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学者姓名：秦飞
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Abstract ：
Bondline thickness effect on fracture behaviors and cohesive zone model (CZM) is an important topic for adhesive joints. In this paper, the fracture and CZM of sintered nano silver adhesive joints are investigated based on end notched flexure (ENF) test. Results show that load versus displacement curves of sintered silver adhesive joints is sensitive to the bondline thickness. With compliance-based beam method (CBBM), the shearing fracture toughness of sintered silver bonded joints heightens with the increase of bondline thickness, which indicates that shearing fracture toughness is highly dependent on bondline thickness. R curves increase steeply for short equivalent crack length and become plateau for long equivalent crack length. The cracking morphology shows that the cracking paths are mainly interfacial and interlayer types. The bilinear CZM is also presented. The bondline thickness effect on CZM parameter is presented and discussed. The CZM given in this paper can be adopted for reliability analysis in power devices.
Keyword ：
sintered silver sintered silver cohesive zone model cohesive zone model shearing fracture toughness shearing fracture toughness end notched flexure test end notched flexure test bondline thickness effect bondline thickness effect
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| GB/T 7714 | Dai, Yanwei , Li, Yanning , Zan, Zhi et al. Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests [J]. | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES , 2023 , 46 (6) : 2062-2079 . |
| MLA | Dai, Yanwei et al. "Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests" . | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES 46 . 6 (2023) : 2062-2079 . |
| APA | Dai, Yanwei , Li, Yanning , Zan, Zhi , Qin, Fei . Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests . | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES , 2023 , 46 (6) , 2062-2079 . |
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Abstract ：
In this paper, the residual stresses with a nanoscale depth resolution at TSV-Cu/TiW/SiO2/Si interfaces under different thermal loadings are characterized using the ion-beam layer removal (ILR) method. Moreover, the correlations of residual stress, microstructure, and the failure modes of the interfaces are discussed. The residual stresses at the interfaces of TSV-Cu/TiW, TiW/SiO2, and SiO2/Si are in the form of small compressive stress at room temperature, then turn into high-tensile stress after thermal cycling or annealing. In addition, the maximum residual stress inside the TSV-Cu is 478.54 MPa at room temperature, then decreases to 216.75 MPa and 90.45 MPa, respectively, after thermal cycling and annealing. The microstructural analysis indicates that thermal cycling causes an increase in the dislocation density and a decrease in the grain diameter of TSV-Cu. Thus, residual stress accumulates constantly in the TSV-Cu/TiW interface, resulting in the cracking of the interface. Furthermore, annealing leads to the cracking of more interfaces, relieving the residual stress as well as increasing the grain diameter of TSV-Cu. Besides this, the applicability of the ILR method is verified by finite element modeling (FEM). The influence of the geometric errors of the micro-cantilever beam and the damage to the materials introduced by the focused ion beam (FIB) in the experimental results are discussed.
Keyword ：
TSV interconnected interfaces TSV interconnected interfaces ion-beam layer removal (ILR) method ion-beam layer removal (ILR) method residual stress residual stress thermal loading thermal loading microstructure microstructure
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| GB/T 7714 | Zhang, Min , Chen, Fangzhou , Qin, Fei et al. Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading [J]. | MATERIALS , 2023 , 16 (1) . |
| MLA | Zhang, Min et al. "Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading" . | MATERIALS 16 . 1 (2023) . |
| APA | Zhang, Min , Chen, Fangzhou , Qin, Fei , Chen, Si , Dai, Yanwei . Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading . | MATERIALS , 2023 , 16 (1) . |
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Abstract ：
Due to its higher energy and smaller heating area, laser joining technology is widely used in aluminum alloy welding and other industrial fields, which meets the solder sealing requirements for electronic packaging. According to experiments, cracks were prone to occur at the corners and spot-welding positions near the weld. In this paper, the depth and width of the melt pool were measured experimentally, and the results were used to calibrate and validate the heat source model. An empirical relationship between heat source parameters and melt pool morphology is presented. The heat source model of laser deep penetration welding was established under the same experimental conditions. And the results were in agreement with the experimental results. The finite element method was used to numerically simulate the welding process of a 50%SiAl shell and a 27%SiAl cover plate. The effects of different spot-welding sequences and numbers on the residual stress and cracking possibility of laser welded samples were analyzed. The results show that under sequential spot-welding, when the amount of spot-welding is increased, the stress peak value decreases. Compared with sequential spot welding and side-by-side spot welding, the spot-welding sequence of diagonal points first, and then side-by-side spot welding, can effectively reduce the residual stress. This research enables us to provide some guidelines in terms of studying the reliability issues of microwave devices.
