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学者姓名:季凌飞
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Significance Hard and brittle materials possess excellent mechanical, optical, and chemical properties. However, the demand for efficient and high-precision processing drives continuous innovation in modern processing technologies. Laser processing plays an increasingly important role in high-precision cutting and shaping of these materials due to its high flexibility, precision, and non-contact nature. In this study, we overview the current research and progress on the key technologies of laser high-precision cutting and shaping of hard and brittle materials, particularly focusing on applications involving large thickness/large length ratio, multi-dimensional components, and composite cutting and forming. In addition, we discuss the challenges and prospects of this technology, aiming to provide theoretical guidance and a technical foundation for the advancement of related industries. Progress We first discuss the fundamental interaction between lasers and brittle materials. We elaborate on the laser processing of large thickness brittle materials, high-precision cutting of multi-dimensional components, and composite cutting and forming technologies. Besides, we analyze the technical principles, advantages, and application examples of these technologies, which lays a solid foundation for innovations in laser cutting of hard and brittle materials. For the laser cutting of materials with large thickness or a high length-to-diameter ratio, methods such as non-destructive close piercing, multi-focal distribution spherical aberration correction, Bessel beam modulation, and laser filamentation have been successfully applied to address issues like heat accumulation, beam aberration, and energy loss. These methods enable high-precision cutting of thick, hard, and brittle materials, including the machining of complex structures that are challenging for traditional methods. In multi-dimensional structure cutting, the application of computer numerical control (CNC) technology enables precise multi-dimensional laser cutting and structuring. The closed-loop feedback system, with high-precision positioning and trajectory control, plays a crucial role in achieving accurate multi-dimensional cutting and forming. Laser composite cutting and forming technologies significantly improve cutting accuracy and quality by integrating laser techniques with other processing methods. Coupling laser processing with mechanical methods, liquid assistance, chemical etching, and optical far-field-induced near-field breakdown (O-FIB) effectively reduces thermal damage, microcracks, and recast layers. These composite methods not only increase processing efficiency but also expand the range of applications for hard and brittle materials, enabling more intricate multi-dimensional structures. The progress of laser high-precision cutting methods enhances the machining accuracy and efficiency of hard and brittle materials, broadening their application prospects in fields such as precision instruments, artificial intelligence, and bioengineering. With continuous advancements, laser cutting and shaping technologies will play a more significant role in future micro/nano- manufacturing. Conclusions and Prospects Laser cutting technology is widely used in industrial manufacturing due to its ability to enhance machining accuracy and efficiency while minimizing thermal effects. We systematically review recent advances in laser high-precision cutting and shaping of hard and brittle materials. By integrating cutting-edge techniques such as chemical etching, multiphoton absorption, and liquid-assisted methods, laser cutting effectively mitigates issues like thermal stress and microcracking. Particularly for complex structures and large-thickness materials, innovative approaches such as Bessel beams, multi-focus technology, and far-field-induced near-field enhancement further improve cutting performance and precision. As new materials, including composites and functional materials, emerge, laser cutting technology continues to expand in its applications. Further exploration of the interaction between lasers and various materials, as well as optimization of processes tailored to new material requirements, is necessary. The deep integration of laser technology with intelligent manufacturing and automation will provide a powerful momentum for the future development of high-end equipment.
