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学者姓名:郭福
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Abstract :
Bismuth telluride-based thermoelectric generators (TEG) were widely used in the clean recovery of waste heat, but frequent failure problems at the hot-end electrode interface limited the reliable service of TEGs. Diffusion at the electrode interface between n-type Bi2Te3 and Sn-based solder seriously damaged the performance of the TEGs. In this work, the crystalline Co-4 at.% P coating was deposited to protect the n-type thermoelectric material Bi2Te3. The microstructural characterization proved that the Co-P coating effectively resisted the diffusion of Sn, Bi, Te and Cu atoms, and prevented the generation of brittle intermetallic compounds (IMC) and cracks at the interface. Ultra-thin CoTe2 layer was formed between Co-P and Bi2Te3, much thinner than the brittle Ni-Te layer reported in the literatures. It not only showed that a good metallurgical bond was formed between Co-P and Bi2Te3, but also implied the Co-P only consumed little thermoelectric elements. After the 150-hour aging test at 423 K, the shear strength of the electrode joints did not decrease, and the power generation sustainability of thermoelectric pillars was significantly improved compared with uncoated pillars. Overall, the crystalline Co-P coating would be an excellent candidate to protect the n-type Bi2Te3 pillars of the TEGs.
Keyword :
Co-P coating Co-P coating Thermoelectric generator Thermoelectric generator Intermetallic compound Intermetallic compound Interfacial diffusion Interfacial diffusion Solder Solder Bismuth telluride Bismuth telluride
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GB/T 7714 | Liu, Shuang , Ma, Limin , Zhen, Cheng et al. Surface treatment by crystalline Co-P coating with ultra-thin CoTe2 layer for improved electrical and mechanical properties of the n-type Bi2Te3/Sn TEG electrode [J]. | APPLIED SURFACE SCIENCE , 2023 , 645 . |
MLA | Liu, Shuang et al. "Surface treatment by crystalline Co-P coating with ultra-thin CoTe2 layer for improved electrical and mechanical properties of the n-type Bi2Te3/Sn TEG electrode" . | APPLIED SURFACE SCIENCE 645 (2023) . |
APA | Liu, Shuang , Ma, Limin , Zhen, Cheng , Li, Dan , Wang, Yishu , Jia, Qiang et al. Surface treatment by crystalline Co-P coating with ultra-thin CoTe2 layer for improved electrical and mechanical properties of the n-type Bi2Te3/Sn TEG electrode . | APPLIED SURFACE SCIENCE , 2023 , 645 . |
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With the rapid development of the 3rd semiconductors, the metal nanoparticles are investigated to be applied in the die-attached interconnect materials. However, the organic solvent used in the nanoparticle paste needs to be addressed. In this work, we adopted the liquid phase reduction method to synthesize Cu-Ag core-shell micro/nano-mixed particles (Cu@Ag MNPs), which achieved better anti-oxidation properties than Cu MNPs. Due to the suitable boiling point and viscosity, the electrical properties and hardness of the sintered films prepared by polyethylene glycol 400 (PEG-400) are better than those of ethylene glycol and & alpha;-terpineol. The electrical properties reach 43.82 & mu;& OHM; cm and the hardness reach 61.3 HV at 300 & DEG;C. The shear strength of the joint sintered by Cu@Ag MNPs paste with PEG-400 can reach 20.14 MPa at 300 & DEG;C. Besides, the sintered Cu@Ag MNPs film exhibits a denser structure than Ag MNPs and Cu MNPs film. Therefore, Cu@Ag MNPs have great development prospects in the 3rd semiconductors.
