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学者姓名：李晓延
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Abstract ：
The effect of ultrasound on the morphological characteristics and growth mechanism of intermetallic compounds (IMCs) formed at the different temperatures in the ultrasonically fabricated Cu/Cu3Sn/Cu solder joints was systematically investigated. At 260 and 290 degrees C, the acoustic cavitation and acoustic streaming effects of ultrasound increased the diffusion flux (J(R) and J(GB)) by promoting the flow of liquid Sn and accelerating the adsorption of Cu atoms onto Cu6Sn5 surface. This facilitated the annexation of Cu6Sn5 grains and formation of convex-shape Cu6Sn5. The evolution of IMCs thickness difference during the ultrasonic soldering process was different compared with the traditional soldering process. The Cu6Sn5 thickness difference increased at 260 and 290 degrees C, and first increased and then decreased at 320 degrees C with increasing the ultrasonic time range from 5-15 to 30-50 s, while the Cu3Sn thickness difference always increased with increasing the ultrasonic time range from 5-15 to 30-50 s at each temperature. The activation energies of the ultrasonically grown Cu6Sn5 and Cu3Sn IMCs were determined to be 19.67 and 43.93 kJ mol(-1) being lower than the values for the traditional solder joints, i.e., 26.85 and 84.47 kJ mol(-1), respectively. The symmetrical growth of planar-like Cu3Sn layer resulted in the Cu3Sn grain boundary line in the traditional Cu/Cu3Sn/Cu solder joint, which was eliminated due to the asymmetrical growth and combination of branch-like Cu3Sn on the both sides of ultrasonic solder joint center. Importantly, the ultrasonic treatment significantly reduced the fabrication time of the solder joints from 600 min down to 100 s, showing a high potential for industry applications.
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| GB/T 7714 | Han, Xu , Li, Xiaoyan , Ji, Gang . On the study of morphological characteristics and growth mechanism of intermetallic compounds in ultrasonically fabricated Cu-Sn solder joints [J]. | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2022 , 33 (13) : 10677-10692 . |
| MLA | Han, Xu 等. "On the study of morphological characteristics and growth mechanism of intermetallic compounds in ultrasonically fabricated Cu-Sn solder joints" . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 33 . 13 (2022) : 10677-10692 . |
| APA | Han, Xu , Li, Xiaoyan , Ji, Gang . On the study of morphological characteristics and growth mechanism of intermetallic compounds in ultrasonically fabricated Cu-Sn solder joints . | JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS , 2022 , 33 (13) , 10677-10692 . |
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Abstract ：
In this study, Cu/Sn/Cu structure under a pressure of 1.5 N was soldered at 390-450 degrees C. Then, microstructure evolution and changes in mechanical properties of solder joint during the formation of full Cu41Sn11 joint were systematically analyzed. Experimental results showed that Cu6Sn5 and Cu3Sn were observed in the interfacial region at 420 C in the early stage of soldering. The Cu/Sn/Cu structure completely transformed into Cu/Cu3Sn/ Cu at 1 h. With the further progress of the interfacial reaction, Cu41Sn11 appeared and grew at the expense of Cu3Sn. Eventually, the full Cu41Sn11 joint was formed at 10 h. The growth of Cu41Sn11 was controlled by volume-diffusion. Moreover, diffusion activation energy of Cu41Sn11 was about 108.19 kJ/mol. The shear strength of full Cu3Sn joints was 45 MPa, while that of the solder joints with 25, 50, 75 and 100% Cu41Sn11 was 50, 52.2, 59 and 64.5 MPa, respectively. For full Cu3Sn and full Cu41Sn11 joints, respectively, the fracture occurred partly within intermetallic compounds (IMCs) layers and partly along the Cu/IMC interface. However, for the joints composed of Cu3Sn and Cu41Sn11, all fractures occurred in the IMCs layer. Besides, all IMCs joints were brittle fracture, and the fracture of Cu3Sn was mainly intergranular, while the fracture that occurred in Cu41Sn11 was mainly transgranular.