Keyword :
laser cutting laser cutting hard and brittle materials hard and brittle materials high precision machining high precision machining
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GB/T 7714 | Ji, Lingfei , Zhang, Sen , Lin, Zhenyuan et al. Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited) [J]. | ACTA OPTICA SINICA , 2025 , 45 (2) . |
MLA | Ji, Lingfei et al. "Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited)" . | ACTA OPTICA SINICA 45 . 2 (2025) . |
APA | Ji, Lingfei , Zhang, Sen , Lin, Zhenyuan , Fan, Jinshuai , Zhang, Wenlong , Yao, Tianran et al. Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited) . | ACTA OPTICA SINICA , 2025 , 45 (2) . |
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Abstract :
通过飞秒激光单脉冲实验,探究了偏振方向(0°、45°、90°、135°)对x-切铌酸锂(LN)晶体损伤阈值的影响,发现材料损伤阈值呈现明显的偏振依赖性,90°偏振方向的损伤阈值低于其他偏振方向。通过第一性原理计算,确认了飞秒激光引起的隧穿电离主要导致Nb—O键断裂。而当入射偏振角度为90°时,易导致更多的Nb—O键断裂,在该偏振方向上的损伤阈值降低。该研究有助于更深入地理解超快激光在LN晶体表面的烧蚀过程,对LN晶体表面功能性器件激光制备有重要的参考价值。
Keyword :
第一性原理 第一性原理 损伤阈值 损伤阈值 偏振 偏振 铌酸锂 铌酸锂 飞秒激光 飞秒激光
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GB/T 7714 | 温亚楠 , 林真源 , 季凌飞 . 偏振方向对x-切铌酸锂损伤阈值影响规律(特邀) [J]. | 激光与光电子学进展 , 2024 , 61 (11) : 154-159 . |
MLA | 温亚楠 et al. "偏振方向对x-切铌酸锂损伤阈值影响规律(特邀)" . | 激光与光电子学进展 61 . 11 (2024) : 154-159 . |
APA | 温亚楠 , 林真源 , 季凌飞 . 偏振方向对x-切铌酸锂损伤阈值影响规律(特邀) . | 激光与光电子学进展 , 2024 , 61 (11) , 154-159 . |
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Objective Epoxy removal is an important step when testing the performance of electronic components, and laser ablation is expected to be an ideal method for the efficient and non-destructive removal of epoxy resin because of its precision and control. This study reports the results of the systematic investigation of the influence of a 532 nm laser on the ablation of epoxy resin under different laser parameters using a response surface methodology. A multi-response surface model that considers the effects of the laser fluence, scanning speed, and scanning spacing on the removal rate and roughness during the laser ablation of epoxy resin is established using the central composite design method. The effects of single and multiple factors on the laser ablation of epoxy resin are analyzed. The results indicate that the optimal ranges for the laser fluence, scanning speed, and scanning spacing are 11.20?11.28 J/cm(2), 224?240 mm/s, and 1.50?1.55 mu m, respectively, which result in a removal rate of 1620?1628 mu m(3)/s and roughness range of 5.7?5.8 mu m. The optimal parameters are the laser fluence of 11.20 J/cm(2), scanning speed of 234 mm/s, and scanning spacing of 1.50 mu m. The study results confirm that optimized ceramic components inside electronic devices have lower surface damage, based on a comparative analysis of the micro-morphology, elastic modulus, and element content results of epoxy resin samples before and after parameter optimization. These results have significant value and meaning for the non-destructive testing of electronic components through accurate and efficient epoxy resin ablation. Methods A nanosecond laser with a wavelength of 532 nm, pulse width of 6 ns, and repetition frequency of 100 Hz is used to perform ablation tests on epoxy resin-coated electronic devices. Taking the laser fluence, scanning speed, and scanning spacing as input factors, and the roughness and removal rate as output responses, a mathematical?physical regression model of the removal rate and roughness with the above laser parameters is established using three-factor five-level full-response central composite design experiments. In addition, the process parameters needed to obtain the optimal removal effect are obtained, with the reliability of the model proven through validation experiments. The microscopic morphology of the samples after the removal of the epoxy resin is observed and analyzed using scanning electron microscope (SEM). The roughness and removal rate of the samples are measured and calculated using laser confocal microscope, and the elasticity modulus of the electronic device surface after removing the epoxy resin is measured using atomic force microscope (AFM). The parameter combination of smaller laser fluence (11.20?11.40 J/cm(2)), faster scanning speed (200?240 mm/s), and appropriate scanning spacing (approximately 1.50 mu m) allows the laser to ablate the epoxy resin in a more moderate way, which results in a smaller roughness (Fig. 4). The average elastivity modulus of the electronic device surface after the removal of the epoxy resin is (318.0 +/- 10.5)GPa, and after optimizing the parameters, the laser ablation does no damage to the mechanical properties (Fig. 6). Results and Discussions The calculation results show that the optimum removal rate during the laser ablation is obtained with a laser fluence of 11.60?11.80 J/cm(2), scanning speed of 160?180 mm/s, and scanning spacing of 1.50?2.00 mu m (Fig. 3). In this case, increasing the laser fluence increases the energy absorption rate of the epoxy resin, and decreasing the scanning speed increases the interaction time between the laser and material. In addition, decreasing the scanning spacing increases the overlap rate of the spot between rows and the