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GB/T 7714 | Gao, Qian , Zhou, Wei , Xia, Zhidong et al. Investigation of ethylene glycol, & alpha;-terpineol, and polyethylene glycol 400 on the sintering properties of Cu-Ag core-shell micro/nano-mixed paste [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2023 , 34 (21) . |
MLA | Gao, Qian et al. "Investigation of ethylene glycol, & alpha;-terpineol, and polyethylene glycol 400 on the sintering properties of Cu-Ag core-shell micro/nano-mixed paste" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 34 . 21 (2023) . |
APA | Gao, Qian , Zhou, Wei , Xia, Zhidong , Wang, Xiaobo , Wang, Yishu , Yue, Ziwei et al. Investigation of ethylene glycol, & alpha;-terpineol, and polyethylene glycol 400 on the sintering properties of Cu-Ag core-shell micro/nano-mixed paste . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2023 , 34 (21) . |
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Abstract :
The recovery of spent lithium-ion batteries (LiBs) has critical resource and environmental benefits for the promotion of electric vehicles under carbon neutrality. However, different recovery processes will cause uncertain impacts especially when net-zero-carbon-emissions technologies are included. This paper investigates the pyrometallurgical and hydrometallurgical recovery processes for spent ternary LiBs in China based on life cycle assessment framework, then simulates the environmental impacts under different carbon neutrality scenarios, in which the decarbonization of electricity generation, the reconstruction of industrial processes, and the promotion of hydrogen are considered. Results suggest that the current environmental impacts of pyrometallurgical recovery process is greater than that of hydrometallurgical recovery process. Abiotic Depletion Potentials of resources and fossil fuels (ADP element, ADP fossil) and Human Toxicity Potentials are the main indicators that cause these differences. Besides, a multi-scenarios simulation is conducted considering the innovation of carbon neutral technology and expansion of EVs market. It is found that the improvement in energy structure and industrial processes will significantly affect the environmental performance of each recovery process. The pyrometallurgical recovery process has great potentials to improve environmental benefits with net-zero transition of energy system. [GRAPHICS] .
Keyword :
Lithium-ion batteries Lithium-ion batteries Hydrometallurgical recovery process Hydrometallurgical recovery process Pyrometallurgical recovery process Pyrometallurgical recovery process Multi-scenario simulation Multi-scenario simulation Life cycle assessment Life cycle assessment
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GB/T 7714 | Liu, Aiwei , Hu, Guangwen , Wu, Yufeng et al. Life cycle environmental impacts of pyrometallurgical and hydrometallurgical recovery processes for spent lithium-ion batteries: present and future perspectives [J]. | CLEAN TECHNOLOGIES AND ENVIRONMENTAL POLICY , 2023 . |
MLA | Liu, Aiwei et al. "Life cycle environmental impacts of pyrometallurgical and hydrometallurgical recovery processes for spent lithium-ion batteries: present and future perspectives" . | CLEAN TECHNOLOGIES AND ENVIRONMENTAL POLICY (2023) . |
APA | Liu, Aiwei , Hu, Guangwen , Wu, Yufeng , Guo, Fu . Life cycle environmental impacts of pyrometallurgical and hydrometallurgical recovery processes for spent lithium-ion batteries: present and future perspectives . | CLEAN TECHNOLOGIES AND ENVIRONMENTAL POLICY , 2023 . |
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This study investigates the structural, mechanical, and thermodynamic behaviors of AlSi2Sc2 under uniaxial tensile loading by performing first-principles calculations based on density functional theory. The parameters of the lattice a and c were found to depend on the Al-Si and the Sc-Si bonds, respectively. Tensile stress-strain curves were used to obtain ideal tensile strengths of 16.1 GPa and 21.2 GPa along the a-and c-axes, respectively. The criteria for stability showed that the AlSi2Sc2 compound became mechanically unstable when the strain exceeded 0.1 and 0.3 along the a- and the c-axes, respectively. The polycrystalline elastic constants of AlSi2Sc2 decreased with increasing strain along both axes as well, as did its Debye temperature and minimum thermal conductivity. An analysis of its electronic structure indicated that the Al-Si bonds mainly originated from the hybridization of the Al-3p and the Si-3p states, whereas the Sc-Si bonds originated from the Sc-3d and Si-3p states.