Keyword ：
laser spot-welding laser spot-welding deep penetration welding deep penetration welding heat source model calibration heat source model calibration solidification crack solidification crack silicon aluminum alloy silicon aluminum alloy
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| GB/T 7714 | Wang, Song , Shi, Ge , Zhao, Libo et al. Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices [J]. | CRYSTALS , 2023 , 13 (4) . |
| MLA | Wang, Song et al. "Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices" . | CRYSTALS 13 . 4 (2023) . |
| APA | Wang, Song , Shi, Ge , Zhao, Libo , Dai, Yanwei , Hou, Tianyu , He, Ying et al. Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices . | CRYSTALS , 2023 , 13 (4) . |
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Abstract ：
Three-dimensional (3D) interconnection technology based on glass through vias (TGVs) has been used to integrate passive devices, and optoelectronic devices due to its superior electrical qualities, outstanding mechanical stability, and lower cost. Nevertheless, the performance and reliability of the device will be impacted by the thermal stress brought on by the mismatch of the coefficient of thermal expansion among multi-material structures and the complicated structure of TGV. This paper focuses on thermal stress evolution in different geometric and material parameters and the development of a controlled method for filling polymers in TGV interconnected structures. In addition, a numerical study based on the finite element (FE) model has been conducted to analyze the stress distribution of the different thicknesses of TGV-Cu. Additionally, a TGV interconnected structure model with a polymer buffer layer is given to solve the crack problem appearing at the edge of RDL. Meanwhile, after practical verification, in comparison to the experimental results, the FE model was shown to be highly effective and accurate for predicting the evolution of stress, and several recommendations were made to alleviate stress-related reliability concerns. An improved manufacturing process flow for the TGV interconnected structure was proposed and verified as feasible to address the RDL crack issue based on the aforementioned research. It provides helpful information for the creation of highly reliable TGV connection structures.
Keyword ：
finite-element method finite-element method 3D vertical interconnection 3D vertical interconnection thermo-mechanical reliability thermo-mechanical reliability through glass vias through glass vias crack crack
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| GB/T 7714 | Zhao, Jin , Chen, Zuohuan , Qin, Fei et al. Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection [J]. | MICROMACHINES , 2022 , 13 (10) . |
| MLA | Zhao, Jin et al. "Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection" . | MICROMACHINES 13 . 10 (2022) . |
| APA | Zhao, Jin , Chen, Zuohuan , Qin, Fei , Yu, Daquan . Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection . | MICROMACHINES , 2022 , 13 (10) . |
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Abstract ：
In this paper, the effect of different surface finish metallization layers (Cu, Ni, Au and Ag) on the shearing fracture toughness of sintered Ag bonded joints under various sintering temperatures is investigated based on end-notch flexure (ENF) test. The results show that the shearing fracture toughness for different kinds of specimens all increase with the sintering temperature augment. The sintered Ag/Ag joint shows the highest shearing fracture toughness while the sintered Ag/Ni joint shows the lowest. The average shearing fracture toughness of the Ag/Cu joint is very close to the Ag/Au joint when sintered from 240 ?& nbsp;to 280 ?, whereas the former became much higher when sintered under 300 ?. By statistically analysis of crack propagation paths, interface microstructure characteristics, and interface reaction, it is found that the main factors affecting the discrepancy of the shearing fracture toughness for different metallized layers are the interface connection ratio and contact angle. A higher interface connection ratio and lower contact angle can increase the actual crack resistance and lower down stress concentration at the bonding interface, which leads to the discrepancy of shearing fracture toughness correspondingly. The different inter-diffusion rates for Ag and various metallization layers are also clarified. This study could deepen the understanding of the metallization layer effect on the shearing fracture behaviors of sintered silver bonded joints.