energy of the laser irradiation per unit area. As shown by the SEM images, the surface of the laser-removed epoxy resin sample is relatively clean and tidy after the optimization of the parameters (Fig. 5). The elasticity modulus measured via AFM is (318.0 +/- 10.5)GPa, which demonstrates the low laser-induced damage to an electronic component during the removal of epoxy resin. Conclusions A mathematical-physical model of the laser ablation of epoxy resin is established by adopting the response surface method, and the effects of the process parameters and their interaction on the removal rate and roughness during the laser ablation of epoxy resin are systematically investigated. This leads to the optimum theoretical laser parameters for obtaining the maximum removal rate and minimum roughness. The calculation results show that the optimized removal rate and roughness during laser ablation are obtained at a laser fluence range of 11.20?11.28 J/cm(2), scanning speed range of 224?240 mm/s, and scanning spacing range of 1.50?1.55 mu m. The obtained removal rate has a range of 1620?1628 mu m(3)/s, and the roughness has a range of 5.7?5.8 mu m. The optimal combination of parameters includes a laser fluence of 11.20 J/cm(2), scanning speed of 234 mm/s, and scanning spacing of 1.50 mu m. The morphologies and mechanical properties of the removed epoxy resin samples before and after process optimization also confirm the feasibility of the method. These study results have important research value and significance for the efficient removal of epoxy resin via laser ablation and the development of nondestructive testing methods for electronic components.
Keyword :
central composite design central composite design response surface methodology response surface methodology epoxy resin epoxy resin laser technique laser technique non-destructive ablation non-destructive ablation
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GB/T 7714 | Wang, Guanqiang , Lin, Zhenyuan , Sun, Weigao et al. Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology [J]. | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2024 , 51 (24) . |
MLA | Wang, Guanqiang et al. "Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology" . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG 51 . 24 (2024) . |
APA | Wang, Guanqiang , Lin, Zhenyuan , Sun, Weigao , Ji, Lingfei . Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2024 , 51 (24) . |
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Ultrafast laser lift-off is an important step in manufacturing flexible electronic display devices. To improve the picosecond laser lift-off transfer quality of micro light emitting diodes (micro-LEDs), the response surface methodology (RSM) is employed for the optimization of multiple laser processing parameters, including laser power, scanning speed, spot diameter, and scanning distance. Transfer yield and residual stress are chosen as the performance evaluation metrics, as well as the lifted-off device element composition and transfer quality under different process parameters are characterized. The optimized maximum transfer yield is 95.84% and the minimum residual tensile stress is 0.589 GPa, which is less than 0.5% prediction error of the optimum transfer yield (95.67-95.74%) and residual stress (0.588-0.592 GPa) for ultrafast laser lift-off of micro-LEDs based on the central composite design of RSM, indicating the reliable guidance ability of this model. It develops a new way for quality improvement of the ultrafast laser lift-off process for micro-LEDs.
Keyword :
micro-LED micro-LED Ultrafast laser Ultrafast laser laser transfer laser transfer response surface methodology response surface methodology
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GB/T 7714 | Sun, Weigao , Wang, Guanqiang , Ji, Lingfei et al. Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs [J]. | MATERIALS AND MANUFACTURING PROCESSES , 2024 , 40 (4) : 567-578 . |
MLA | Sun, Weigao et al. "Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs" . | MATERIALS AND MANUFACTURING PROCESSES 40 . 4 (2024) : 567-578 . |
APA | Sun, Weigao , Wang, Guanqiang , Ji, Lingfei , Lin, Zhenyuan . Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs . | MATERIALS AND MANUFACTURING PROCESSES , 2024 , 40 (4) , 567-578 . |
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Objective Lithium niobate crystals with deep microhole structures are excellent photonic-crystal devices with modulation properties of wavelength selection. However, current fabrication methods, such as focused ion beam etching, chemical etching, or conventional laser drilling, remain a considerable challenge for obtaining microholes with high-aspect-ratios in lithium niobate crystals. This paper presents a strategy for the one-step fabrication of uniform deep microhole arrays with a 700???1 aspect ratio within lithium niobate crystals using the ultrafast laser temporal Bessel shaping technique. This efficient and high-quality strategy for fabricating deep microhole arrays has excellent process stability. The prepared lithium niobate microhole array has remarkable selective beam transmittance, and we hope that this strategy can be