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面向Chiplet集成的三维互连硅桥技术
期刊论文 | 2024 , 24 (6) , 1-13 | 电子与封装
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Abstract :

摩尔定律的发展速度放缓和集成电路产品应用的多元化趋势,共同推动了先进封装技术的快速发展.先进互连技术是先进封装的核心,在高速、高频传输、功耗、超细节距互连以及系统集成能力等方面均展现出显著优势.硅桥技术作为Chiplet以及异构集成封装的重要解决方案,可以以较低的成本实现多芯片间的局部高密度互连,在处理器、存储器、射频器件中被广泛应用.介绍了业界主流的硅桥技术,并对硅桥技术的结构特点和关键技术进行了分析和总结.深入讨论了硅桥技术的发展趋势及挑战,为相关领域的进一步发展提供参考.

Keyword :

先进互连技术 先进互连技术 硅桥技术 硅桥技术 高密度互连 高密度互连 Chiplet Chiplet

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GB/T 7714 赵瑾 , 于大全 , 秦飞 . 面向Chiplet集成的三维互连硅桥技术 [J]. | 电子与封装 , 2024 , 24 (6) : 1-13 .
MLA 赵瑾 等. "面向Chiplet集成的三维互连硅桥技术" . | 电子与封装 24 . 6 (2024) : 1-13 .
APA 赵瑾 , 于大全 , 秦飞 . 面向Chiplet集成的三维互连硅桥技术 . | 电子与封装 , 2024 , 24 (6) , 1-13 .
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ChatGPT在材料力学教学中的应用前景和风险因素探讨
期刊论文 | 2024 , (12) , 37-39 | 中国教育技术装备
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Abstract :

阐述ChatGPT在材料力学教学中的可能应用场景,从积极影响和消极风险两个方面论述在材料力学教学过程中使用ChatGPT的优势和制约因素,并对普通材料力学授课教师在未来教学过程中如何应对以ChatGPT为代表的人工智能技术提出观点和看法.

Keyword :

ChatGPT ChatGPT 人工智能 人工智能 材料力学 材料力学

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GB/T 7714 代岩伟 , 秦飞 . ChatGPT在材料力学教学中的应用前景和风险因素探讨 [J]. | 中国教育技术装备 , 2024 , (12) : 37-39 .
MLA 代岩伟 等. "ChatGPT在材料力学教学中的应用前景和风险因素探讨" . | 中国教育技术装备 12 (2024) : 37-39 .
APA 代岩伟 , 秦飞 . ChatGPT在材料力学教学中的应用前景和风险因素探讨 . | 中国教育技术装备 , 2024 , (12) , 37-39 .
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基于LTCC射频SiP组件微流道结构拓扑优化研究
会议论文 | 2024 | 北京力学会第30届学术年会
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Abstract :

随着现代通信的不断进步和微电子产业的迅速发展,电子产品小型化和高密度化逐渐成为主流趋势,有源相控阵天线的收发组件,作为雷达重要组成部分和高温组件,其散热性能为目前雷达散热中研究的重点。本文以有源相控阵天线中以低温共烧陶瓷材料(LTCC)作为基板的收发组件散热为研究对象,通过在收发组件上方添加液冷散热的方式进行辅助散热,改善收发组件散热问题。通过COMSOL Multiphysics软件使用二维密度拓扑优化的方式,以压降与平均温度为优化目标获取流道几何模型、温度与流体特性结果,并于传统直通型流进行对比。结果表明拓扑优化后热源位置温度有较好的改善。

Keyword :

LTCC LTCC T/R组件 T/R组件 拓扑优化 拓扑优化 微流道 微流道

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GB/T 7714 杨光 , 秦飞 , 史戈 . 基于LTCC射频SiP组件微流道结构拓扑优化研究 [C] //北京力学会第30届学术年会 . 2024 .
MLA 杨光 等. "基于LTCC射频SiP组件微流道结构拓扑优化研究" 北京力学会第30届学术年会 . (2024) .
APA 杨光 , 秦飞 , 史戈 . 基于LTCC射频SiP组件微流道结构拓扑优化研究 北京力学会第30届学术年会 . (2024) .
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二氧化硅/硅晶圆翘曲初始残余应力数值反演研究
会议论文 | 2024 | 北京力学会第30届学术年会
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Abstract :