Keyword ：
Metallization layers Metallization layers Microstructure Microstructure Sintered Ag Sintered Ag Interface property Interface property Shearing fracture toughness Shearing fracture toughness
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| GB/T 7714 | Zhao, Shuai , Dai, Yanwei , Qin, Fei et al. Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints [J]. | ENGINEERING FRACTURE MECHANICS , 2022 , 264 . |
| MLA | Zhao, Shuai et al. "Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints" . | ENGINEERING FRACTURE MECHANICS 264 (2022) . |
| APA | Zhao, Shuai , Dai, Yanwei , Qin, Fei , Li, Yanning , An, Tong , Gong, Yanpeng . Effect of surface finish metallization layer on shearing fracture toughness of sintered silver bonded joints . | ENGINEERING FRACTURE MECHANICS , 2022 , 264 . |
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Abstract ：
Copper filled through silicon via (TSV-Cu) is a crucial technology for chip stacking and three-dimensional (3D) vertical packaging. The multiple thermal loadings caused by the annealing process and deposition of interconnected dielectric layers lead to continuous TSV-Cu protrusions, which can affect its reliability severely. In this paper, the relationship between second protrusion height of TSV-Cu and its microstructur characteristics during double annealing is quantitatively investigated. It is found that grain size of TSV-Cu after annealing once is larger, and the second protrusion value under additional annealing can be greatly reduced. The reduction phenomenon of second protrusion is relative to the microstructure characteristics such as <111> texture and Sigma 3 grain boundary type. In addition, stress and strain are analyzed by finite element analysis (FEA) to reveal the reduction mechanisms of the second protrusion height of TSV-Cu during double annealing. The initial residual stress of fabricated TSV-Cu and its mechanical property parameters measured by nanoindentation test are incorporated in FEA. The main results show that additional thermal loading leads to a smaller increase of equivalent plastic strain (PEEQ) and von Mises stress if the TSV-Cu is annealed firstly at a high temperature of 400 degrees C. This verifies the second protrusion tendency of TSV-Cu, and explains the reduction mechanisms of the second protrusion height of TSV-Cu.
Keyword ：
mechanical properties mechanical properties microstructure microstructure protrusion protrusion Through-silicon-via copper (TSV-Cu) Through-silicon-via copper (TSV-Cu) double annealing double annealing
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| GB/T 7714 | Zhang, Min , Qin, Fei , Chen, Si et al. Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2022 , 51 (5) : 2433-2449 . |
| MLA | Zhang, Min et al. "Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes" . | JOURNAL OF ELECTRONIC MATERIALS 51 . 5 (2022) : 2433-2449 . |
| APA | Zhang, Min , Qin, Fei , Chen, Si , Dai, Yanwei , Chen, Pei , An, Tong . Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes . | JOURNAL OF ELECTRONIC MATERIALS , 2022 , 51 (5) , 2433-2449 . |
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Abstract ：
In this article, the correlation between the thermal contact resistance and the surface roughness characteristics of the contact interface in the press-pack insulated-gate bipolar transistor (PP-IGBT) modules during power cycling was studied by experimental measurements and finite-element (FE) simulation-based factorial design analysis. Thermal transient test technology was applied to examine the change in the thermal characteristic parameters of the PP-IGBT module. This shows that the increase in the thermal contact resistance of the Al metallization/emitter Mo contact interface occurs more dramatically during power cycling. A 3-D surface profilometer was used to evaluate the surface morphology parameters of the Al metallization/emitter Mo contact interface. The equivalent root-mean-square (RMS) roughness increases during power cycling, and the equivalent asperity slope and the equivalent spacing between asperities increase slightly. Additionally, the surface roughening in the corner area of the chip is more obvious than in other regions. A fractional factorial design analysis based on FE simulations was performed. The results indicate that the thermal contact resistance strongly depends on the main effects of the real contact area and the spacing between the asperities, and the RMS roughness and the asperity slope interaction.
