Sintering process
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| GB/T 7714 | Dai, Yanwei , Zhao, Libo , Qin, Fei et al. Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2024 . |
| MLA | Dai, Yanwei et al. "Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters" . | SOLDERING & SURFACE MOUNT TECHNOLOGY (2024) . |
| APA | Dai, Yanwei , Zhao, Libo , Qin, Fei , Chen, Si . Elastoplastic nanoindentation behaviors of sintered nano-silver under various sintering parameters . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2024 . |
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Abstract ：
Nonproportional loading and residual stresses effects on creep crack tip fields are important topics in fracture mechanics at elevated temperature. In this paper, nonproportional loading and residual stresses effects on creep crack tip fields are systematically investigated based on the novel interpretation of C(t)-integral considering residual stress. With the numerical implementation of the corrected C(t)-integral considering residual stress, the eigenstrain and mechanical induced residual stress effects on the creep crack tip fields are studied. We find that C(t)-integral level is affected remarkably in the presence of residual stress regardless of eigenstrain or mechanical induced residual stresses for creep crack tip under small scale creep. However, level of C*-integral is not significantly influenced under the effects of residual stresses in presence of large-scale creep although the transition creep time is remarkably changed. Otherwise, C(t)-integral is highly affected by loading path under small scale creep. However, C*-integral is independent of the loading path if the creep time is long enough. Nonproportional loading effect on C*-integral is very limited for creep crack tip field according to our study. The investigation given in this paper could deepen the understanding the effects of residual stress and nonproportional loading on the creep crack tip field.
Keyword ：
Crack tip fields Crack tip fields C(t)-integral C(t)-integral Residual stress Residual stress Creep crack Creep crack Nonproportional loading Nonproportional loading
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| GB/T 7714 | Liu, Wei , Dai, Yanwei , Liu, Yinghua et al. Effects of nonproportional loading and residual stress on creep crack tip fields [J]. | ENGINEERING FRACTURE MECHANICS , 2023 , 281 . |
| MLA | Liu, Wei et al. "Effects of nonproportional loading and residual stress on creep crack tip fields" . | ENGINEERING FRACTURE MECHANICS 281 (2023) . |
| APA | Liu, Wei , Dai, Yanwei , Liu, Yinghua , Kong, Weichen . Effects of nonproportional loading and residual stress on creep crack tip fields . | ENGINEERING FRACTURE MECHANICS , 2023 , 281 . |
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Abstract ：
One of the main failure modes of an insulated-gate bipolar transistor (IGBT) module is the reconstruction of an aluminum (Al) metallization layer on the surface of the IGBT chip. In this study, experimental observations and numerical simulations were used to investigate the evolution of the surface morphology of this Al metallization layer during power cycling, and both internal and external factors affecting the surface roughness of the layer were analyzed. The results indicate that the microstructure of the Al metallization layer evolves during power cycling, where the initially flat surface gradually becomes uneven, such that the roughness varies significantly across the IGBT chip surface. The surface roughness depends on several factors, including the grain size, grain orientation, temperature, and stress. With regard to the internal factors, reducing the grain size or orientation differences between neighboring grains can effectively decrease the surface roughness. With regard to the external factors, the reasonable design of the process parameters, a reduction in the stress concentration and temperature hotspots, and preventing large local deformation can also reduce the surface roughness.