Keyword :
Electronic structure Electronic structure Mechanical properties Mechanical properties Uniaxial tensile Uniaxial tensile Thermodynamic behavior Thermodynamic behavior First principles First principles
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GB/T 7714 | Tan, Yong , Ma, Limin , Wang, Yishu et al. Mechanical and thermodynamic behaviors of AlSi2Sc2 under uniaxial tensile loading: A first-principles study [J]. | JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS , 2023 , 174 . |
MLA | Tan, Yong et al. "Mechanical and thermodynamic behaviors of AlSi2Sc2 under uniaxial tensile loading: A first-principles study" . | JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS 174 (2023) . |
APA | Tan, Yong , Ma, Limin , Wang, Yishu , Zhou, Wei , Wang, Xiaolu , Guo, Fu . Mechanical and thermodynamic behaviors of AlSi2Sc2 under uniaxial tensile loading: A first-principles study . | JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS , 2023 , 174 . |
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Abstract :
Nano-Ag sintering can realize superior thermal, electrical, and mechanical properties for power electronic packaging, while it suffers from unstable microstructure and electrochemical migration. In this work, a super-saturated Ag2.8 wt%Cu nanoalloy film has been developed using pulsed laser deposition, which can be sintered at 250 degrees C in air for electronic packaging without sacrificing bondability. It was surprisingly found that both thermal stability and electrochemical migration resistance were significantly improved when alloying the Ag with 2.8 wt% Cu. The in situ formed Cu2O/CuO from Ag-Cu nanoalloy existed on the pore surface and along the grain boundaries of Ag/Ag-Cu nanoalloy, which stabilized the microstructure of bondline from 400 h to 1400 h at 300 degrees C. The synergistic effect of Ag-Cu nanoalloy and Cu oxides realized an obvious protective effect in the process of anodic dissolution, exhibiting a short-circuit time 2.4 times of the pure Ag electrode. The die attach process is compatible with most commercial equipment and Si/SiC dies with improved performance, enabling the supersaturated Ag-Cu nanoalloy to be a promising material for high reliability power electronic packaging.
Keyword :
Power electronic packaging Power electronic packaging Thermal and electrochemical stability Thermal and electrochemical stability Low temperature sintering Low temperature sintering Ag-Cu nanoalloy Ag-Cu nanoalloy
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GB/T 7714 | Jia, Qiang , Zou, Guisheng , Zhang, Hongqiang et al. Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging [J]. | APPLIED SURFACE SCIENCE , 2023 , 612 . |
MLA | Jia, Qiang et al. "Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging" . | APPLIED SURFACE SCIENCE 612 (2023) . |
APA | Jia, Qiang , Zou, Guisheng , Zhang, Hongqiang , Deng, Zhongyang , Wang, Wengan , Liu, Lei et al. Supersaturated Ag-Cu nanoalloy film for high reliability power electronic packaging . | APPLIED SURFACE SCIENCE , 2023 , 612 . |
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Abstract :
Advances in additive manufacturing are leading to the emergence of new printable applications, including sensors for healthcare monitoring and bioengineering scaffolds. Research is driven by designing new printable inks including composites that can be extruded and respond to changes in their surroundings and patterning these materials on the microscale. In modern printing techniques, an emerging modified three-dimensional (3D) printing method: materials extrusion has been utilized for customizable electronics because of its high compatibility with various inks, low cost, and versatility to different levels of complexity. Material extrusion enables not only the printing of 2D and 3D architecture of the electrode structure but also the bioprinting of structures such as conductive scaffolds. In this review, fundamental insights into rational printable ink formulation including colloidal suspensions, gels, polymer melts, composites, printing criteria, processes, and applications toward printable electronics using composites composed of nanomaterials and biopolymers are fully discussed. New manufacturing insights on how to further improve the resolution and simplify the printing process of responsive materials are discussed, which have not been seen in currently published representative reviews. It is envisioned that this review provides high scientific merits to readers working in wearable devices, biological smart materials, and flexible nanoelectronics. This review describes the components and practical steps to extrusion-based direct ink writing (DIW), discusses steps, printer choice, fabrication and synthesis methods of graphenic material printable inks, and results in composites and ink formulation for DIW with a focus on the use of different biopolymer matrix.image & COPY; 2023 WILEY-VCH GmbH