used as a promising method for fabricating lithium niobate photonic-crystals. Methods In this study, the original femtosecond Gaussian beam was transformed into a zero-order Bessel beam using a series of beam shaping units and the energy distribution of the femtosecond Bessel beam was calculated via COMSOL simulations. The one-step fabrication of deep microholes was realized using the high peak power of the femtosecond laser and by adjusting the spatial energy distribution of the Bessel beam. By matching the pulse frequency and the speed of the moving stage, stable and uniform fabrication of large-area deep microhole arrays could be achieved by varying beam energy and the relative focal position. The resulting microhole morphology and aspect ratio were evaluated using scanning electron microscope, confocal laser scanning microscope, and optical microscope. Additionally, the beam transmission test was performed on the microhole arrays, verifying the structure's excellent selective beam transmission ability. Results and Discussions The femtosecond Bessel beam obtained after beam shaping successfully realized the fabrication of microhole arrays with a 700???1 aspect ratio. Varying the laser power can effectively adjust the morphology and aspect ratio of the fabricated microhole. With an increase in laser power, the diameter and depth of the microhole become larger but the aspect ratio gradually decreases. At the same time, an increase in laser power can lead to a side lobe etching effect on the sample surface, resulting in degradation of the device performance or even its damage. Variation in the relative focal position slightly changes the microhole diameter but considerably affects the depth of the microhole. Furthermore, maximum utilization of the Bessel beam energy can be achieved when the Bessel beam is focused at the center of the sample, and a complete through-hole of a 500 mu m thick lithium niobate crystal is realized. This high-aspect-ratio microhole array demonstrates excellent selective transmission of light beams in the 450510 nm range. Conclusions In this study, a femtosecond Bessel beam is successfully used to rapidly produce a uniform array of microholes with an aspect ratio of 700???1 inside a lithium niobate crystal. The effects of laser output power and relative focal position on the microhole's morphology, depth, and aspect ratio are systematically studied and summarized. The laser power range for inhibiting the side lobe etching effect and the design principles of the microhole array are presented. The high-aspect-ratio lithium niobate photonic-crystal filter is fabricated based on the optimization of the processing parameters, and the wavelength-selective transmission of the structure for beams in the range of 450510 nm is demonstrated through the transmission spectrum measurements. The efficient and reliable processing of high-aspect-ratio microhole structures provides a new pathway that is worth exploring for the fabrication of lithium-niobate-based photonic-crystal devices.
Keyword :
laser technique laser technique aspect ratio aspect ratio ultrafast lasers ultrafast lasers lithium niobate lithium niobate Bessel beam Bessel beam photonic-crystal photonic-crystal
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GB/T 7714 | Sun Weigao , Ji Lingfei , Zheng Jincan et al. High-Aspect-Ratio Photonic-Crystal Structure of Lithium Niobate Fabricated via Femtosecond Bessel Beam Direct Writing [J]. | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2022 , 49 (10) . |
MLA | Sun Weigao et al. "High-Aspect-Ratio Photonic-Crystal Structure of Lithium Niobate Fabricated via Femtosecond Bessel Beam Direct Writing" . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG 49 . 10 (2022) . |
APA | Sun Weigao , Ji Lingfei , Zheng Jincan , Wen Yanan , Wang Guanqiang . High-Aspect-Ratio Photonic-Crystal Structure of Lithium Niobate Fabricated via Femtosecond Bessel Beam Direct Writing . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2022 , 49 (10) . |
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The influence of the picosecond (ps) pulsed burst with a nanosecond scale of temporal separation (50 ns) on filamentary traces in sapphire substrate is investigated. The spatiotemporal evolution of the filamentary plasma string induced by sub-pulses of the burst-mode is revealed according to the analysis of the instantaneous photoluminescence images. Due to the presence of residual plasma, the energy loss of sub-pulse during the balancing of self-focusing effect is reduced, and thus refreshes the plasma via refocusing. The refreshed plasma peak generated by the subsequent subpulse appears at relatively low density positions in the formed filamentary plasma string, which results in more uniform densities and less spatial overlap among the plasma peaks. The continuity and uniformity of the filamentary trace in sapphire are enhanced by the burst-mode. Besides, the burst filamentary propagation can also remain effective when the sub-pulse energy is below the self-focusing threshold. Based on this uniform and precise energy propagation mode, the feasibility of its use for the laser lift-off (LLO) process is verified.