Keyword ：
crystal thermo-elasto-plasticity finite element crystal thermo-elasto-plasticity finite element Al metallization layer Al metallization layer surface roughness surface roughness power cycling power cycling macro-mesoscale modeling macro-mesoscale modeling
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| GB/T 7714 | An, Tong , Zheng, Xueheng , Qin, Fei et al. Macro-Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling [J]. | MATERIALS , 2023 , 16 (5) . |
| MLA | An, Tong et al. "Macro-Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling" . | MATERIALS 16 . 5 (2023) . |
| APA | An, Tong , Zheng, Xueheng , Qin, Fei , Dai, Yanwei , Gong, Yanpeng , Chen, Pei . Macro-Mesoscale Modeling of the Evolution of the Surface Roughness of the Al Metallization Layer of an IGBT Module during Power Cycling . | MATERIALS , 2023 , 16 (5) . |
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Abstract ：
Under the operating conditions of high power and high switching frequency, an insulated gate bipolar transistor (IGBT) chip can produce relatively large power loss, causing the junction temperature to rise rapidly; consequently, the reliability of the IGBT module can be seriously affected. Therefore, it is necessary to accurately predict the junction temperature of the IGBT chip. The resistance capacitance (RC) thermal network model is a commonly used method for IGBT junction temperature prediction. In this paper, the model parameters are obtained by two methods to establish the Cauer thermal network models of the IGBT module. The first method is to experimentally obtain the transient thermal impedance curve of the IGBT module and the structure function and then extract the individual thermal parameters of the Cauer thermal network model; the second method is to obtain the thermal parameters of the thermal network model directly by using theoretical formulas that consider the influence of the heat spreading angle. The predicted junction temperatures of the Cauer thermal network models established by the two methods are compared with the junction temperatures obtained from infrared (IR) measurements during the power cycling test, the junction temperatures measured by the temperature-sensitive electrical parameter (TSEP) method, and the junction temperatures calculated by finite element (FE) analysis. Additionally, the Cauer thermal network models established by the two methods are compared and verified. The results indicate that the Cauer thermal network model established based on theoretical formulas can accurately predict the maximum junction temperature of the IGBT chip, and the calculated temperature for each layer, from the IGBT chip layer to the ceramic layer, also accords well with the FE results. The Cauer thermal network model established based on the experimental test and the structure function can accurately predict the average junction temperature of the IGBT chip.
Keyword ：
insulated gate bipolar transistor insulated gate bipolar transistor junction temperature junction temperature Cauer thermal network models Cauer thermal network models
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| GB/T 7714 | An, Tong , Zhou, Rui , Qin, Fei et al. Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module [J]. | ELECTRONICS , 2023 , 12 (7) . |
| MLA | An, Tong et al. "Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module" . | ELECTRONICS 12 . 7 (2023) . |
| APA | An, Tong , Zhou, Rui , Qin, Fei , Dai, Yanwei , Gong, Yanpeng , Chen, Pei . Comparative Study of the Parameter Acquisition Methods for the Cauer Thermal Network Model of an IGBT Module . | ELECTRONICS , 2023 , 12 (7) . |
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Abstract ：
In this paper, the elastoplastic and creep constitutive behaviors of sintered silver with varying amounts of nickel-modified multiwall carbon nanotubes are studied through a systematic investigation of the nanoindentation test. Elastoplastic stress-strain curves for the sintered silver with different additive content are obtained based on reverse analysis. The addition of nickel-modified multiwall carbon nanotubes reduced the yielding stress from 110.68 MPa to 61.61 MPa and generally increased the strain-hardening exponent from 0.26 to 0.41. The initial and steady-state creep stress exponent remained almost unchanged. However, the creep coefficient increased remarkably. Otherwise, the yielding stress was confirmed to agree well with the Hall-Petch relation, and the hardening exponent was found to follow Morrison's law. The creep exponents and creep coefficients were also obtained and shown to be highly related to the particle size and positively correlated with porosity. The creep regime at room temperature was confirmed to obey Sherby's model. This investigation shows the effect of additive content on sintered silver. The study given in this paper could deepen the understanding of the strengthening effect of nickel-modified multiwall carbon nanotubes on the mechanical performance of sintered silver at room temperature.
Keyword ：
nanoindentation nanoindentation Sintered Ag Sintered Ag elastoplasticity elastoplasticity creep creep nickel-modified multiwall carbon nanotubes nickel-modified multiwall carbon nanotubes
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| GB/T 7714 | Dai, Yanwei , Zan, Zhi , Zhao, Libo et al. Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2023 , 53 (3) : 1344-1359 . |
| MLA | Dai, Yanwei et al. "Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler" . | JOURNAL OF ELECTRONIC MATERIALS 53 . 3 (2023) : 1344-1359 . |
| APA | Dai, Yanwei , Zan, Zhi , Zhao, Libo , Qin, Fei . Nanoindentation Elastoplastic and Creep Behaviors of Sintered Nano-Silver Doped with Nickel-Modified Multiwall Carbon Nanotube Filler . | JOURNAL OF ELECTRONIC MATERIALS , 2023 , 53 (3) , 1344-1359 . |
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Abstract ：
A fatigue crack growth rate model introducing corrosion damage is proposed in this paper, where the fracture parameter is modified by the damage variable and the exponential influence factor. The corrosion damage mechanism is coupled to the crack growth rate model, which quantifies the influence of the environment and reflects the interaction between corrosion and fatigue. To accurately predict the corrosion-fatigue crack growth life by the extended finite element method (XFEM), a simple crack surface updating method is developed. This method does not depend on the complex level set marching algorithm which often brings serious computational convergence problem, so it has good robustness and high efficiency. Moreover, the stress intensity factors at arbitrary crack tip can be calculated by combining the interaction integral method and the piecewise interpolation method, so it is suitable for the double crack-tip problem. The corrosionfatigue crack growth life is calculated based on the cycle-by-cycle method and the corresponding algorithm is developed. The corrosion-fatigue crack growth life can be accurately predicted by calculating the corrosion damage and crack propagation length under each load cycle. In this paper, sufficient examples are given to verify the accuracy of the proposed method in simulating crack propagation path and predicting corrosion-fatigue life. Finally, this method is well applied to a practical engineering structure.