本文采用有限元方法对表面沉积不同厚度二氧化硅晶圆进行了数值仿真。晶圆表面沉积材料的初始残余应力影响晶圆的翘曲,然而由于测试精度和手段通常难以表征,本文基于数值反演方法获取测样品在沉积过程中的初始残余应力。仿真数据表明,随着二氧化硅厚度的增加,初始残余应力呈现下降的趋势。

Keyword :

晶圆翘曲 晶圆翘曲 薄膜沉积 薄膜沉积 初始残余应力 初始残余应力

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GB/T 7714 刘泓利 , 秦飞 , 代岩伟 et al. 二氧化硅/硅晶圆翘曲初始残余应力数值反演研究 [C] //北京力学会第30届学术年会 . 2024 .
MLA 刘泓利 et al. "二氧化硅/硅晶圆翘曲初始残余应力数值反演研究" 北京力学会第30届学术年会 . (2024) .
APA 刘泓利 , 秦飞 , 代岩伟 , 李晨光 . 二氧化硅/硅晶圆翘曲初始残余应力数值反演研究 北京力学会第30届学术年会 . (2024) .
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Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests SCIE
期刊论文 | 2023 , 46 (6) , 2062-2079 | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES
WoS CC Cited Count: 7
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Abstract :

Bondline thickness effect on fracture behaviors and cohesive zone model (CZM) is an important topic for adhesive joints. In this paper, the fracture and CZM of sintered nano silver adhesive joints are investigated based on end notched flexure (ENF) test. Results show that load versus displacement curves of sintered silver adhesive joints is sensitive to the bondline thickness. With compliance-based beam method (CBBM), the shearing fracture toughness of sintered silver bonded joints heightens with the increase of bondline thickness, which indicates that shearing fracture toughness is highly dependent on bondline thickness. R curves increase steeply for short equivalent crack length and become plateau for long equivalent crack length. The cracking morphology shows that the cracking paths are mainly interfacial and interlayer types. The bilinear CZM is also presented. The bondline thickness effect on CZM parameter is presented and discussed. The CZM given in this paper can be adopted for reliability analysis in power devices.

Keyword :

sintered silver sintered silver cohesive zone model cohesive zone model shearing fracture toughness shearing fracture toughness end notched flexure test end notched flexure test bondline thickness effect bondline thickness effect

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GB/T 7714 Dai, Yanwei , Li, Yanning , Zan, Zhi et al. Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests [J]. | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES , 2023 , 46 (6) : 2062-2079 .
MLA Dai, Yanwei et al. "Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests" . | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES 46 . 6 (2023) : 2062-2079 .
APA Dai, Yanwei , Li, Yanning , Zan, Zhi , Qin, Fei . Bondline thickness effect on fracture and cohesive zone model of sintered nano silver adhesive joints under end notched flexure tests . | FATIGUE & FRACTURE OF ENGINEERING MATERIALS & STRUCTURES , 2023 , 46 (6) , 2062-2079 .
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包镍多壁碳纳米管增强SAC305焊料的Ⅰ型断裂机理研究
期刊论文 | 2023 , 40 (1) , 124-129 | 微电子学与计算机
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Abstract :

发展高可靠的互连封装新型焊料已经成为电子封装领域的前沿研究内容之一.本文制备了包镍碳纳米管增强SAC305焊料,并开展了不同含量增强SAC305焊料的双悬臂梁试样Ⅰ型断裂测试,得到了不同添加含量SAC305的载荷-位移曲线.基于柔度的梁方法理论(CBBM)计算了增强焊料的Ⅰ型断裂韧度.研究结果表明,其Ⅰ型断裂韧度随着包镍碳纳米管质量分数的增加,表现出先升高后降低的趋势.没有添加包镍碳纳米管的SAC305焊料的Ⅰ型断裂韧度约为0.53N/mm,添加0.05wt%包镍碳纳米管的增强焊料的Ⅰ型断裂韧度最高,约为1.14 N/mm,相较于没有添加包镍碳纳米管的SAC305焊料断裂韧度提高了 1.15倍,表现出更好的抵抗裂纹扩展的特性.