Keyword :
laser lift-off laser lift-off picosecond laser picosecond laser spatiotemporal evolution spatiotemporal evolution burst-mode burst-mode filamentary plasma string filamentary plasma string
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GB/T 7714 | Sun Wei-gao , Yan Tian-yang , Wang Yu-heng et al. Spatiotemporal evolution of high-aspect-ratio filamentary trace in sapphire of picosecond pulse burst-mode for laser lift-off [J]. | JOURNAL OF CENTRAL SOUTH UNIVERSITY , 2022 , 29 (10) : 3304-3311 . |
MLA | Sun Wei-gao et al. "Spatiotemporal evolution of high-aspect-ratio filamentary trace in sapphire of picosecond pulse burst-mode for laser lift-off" . | JOURNAL OF CENTRAL SOUTH UNIVERSITY 29 . 10 (2022) : 3304-3311 . |
APA | Sun Wei-gao , Yan Tian-yang , Wang Yu-heng , Ji Ling-fei . Spatiotemporal evolution of high-aspect-ratio filamentary trace in sapphire of picosecond pulse burst-mode for laser lift-off . | JOURNAL OF CENTRAL SOUTH UNIVERSITY , 2022 , 29 (10) , 3304-3311 . |
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A one-step laser lift-off (LLO) for patterned gallium nitride (GaN) film and GaN-based light-emitting diode (LED) device is achieved using 355 nm picosecond laser irradiation in this research. The laser fluence required for separation is 0.09-0.13 J cm(-2), which is much lower than that for the currently reported LLO methods. The separated GaN film is intact with only 0.04 GPa of residual stress. The ultra-smooth separated surface with root mean square roughness of only 5.2 nm is attributed to the interconnection of microcrack-free flat cavities formed by the combination of high photon energy-induced intrinsic absorption and subsequent plasma generation. The flat cavity with a depth-to-width ratio of 1:4000 limits the delamination region to a few nanometers at the GaN/sapphire interface. GaN-based LED is transferred with perfect electroluminescence (EL) by the strategy. The stable EL spectral peak positions and intensity independent of the bending state prove that the presented low-energy ultrafast LLO technique ensured the flexibility of the separated LED device without affecting the performance. This research provides a promising strategy to achieve the LLO of GaN devices with low energy consumption, high controllability, and high efficiency, which is significant for the industrial fabrication of flexible GaN-based electronics.
Keyword :
ultrafast laser lift-off ultrafast laser lift-off flexible electronics flexible electronics plasma plasma GaN devices GaN devices photochemical decomposition photochemical decomposition
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GB/T 7714 | Sun, Weigao , Ji, Lingfei , Lin, Zhenyuan et al. Low-Energy UV Ultrafast Laser Controlled Lift-Off for High-Quality Flexible GaN-Based Device [J]. | ADVANCED FUNCTIONAL MATERIALS , 2022 , 32 (8) . |
MLA | Sun, Weigao et al. "Low-Energy UV Ultrafast Laser Controlled Lift-Off for High-Quality Flexible GaN-Based Device" . | ADVANCED FUNCTIONAL MATERIALS 32 . 8 (2022) . |
APA | Sun, Weigao , Ji, Lingfei , Lin, Zhenyuan , Zheng, Jincan , Wang, Zhiyong , Zhang, Litian et al. Low-Energy UV Ultrafast Laser Controlled Lift-Off for High-Quality Flexible GaN-Based Device . | ADVANCED FUNCTIONAL MATERIALS , 2022 , 32 (8) . |
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Nanogrooves with a minimum feature size down to 30 nm (lambda/26) can be formed directly on silicon surface by irradiation from two orthogonal polarized 1064 nm/10 ns fiber laser beams. The creation of such small nanogrooves is attributed to surface thermal stress during resolidification and supercooling with the double laser beams' irradiation. By varying the pulse number and laser fluence, the feature size of narrow grooves on silicon surface can be tuned. The experimental results and numerical calculation of surface thermal behaviors indicated that the high repetition rate of the nanosecond laser leads to the incubation effect and different silicon optical and thermal properties during laser irradiation. Resolution on this scale should be attractive in nanolithography, particularly considering that this method is available in far field and in ambient air.