Keyword :
carbon based carbon based direct ink writing direct ink writing biopolymers biopolymers material extrusion material extrusion cell scaffolds cell scaffolds
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GB/T 7714 | Li, Dan , Yang, Yunxia , Elias, Anastasia L. et al. Biopolymer Composites Material Extrusion and their Applications: A Review [J]. | ADVANCED ENGINEERING MATERIALS , 2023 , 25 (21) . |
MLA | Li, Dan et al. "Biopolymer Composites Material Extrusion and their Applications: A Review" . | ADVANCED ENGINEERING MATERIALS 25 . 21 (2023) . |
APA | Li, Dan , Yang, Yunxia , Elias, Anastasia L. , Yan, Ning , Guo, Fu . Biopolymer Composites Material Extrusion and their Applications: A Review . | ADVANCED ENGINEERING MATERIALS , 2023 , 25 (21) . |
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Abstract :
Over the past few decades, electronic products have evolved towards miniaturization, intelligence, and multi-functionality. With the rapid development of new energy vehicles and 5G mobile communication technologies, solder, the most commonly used interconnecting material in the microelectronic industry, may continuously undergo alternating temperature excursions. As a result, researchers have focused on improving the thermomechanical reliability of solder joints. For several decades, researchers have widely studied Sn-based lead-free solder and have established that adding an alloying element or foreign reinforcement can overcome the limitations of traditional Sn-based binary/ternary solder, resulting in highly reliable solder joints. Recently, the interest in Sn-based alloys and composite solders has increased due to their improved mechanical performance. However, various concerns, such as high manufacturing costs, microstructural heterogeneity, and incomplete reliability data. This paper reviews the latest research progress on Sn-based lead-free solders for microelectronic interconnection over the past five years, in particular Sn-based multi-element alloys and composite solders. First, the advantages and disadvantages of typical solder preparation methods are compared and discussed. Second, the effects of an alloying element or foreign reinforcement additions on the solders microstructure, properties, and thermomechanical reliability are summarized. Finally, this paper presents the main problems in preparing and investigating Sn-based lead-free solders and proposes tentative solutions. The aim is to provide an essential basis for understanding the current development and future research directions for fast-evolving future application scenarios.
Keyword :
microstructure and property microstructure and property thermo-mechanical reliability thermo-mechanical reliability microelectronic interconnection microelectronic interconnection Sn-based lead-free solder Sn-based lead-free solder
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GB/T 7714 | Guo, Fu , Du, Yihui , Ji, Xiaoliang et al. Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection [J]. | ACTA METALLURGICA SINICA , 2023 , 59 (6) : 744-756 . |
MLA | Guo, Fu et al. "Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection" . | ACTA METALLURGICA SINICA 59 . 6 (2023) : 744-756 . |
APA | Guo, Fu , Du, Yihui , Ji, Xiaoliang , Wang, Yishu . Recent Progress on Thermo-Mechanical Reliability of Sn-Based Alloys and Composite Solder for Microelectronic Interconnection . | ACTA METALLURGICA SINICA , 2023 , 59 (6) , 744-756 . |
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Abstract :
The copper recovery from waste printed circuit boards is of great significance to protect natural resource and environment. Direct current electrodeposition has been applied to extract metal from hydrometallurgical leach solutions. However, during the direct current electrodeposition process, concentration polarization and hydrogen evolution reaction often exist, which reduces current efficiency and metal recovery capability. In this work, a pulse current was applied to electrodeposit copper. The electrolyte was the leach solution of waste printed circuit boards obtained using a sulfuric acid-hydrogen peroxide system. The influence of process parameters in the leaching stage and the electrodeposition process on current efficiency were both investigated. The results showed that the current efficiency was 95.1% in pulse current electrodeposition, while that was only 90.9% in direct current electrodeposition. The increased current efficiency was proposed to be attributed to the fact that pulse current electrodeposition could improve the mass transfer of copper ions which suppressed concentration polarization and hydrogen evolution reaction. These results demonstrate that pulse current electrodeposition is a promising approach for recovering copper from waste-printed circuit boards.