Keyword ：
Extended finite element method Extended finite element method Crack growth rate model Crack growth rate model Fatigue life calculation Fatigue life calculation Corrosion damage Corrosion damage Crack surface update Crack surface update
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| GB/T 7714 | Chen, Zhiying , Dai, Yanwei , Liu, Yinghua . Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method [J]. | ENGINEERING FRACTURE MECHANICS , 2023 , 289 . |
| MLA | Chen, Zhiying et al. "Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method" . | ENGINEERING FRACTURE MECHANICS 289 (2023) . |
| APA | Chen, Zhiying , Dai, Yanwei , Liu, Yinghua . Life prediction of corrosion-fatigue based on a new crack growth rate model with damage and the extended finite element method . | ENGINEERING FRACTURE MECHANICS , 2023 , 289 . |
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Abstract ：
The die shear test is a feasible and conventional method to characterize the shear strength of die-attaching layer materials in electronic packaging. A new method for determining cohesive zone model (CZM) parameters using deep neural networks (DNN) and die shear tests is proposed, different from classical fracture framework or lap shear test-based methods. With the sintered nano-silver die shear test, the results show that the bilinear CZM inversion results agree well with the experimental results. It is found that the DNN model has high accuracy in predicting and identifying the maximum shear traction strength tau max, separation displacement of the interface delta f, and the interface stiffness k1 of CZM parameters for sintered nano-silver adhesive layer through die shear test load versus displacement curves. The presented DNN-aided inverse identifying method through the die shear test in this paper could provide an alternative and convenient method for extracting CZM parameters of various kinds of adhesive materials in electronic packaging. Die shear tests were used for the inverse identification of CZM parameters.The die shear test P-delta curves were established as the dataset.A DNN-aided CZM inverse identification method was proposed.The DNN-aided model can accurately identify the CZM parameters.
Keyword ：
CZM CZM DNN DNN die shear test die shear test sintered silver sintered silver machine learning machine learning
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| GB/T 7714 | Zhao, Libo , Dai, Yanwei , Wei, Jiahui et al. Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging [J]. | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES , 2023 , 47 (3) : 766-780 . |
| MLA | Zhao, Libo et al. "Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging" . | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES 47 . 3 (2023) : 766-780 . |
| APA | Zhao, Libo , Dai, Yanwei , Wei, Jiahui , Qin, Fei . Deep neural network aided cohesive zone parameter identifications through die shear test in electronic packaging . | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES , 2023 , 47 (3) , 766-780 . |
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Abstract ：
Interface creep cracking is very common to be seen in various kinds of welded components which are used widely in engineering practice. In the present paper, the interface creep crack tip field by considering material mismatch effect is studied. The interface creep crack is found to be close to the HRR field which can produce the faster creep crack growth rate. A material mismatch constraint parameter is proposed based on the validation of the local mismatch effect on the interface creep crack tip field which also maintains the self-similarity. An averaged material mismatch constraint M*avg is presented to represent the material mismatch constraint effect. It reveals that the material mismatch constraint effect for interface creep crack decreases with the increase of the local mismatch factor. The physical meaning of the material mismatch constraint effect for the interface creep crack and its future application to engineering failure analysis is also discussed and presented.