Keyword :
thermal stress thermal stress nanocreation nanocreation nanosecond laser nanosecond laser silicon silicon
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GB/T 7714 | Lin, Zhenyuan , Ji, Lingfei , Hong, Minghui . Approximately 30 nm Nanogroove Formation on Single Crystalline Silicon Surface under Pulsed Nanosecond Laser Irradiation [J]. | NANO LETTERS , 2022 , 22 (17) : 7005-7010 . |
MLA | Lin, Zhenyuan et al. "Approximately 30 nm Nanogroove Formation on Single Crystalline Silicon Surface under Pulsed Nanosecond Laser Irradiation" . | NANO LETTERS 22 . 17 (2022) : 7005-7010 . |
APA | Lin, Zhenyuan , Ji, Lingfei , Hong, Minghui . Approximately 30 nm Nanogroove Formation on Single Crystalline Silicon Surface under Pulsed Nanosecond Laser Irradiation . | NANO LETTERS , 2022 , 22 (17) , 7005-7010 . |
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Traditional mechanical bone drilling is prone to heat generation and debris accumulation which will cause tissue damage in orthopedic surgeries. Therefore, research on contactless laser bone drilling has become a mainstream trend in the development of bone surgery. This study presents a laser rapid drilling strategy for bone surgery with minimizing thermal osteonecrosis and debris based on the design of dynamic focusing and spreading droplet cooling. The laser drilled hole suffered from low temperature (T-max = 46.2 ?) under clinically accepted threshold of 47 ?, presenting osteocyte-filled lacunas, visible Haversian canals and increased pullout strength when compared with that following mechanically drilling. An intact bone column without debris was extracted from a 4-mm-deep hole in vitro on a sheep tibia which provides a clean surgical method with increased drilling rate of 0.94 mm(3)/s. The criteria dimensionless We constant related to spreading droplets leading to effective heat transfer is determined as2.8 x 10(3) x Re-1/2 <= We <= 1.9 x 10(-2) x Re-7, yielding a high convective coefficient of 0.11 W/mm(2).K for cooling. The comprehensive results of laser bone drilling proved the effectiveness of the presented technology and setup, which is significant in realizing rapid, debris-free orthopedic surgery. (C) 2022 The Author(s). Published by Elsevier Ltd.
Keyword :
Bone drilling Bone drilling Mechanical properties Mechanical properties Orthopedic surgery Orthopedic surgery Thermal analysis Thermal analysis Histology Histology
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GB/T 7714 | Ji, Lingfei , Zhang, Litian , Cao, Lijie et al. Laser rapid drilling of bone tissue in minimizing thermal injury and debris towards orthopedic surgery [J]. | MATERIALS & DESIGN , 2022 , 220 . |
MLA | Ji, Lingfei et al. "Laser rapid drilling of bone tissue in minimizing thermal injury and debris towards orthopedic surgery" . | MATERIALS & DESIGN 220 (2022) . |
APA | Ji, Lingfei , Zhang, Litian , Cao, Lijie , Zheng, Jincan , Wang, Junqiang , Han, Wei et al. Laser rapid drilling of bone tissue in minimizing thermal injury and debris towards orthopedic surgery . | MATERIALS & DESIGN , 2022 , 220 . |
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Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire are studied experimentally and numerically. Relative brightness and spatial distribution of the filamentary plasma string are characterized by time-resolved luminescence images. The whole filamentary plasma string is composed of a leading plasma string with stronger brightness and a tailing plasma string with weaker brightness. The numerical analysis shows that the different characteristics of filamentary plasma string are related to the two types of spatiotemporal evolution stages. The pivotal role of avalanche ionization for different spatiotemporal evolution stages is revealed. The filamentary plasma string induced by single pulse has a guiding significance for the subsequent pulse nonlinear propagation and the material modification; all the above provides basic information for the multi-pulse filamentation and the laser-induced filamentation processing of sapphire.
Keyword :
Nonlinear ionization Nonlinear ionization Picosecond laser Picosecond laser Spatiotemporal evolution Spatiotemporal evolution Filamentary plasma string Filamentary plasma string Sapphire Sapphire
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GB/T 7714 | Yan, Tianyang , Ji, Lingfei , Sun, Weigao . Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire [J]. | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING , 2022 , 128 (1) . |
MLA | Yan, Tianyang et al. "Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire" . | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING 128 . 1 (2022) . |
APA | Yan, Tianyang , Ji, Lingfei , Sun, Weigao . Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire . | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING , 2022 , 128 (1) . |
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