Keyword ：
Surface resistance Surface resistance Surface roughness Surface roughness press-pack insulated-gate bipolar transistor (PP-IGBT) press-pack insulated-gate bipolar transistor (PP-IGBT) Rough surfaces Rough surfaces Power cycling Power cycling Contact resistance Contact resistance Surface morphology Surface morphology Temperature measurement Temperature measurement thermal contact resistance thermal contact resistance surface roughness surface roughness Thermal resistance Thermal resistance
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| GB/T 7714 | An, Tong , Li, Zezheng , Zhang, Yakun et al. The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module [J]. | IEEE TRANSACTIONS ON POWER ELECTRONICS , 2022 , 37 (6) : 7286-7298 . |
| MLA | An, Tong et al. "The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module" . | IEEE TRANSACTIONS ON POWER ELECTRONICS 37 . 6 (2022) : 7286-7298 . |
| APA | An, Tong , Li, Zezheng , Zhang, Yakun , Qin, Fei , Wang, Liang , Lin, Zhongkang et al. The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module . | IEEE TRANSACTIONS ON POWER ELECTRONICS , 2022 , 37 (6) , 7286-7298 . |
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Abstract ：
Shearing fracture behaviors of nickel coated multiwall carbon nanotubes (Ni-MWCNTs) reinforced sintered silver were investigated based on end-notched flexure (ENF) test in this paper. By mechanical mixture of Ni-MWCNTs with sintered silver, an enhanced shearing fracture toughness is obtained at content of 0.5 wt% Ni-MWCNTs . Shearing fracture toughness of sintered silver with different contents of Ni-MWCNTs has been investigated. Upon adding the proper Ni-MWCNTs, the cracking path in sintered silver turns to be cohesive cracking easily, which leads to increase of shearing fracture toughness. The average critical energy release rate obtained at content of 0.5 wt % Ni-MWCNTs sintered silver has been increased by 67.98% and the maximum critical energy release rate was increased to 2.1 times that of average condition in sintered silver without additive. The enhancement mechanism and agglomeration effect of Ni-MWCNTs are discussed. The different microstructure characteristics of Ni-MWCNTs sintered silver are also presented. The fracture properties of sintered silver with different Ni-MWCNTs additive contents are discussed and clarified. The sintered method presented in this paper satisfies the requirements of low temperature and low pressure joining technique in electronics implications. This study presents a novel insight on improving the shearing fracture resistance by adding carbon-based nanomaterial for those die-attaching materials in electronic packaging of power devices.
Keyword ：
Fracture toughness Fracture toughness Shearing Shearing Ni coated multiwall CNTs Ni coated multiwall CNTs Sintered silver Sintered silver ENF test ENF test
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| GB/T 7714 | Dai, Yanwei , Zan, Zhi , Zhao, Shuai et al. Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive [J]. | ENGINEERING FRACTURE MECHANICS , 2022 , 260 . |
| MLA | Dai, Yanwei et al. "Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive" . | ENGINEERING FRACTURE MECHANICS 260 (2022) . |
| APA | Dai, Yanwei , Zan, Zhi , Zhao, Shuai , Li, Yanning , Qin, Fei . Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive . | ENGINEERING FRACTURE MECHANICS , 2022 , 260 . |
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Abstract ：
随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型
Keyword ：
Steinberg模型 Steinberg模型 随机振动 随机振动 塑封球栅阵列(PBGA)封装 塑封球栅阵列(PBGA)封装 有限元分析(FEA) 有限元分析(FEA) 寿命预测 寿命预测
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| GB/T 7714 | 秦飞 , 别晓锐 , 陈思 et al. 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型 [J]. | 秦飞 , 2021 , 40 (2) : 164-170 . |
| MLA | 秦飞 et al. "随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型" . | 秦飞 40 . 2 (2021) : 164-170 . |
| APA | 秦飞 , 别晓锐 , 陈思 , 安彤 , 振动与冲击 . 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型 . | 秦飞 , 2021 , 40 (2) , 164-170 . |
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Abstract ：
对塑封球栅阵列(PBGA)封装器件Sn37Pb焊点进行了正弦振动、随机振动实验,得到各个载荷下焊点的疲劳寿命结果。建立了三维有限元模型,进行与实验条件一致的有限元分析,计算焊点的应力;将实验结果与有限元计算相结合,并基于Steinberg寿命预测模型,发展了随机振动载荷下焊点疲劳寿命预测方法。结果表明,疲劳寿命模型预测结果与实验结果吻合较好,该方法可应用于PBGA封装焊点在随机振动载荷下的疲劳寿命评估,为PBGA封装器件的设计与使用提供指导。
Keyword ：
寿命预测 寿命预测 Steinberg模型 Steinberg模型 随机振动 随机振动 有限元分析(FEA) 有限元分析(FEA) 塑封球栅阵列(PBGA)封装 塑封球栅阵列(PBGA)封装
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| GB/T 7714 | 秦飞 , 别晓锐 , 陈思 et al. 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型 [J]. | 振动与冲击 , 2021 , 40 (02) : 164-170 . |
| MLA | 秦飞 et al. "随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型" . | 振动与冲击 40 . 02 (2021) : 164-170 . |
| APA | 秦飞 , 别晓锐 , 陈思 , 安彤 . 随机振动载荷下塑封球栅阵列含铅焊点疲劳寿命模型 . | 振动与冲击 , 2021 , 40 (02) , 164-170 . |
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