Keyword :

断裂 断裂 包镍碳纳米管 包镍碳纳米管 双悬臂梁试样 双悬臂梁试样 能量释放率 能量释放率 SAC305焊料 SAC305焊料

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GB/T 7714 张谋 , 秦飞 , 代岩伟 . 包镍多壁碳纳米管增强SAC305焊料的Ⅰ型断裂机理研究 [J]. | 微电子学与计算机 , 2023 , 40 (1) : 124-129 .
MLA 张谋 et al. "包镍多壁碳纳米管增强SAC305焊料的Ⅰ型断裂机理研究" . | 微电子学与计算机 40 . 1 (2023) : 124-129 .
APA 张谋 , 秦飞 , 代岩伟 . 包镍多壁碳纳米管增强SAC305焊料的Ⅰ型断裂机理研究 . | 微电子学与计算机 , 2023 , 40 (1) , 124-129 .
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Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading SCIE
期刊论文 | 2023 , 16 (1) | MATERIALS
WoS CC Cited Count: 2
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Abstract :

In this paper, the residual stresses with a nanoscale depth resolution at TSV-Cu/TiW/SiO2/Si interfaces under different thermal loadings are characterized using the ion-beam layer removal (ILR) method. Moreover, the correlations of residual stress, microstructure, and the failure modes of the interfaces are discussed. The residual stresses at the interfaces of TSV-Cu/TiW, TiW/SiO2, and SiO2/Si are in the form of small compressive stress at room temperature, then turn into high-tensile stress after thermal cycling or annealing. In addition, the maximum residual stress inside the TSV-Cu is 478.54 MPa at room temperature, then decreases to 216.75 MPa and 90.45 MPa, respectively, after thermal cycling and annealing. The microstructural analysis indicates that thermal cycling causes an increase in the dislocation density and a decrease in the grain diameter of TSV-Cu. Thus, residual stress accumulates constantly in the TSV-Cu/TiW interface, resulting in the cracking of the interface. Furthermore, annealing leads to the cracking of more interfaces, relieving the residual stress as well as increasing the grain diameter of TSV-Cu. Besides this, the applicability of the ILR method is verified by finite element modeling (FEM). The influence of the geometric errors of the micro-cantilever beam and the damage to the materials introduced by the focused ion beam (FIB) in the experimental results are discussed.

Keyword :

TSV interconnected interfaces TSV interconnected interfaces ion-beam layer removal (ILR) method ion-beam layer removal (ILR) method residual stress residual stress thermal loading thermal loading microstructure microstructure

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GB/T 7714 Zhang, Min , Chen, Fangzhou , Qin, Fei et al. Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading [J]. | MATERIALS , 2023 , 16 (1) .
MLA Zhang, Min et al. "Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading" . | MATERIALS 16 . 1 (2023) .
APA Zhang, Min , Chen, Fangzhou , Qin, Fei , Chen, Si , Dai, Yanwei . Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO2/Si Interfaces after Different Thermal Loading . | MATERIALS , 2023 , 16 (1) .
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Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices SCIE
期刊论文 | 2023 , 13 (4) | CRYSTALS
WoS CC Cited Count: 1
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Abstract :

Due to its higher energy and smaller heating area, laser joining technology is widely used in aluminum alloy welding and other industrial fields, which meets the solder sealing requirements for electronic packaging. According to experiments, cracks were prone to occur at the corners and spot-welding positions near the weld. In this paper, the depth and width of the melt pool were measured experimentally, and the results were used to calibrate and validate the heat source model. An empirical relationship between heat source parameters and melt pool morphology is presented. The heat source model of laser deep penetration welding was established under the same experimental conditions. And the results were in agreement with the experimental results. The finite element method was used to numerically simulate the welding process of a 50%SiAl shell and a 27%SiAl cover plate. The effects of different spot-welding sequences and numbers on the residual stress and cracking possibility of laser welded samples were analyzed. The results show that under sequential spot-welding, when the amount of spot-welding is increased, the stress peak value decreases. Compared with sequential spot welding and side-by-side spot welding, the spot-welding sequence of diagonal points first, and then side-by-side spot welding, can effectively reduce the residual stress. This research enables us to provide some guidelines in terms of studying the reliability issues of microwave devices.

Keyword :

laser spot-welding laser spot-welding deep penetration welding deep penetration welding heat source model calibration heat source model calibration solidification crack solidification crack silicon aluminum alloy silicon aluminum alloy

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GB/T 7714 Wang, Song , Shi, Ge , Zhao, Libo et al. Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices [J]. | CRYSTALS , 2023 , 13 (4) .
MLA Wang, Song et al. "Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices" . | CRYSTALS 13 . 4 (2023) .
APA Wang, Song , Shi, Ge , Zhao, Libo , Dai, Yanwei , Hou, Tianyu , He, Ying et al. Modelling and Optimization of Continual Laser Joining Processes for Silicon Aluminum Alloy in Microwave Devices . | CRYSTALS , 2023 , 13 (4) .
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Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive SCIE
期刊论文 | 2022 , 260 | ENGINEERING FRACTURE MECHANICS
WoS CC Cited Count: 12
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Abstract :