Keyword :
Pulsed electrodeposition Pulsed electrodeposition Copper recycling Copper recycling Leaching Leaching Waste-printed circuit boards Waste-printed circuit boards
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GB/T 7714 | Hao, Juanjuan , Wang, Xiaolu , Wang, Yishu et al. Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition [J]. | JOURNAL OF MATERIAL CYCLES AND WASTE MANAGEMENT , 2023 , 25 (2) : 1108-1119 . |
MLA | Hao, Juanjuan et al. "Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition" . | JOURNAL OF MATERIAL CYCLES AND WASTE MANAGEMENT 25 . 2 (2023) : 1108-1119 . |
APA | Hao, Juanjuan , Wang, Xiaolu , Wang, Yishu , Guo, Fu , Wu, Yufeng . Copper recovery from leach solution of waste printed circuit boards by pulse current electrodeposition . | JOURNAL OF MATERIAL CYCLES AND WASTE MANAGEMENT , 2023 , 25 (2) , 1108-1119 . |
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Abstract :
In this research, camphorquinone (CQ)-mediated one-pot polyol methods to synthesize silver right bipyramids and nanorods with high yields are developed. The key strategy of these methods is the use of CQ which is first applied to selectively stabilize Ag(100) facets through capping. As CQ stabilizes small-sized nanocrystals, including single-twinned and nanorod struc-tures, we successfully synthesized silver right bipyramids and nanorods as the two dominant products in a CQ-mediated polyol system. Further morphology control between silver nanorods and silver right bipyramids is conducted through adjusting the poly(vinylpyrrolidone) (PVP) concentration and reaction temper-ature, which can improve the formation of single-twinned and fivefold twinned particles through affecting the reduction kinetics. Silver nanorods with a yield of 87% are obtained under 150 degrees C with a PVP/CQ/AgNO3 molar ratio of 1.2:2:1, while silver right bipyramids with a yield of 88% are obtained under 120 degrees C with a molar ratio of 1.6:2:1.
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GB/T 7714 | Zhu, Zhaoxi , Wang, Xiaolu , Yu, Haiyang et al. Improved Polyol Syntheses of Silver Right Bipyramids and Nanorods: Camphorquinone-Mediated Morphology Control Methods [J]. | CRYSTAL GROWTH & DESIGN , 2023 , 23 (3) : 1455-1465 . |
MLA | Zhu, Zhaoxi et al. "Improved Polyol Syntheses of Silver Right Bipyramids and Nanorods: Camphorquinone-Mediated Morphology Control Methods" . | CRYSTAL GROWTH & DESIGN 23 . 3 (2023) : 1455-1465 . |
APA | Zhu, Zhaoxi , Wang, Xiaolu , Yu, Haiyang , Zhou, Wei , Wang, Yishu , Han, Jing et al. Improved Polyol Syntheses of Silver Right Bipyramids and Nanorods: Camphorquinone-Mediated Morphology Control Methods . | CRYSTAL GROWTH & DESIGN , 2023 , 23 (3) , 1455-1465 . |
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Nano-Ag paste sintering has attracted much attention for high-power electronics packaging owing to its excellent electrical conductivity, thermal conductivity, and oxidation resistance. However, it requires printing and pre-heating before the die attach process, and the organics in the paste do not evaporate easily for large-area die attachment. In this work, a nano-Ag film (similar to 100 mu m thickness) with only 2.1% organics is developed to realize low-temperature bonding, which is compatible with the current sintering bonding process. The optimized preparation parameters of the nano-Ag films was optimized as 180 degrees C-5 min. The characteristics and sintering mechanism of nano-Ag film are discussed. The results showed that the micro/nanostructure on the surface of nano-Ag film with a small amount of organic material is responsible for the low-temperature sintering ability, which realized 24.01 MPa shear strength at 200 degrees C. The fracture was analyzed and failure modes are discussed. The easy-to-use features and low-temperature sintering ability make the nano-Ag film a promising die-attach material with high reliability. [GRAPHICS] .
Keyword :
low-temperature bonding low-temperature bonding sintering mechanism sintering mechanism mechanical properties mechanical properties Nano-Ag films Nano-Ag films
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GB/T 7714 | Ma, Limin , Wang, Yuchen , Jia, Qiang et al. Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging [J]. | JOURNAL OF ELECTRONIC MATERIALS , 2023 , 53 (1) : 228-237 . |
MLA | Ma, Limin et al. "Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging" . | JOURNAL OF ELECTRONIC MATERIALS 53 . 1 (2023) : 228-237 . |
APA | Ma, Limin , Wang, Yuchen , Jia, Qiang , Zhang, Hongqiang , Wang, Yishu , Li, Dan et al. Low-Temperature-Sintered Nano-Ag Film for Power Electronics Packaging . | JOURNAL OF ELECTRONIC MATERIALS , 2023 , 53 (1) , 228-237 . |
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