Keyword ：
Stress field Stress field Self-similarity Self-similarity Material constraint Material constraint Material mismatch Material mismatch Interface creep crack Interface creep crack
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| GB/T 7714 | Dai, Yanwei , Qin, Fei , Liu, Yinghua et al. Influences of material mismatch on interface crack tip field in three layered creeping materials [J]. | ENGINEERING FAILURE ANALYSIS , 2022 , 140 . |
| MLA | Dai, Yanwei et al. "Influences of material mismatch on interface crack tip field in three layered creeping materials" . | ENGINEERING FAILURE ANALYSIS 140 (2022) . |
| APA | Dai, Yanwei , Qin, Fei , Liu, Yinghua , Chen, Haofeng . Influences of material mismatch on interface crack tip field in three layered creeping materials . | ENGINEERING FAILURE ANALYSIS , 2022 , 140 . |
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Abstract ：
Mud-cracking of the sintered silver (Ag) layer of the SiC power module is commonly found during power cycling tests. In this article, the effect of the mud-cracking of sintered Ag on the heat transfer behaviors of SiC power module is studied based on a Voronoi tessellation model. This model is verified to be reasonable on the prediction of the equivalent thermal conductivity of sintered Ag as well as the thermal resistance of power module. The effect of the crack ratio on the equivalent thermal conductivity of sintered Ag is studied and an empirical model is proposed to predict the equivalent thermal conductivity of sintered Ag containing different mud-cracking ratios. The effect of mud-cracking ratio, chip size, sintered Ag thickness, and porosity on the thermal resistance of power module are studied. An equivalent model to study the heat transfer behaviors of the power module with mud-cracking is also developed to improve the calculation efficiency. This article establishes a new method to quantitively study the heat transfer behaviors of the power module under power cycling condition.
Keyword ：
Geometry Geometry Conductivity Conductivity Mathematical models Mathematical models sintered Ag sintered Ag Multichip modules Multichip modules Behavioral sciences Behavioral sciences Silicon carbide Silicon carbide Voronoi model Voronoi model Heat transfer Heat transfer Mud-cracking Mud-cracking porosity porosity power cycling power cycling
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| GB/T 7714 | Qin, Fei , Zhao, Shuai , Dai, Yanwei et al. Mud-Cracking Effect of Sintered Silver Layer on Quantifying Heat Transfer Behavior of SiC Devices Under Power Cycling: Voronoi Tessellation Model [J]. | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , 2022 , 12 (6) : 964-972 . |
| MLA | Qin, Fei et al. "Mud-Cracking Effect of Sintered Silver Layer on Quantifying Heat Transfer Behavior of SiC Devices Under Power Cycling: Voronoi Tessellation Model" . | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY 12 . 6 (2022) : 964-972 . |
| APA | Qin, Fei , Zhao, Shuai , Dai, Yanwei , Hu, Yuankun , An, Tong , Gong, Yanpeng . Mud-Cracking Effect of Sintered Silver Layer on Quantifying Heat Transfer Behavior of SiC Devices Under Power Cycling: Voronoi Tessellation Model . | IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY , 2022 , 12 (6) , 964-972 . |
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Abstract ：
Thermomechanical reliability assessment for sintered silver is a crucial issue as sintered silver is a promising candidate of die-attachment materials adopted for power devices. In this paper, the nano-indentation tests are performed for sintered silver in typical die-attach interconnection under different thermal cycles. Based on thermal cycling test, the Young's modulus and hardness of sintered silver layer have been presented. It is found that the Young's modulus and hardness of sintered silver layer changes slightly although the microstructure of sintered silver also presents some variations. The stress and strain curves for different thermal cycling tests of sintered silver are also given based on reverse analysis of nano-indentation. The results show that the elastoplastic constitutive equations change significantly after thermal cycling tests, and the yielding stress decreases remarkably after 70 thermal cycles. The experimental investigation also shows that the cracking behaviors of sintered silver depend on its geometry characteristics, which implies that the possible optimization of sintered silver layer could enhance its thermomechanical performance.
Keyword ：
stress strain curve stress strain curve sintered silver sintered silver nano-indentation nano-indentation die-attach interconnection die-attach interconnection thermal cycling thermal cycling
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| GB/T 7714 | Qin, Fei , Zhao, Shuai , Dai, Yanwei et al. Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling [J]. | JOURNAL OF ELECTRONIC PACKAGING , 2022 , 144 (3) . |
| MLA | Qin, Fei et al. "Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling" . | JOURNAL OF ELECTRONIC PACKAGING 144 . 3 (2022) . |
| APA | Qin, Fei , Zhao, Shuai , Dai, Yanwei , Liu, Lingyun , An, Tong , Chen, Pei et al. Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling . | JOURNAL OF ELECTRONIC PACKAGING , 2022 , 144 (3) . |
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