Shearing fracture behaviors of nickel coated multiwall carbon nanotubes (Ni-MWCNTs) reinforced sintered silver were investigated based on end-notched flexure (ENF) test in this paper. By mechanical mixture of Ni-MWCNTs with sintered silver, an enhanced shearing fracture toughness is obtained at content of 0.5 wt% Ni-MWCNTs . Shearing fracture toughness of sintered silver with different contents of Ni-MWCNTs has been investigated. Upon adding the proper Ni-MWCNTs, the cracking path in sintered silver turns to be cohesive cracking easily, which leads to increase of shearing fracture toughness. The average critical energy release rate obtained at content of 0.5 wt % Ni-MWCNTs sintered silver has been increased by 67.98% and the maximum critical energy release rate was increased to 2.1 times that of average condition in sintered silver without additive. The enhancement mechanism and agglomeration effect of Ni-MWCNTs are discussed. The different microstructure characteristics of Ni-MWCNTs sintered silver are also presented. The fracture properties of sintered silver with different Ni-MWCNTs additive contents are discussed and clarified. The sintered method presented in this paper satisfies the requirements of low temperature and low pressure joining technique in electronics implications. This study presents a novel insight on improving the shearing fracture resistance by adding carbon-based nanomaterial for those die-attaching materials in electronic packaging of power devices.

Keyword :

Fracture toughness Fracture toughness Shearing Shearing Ni coated multiwall CNTs Ni coated multiwall CNTs Sintered silver Sintered silver ENF test ENF test

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GB/T 7714 Dai, Yanwei , Zan, Zhi , Zhao, Shuai et al. Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive [J]. | ENGINEERING FRACTURE MECHANICS , 2022 , 260 .
MLA Dai, Yanwei et al. "Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive" . | ENGINEERING FRACTURE MECHANICS 260 (2022) .
APA Dai, Yanwei , Zan, Zhi , Zhao, Shuai , Li, Yanning , Qin, Fei . Shearing fracture toughness enhancement for sintered silver with nickel coated multiwall carbon nanotubes additive . | ENGINEERING FRACTURE MECHANICS , 2022 , 260 .
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Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes SCIE
期刊论文 | 2022 , 51 (5) , 2433-2449 | JOURNAL OF ELECTRONIC MATERIALS
WoS CC Cited Count: 9
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Abstract :

Copper filled through silicon via (TSV-Cu) is a crucial technology for chip stacking and three-dimensional (3D) vertical packaging. The multiple thermal loadings caused by the annealing process and deposition of interconnected dielectric layers lead to continuous TSV-Cu protrusions, which can affect its reliability severely. In this paper, the relationship between second protrusion height of TSV-Cu and its microstructur characteristics during double annealing is quantitatively investigated. It is found that grain size of TSV-Cu after annealing once is larger, and the second protrusion value under additional annealing can be greatly reduced. The reduction phenomenon of second protrusion is relative to the microstructure characteristics such as <111> texture and Sigma 3 grain boundary type. In addition, stress and strain are analyzed by finite element analysis (FEA) to reveal the reduction mechanisms of the second protrusion height of TSV-Cu during double annealing. The initial residual stress of fabricated TSV-Cu and its mechanical property parameters measured by nanoindentation test are incorporated in FEA. The main results show that additional thermal loading leads to a smaller increase of equivalent plastic strain (PEEQ) and von Mises stress if the TSV-Cu is annealed firstly at a high temperature of 400 degrees C. This verifies the second protrusion tendency of TSV-Cu, and explains the reduction mechanisms of the second protrusion height of TSV-Cu.

Keyword :

mechanical properties mechanical properties microstructure microstructure protrusion protrusion Through-silicon-via copper (TSV-Cu) Through-silicon-via copper (TSV-Cu) double annealing double annealing

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GB/T 7714 Zhang, Min , Qin, Fei , Chen, Si et al. Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2022 , 51 (5) : 2433-2449 .
MLA Zhang, Min et al. "Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes" . | JOURNAL OF ELECTRONIC MATERIALS 51 . 5 (2022) : 2433-2449 .
APA Zhang, Min , Qin, Fei , Chen, Si , Dai, Yanwei , Chen, Pei , An, Tong . Protrusion of Through-Silicon-Via (TSV) Copper with Double Annealing Processes . | JOURNAL OF ELECTRONIC MATERIALS , 2022 , 51 (5) , 2433-2449 .
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