Keyword ：
Growth kinetic Growth kinetic Cu41Sn11 Cu41Sn11 Mechanical property changes Mechanical property changes Brittle failure Brittle failure Microstructure evolution Microstructure evolution
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| GB/T 7714 | Yang, Gangli , Li, Xiaoyan , Han, Xu et al. Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging [J]. | MICROELECTRONICS RELIABILITY , 2022 , 130 . |
| MLA | Yang, Gangli et al. "Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging" . | MICROELECTRONICS RELIABILITY 130 (2022) . |
| APA | Yang, Gangli , Li, Xiaoyan , Han, Xu , Zhang, Hu , Wen, Linjie , Li, Shanshan . Microstructure evolution and mechanical properties changes during the formation of full Cu41Sn11 joint in high-temperature electronic packaging . | MICROELECTRONICS RELIABILITY , 2022 , 130 . |
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Abstract ：
The morphological evolution and grain orientations of intermetallic compounds (IMCs) were investigated during the formation of full Cu3Sn joints at two soldering temperatures (310 and 430 degrees C). The mechanical properties of both types of full Cu3Sn joints were then analyzed. The experimental results showed that the morphology of interfacial IMCs varied significantly at two temperatures. At 310 degrees C, scallop-like Cu6Sn5 grains became larger but were fewer in number and the top of the scallops became rough due to the grain ripening effect. With the increase in the soldering temperature to 430 degrees C, Cu3Sn no longer grew uniformly as observed during soldering at 310 degrees C, but exhibited various growth rates. Furthermore, some eta-Cu6Sn5 transformed into eta'-Cu6Sn5 during cooling, and the following orientation groups between eta'-Cu6Sn5 and eta-Cu6Sn5, i.e., {102}eta' and {1120}eta, {112}eta' and {1010}eta, and {201}eta' and {0001}eta, were found to be near-parallel. The Cu3Sn grains were preferably oriented with [203] and [100] crystal orientations parallel to transverse direction (TD) at both temperatures. Noteworthy, the Cu3Sn grains with [203]//TD and [010]//ND grew much faster than those with other orientations at 430 degrees C. Moreover, molecular dynamics simulation showed that the diffusion coefficients of atoms in Cu3Sn crystals along [203] direction were significantly greater than those in other low-index crystal directions. After soldering, two types of full Cu3Sn joints obtained at different temperatures exhibited different shear strength and fracture mechanisms.
Keyword ：
Microstructure Microstructure Electron backscatter diffraction Electron backscatter diffraction Molecular dynamics simulation Molecular dynamics simulation Intermetallics Intermetallics Jointing Jointing
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| GB/T 7714 | Yang, Gangli , Li, Xiaoyan , Ren, Erhua et al. Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint [J]. | INTERMETALLICS , 2022 , 145 . |
| MLA | Yang, Gangli et al. "Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint" . | INTERMETALLICS 145 (2022) . |
| APA | Yang, Gangli , Li, Xiaoyan , Ren, Erhua , Li, Shanshan . Morphology evolution and grain orientations of intermetallic compounds during the formation of full Cu3Sn joint . | INTERMETALLICS , 2022 , 145 . |
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Abstract ：
In this work, full Cu3Sn joints were aged at 500 C, 550 C, and 600C for various durations. Microstructure evolution and grain morphology of the joints were systematically investigated by OM, SEM, EBSD, and TEM technology. In addition, the mechanical properties of hardness and shear strength for the Cu-Sn intermetallic compounds were studied using a Micro Vickers hardness tester and uniaxial tensile equipment. Upon heating to 500C, the phase transformation pathway was Cu3Sn-Cu41Sn11-alpha(Cu); aging at 550C demonstrated a pathway of Cu3Sn-Cu41Sn11-Cu41Sn11 &alpha(Cu)-alpha(Cu); and finally, heating to 600C resulted in a phase transformation pathway of Cu3Sn-Cu20Sn6-Cu20Sn6 &alpha(Cu)-alpha(Cu). It was found that longer aging times and higher temperatures had effects on grain size and morphology. For the 500C group, the average grain size of the fully formedCu(41)Sn(11) phase increased from 1.93 mu m at an aging time of 20 min to 4.20 mu m at 30 min. The grain sizes of the fully formed Cu41Sn11 phase in joints subjected to 550C for 11 min was lower than 2.36 mu m, which were in turn smaller than joints treated at 500 C for 30 min (4.2 mu m). Treatment with higher temperatures resulted in more cores and a higher growth rate ofCu(41)Sn(11) grains formed on the interface of Cu/Cu3Sn, which eventually led to the small grain size of the Cu41Sn11 phase. The grain morphologies of the formed Cu41Sn11 phase and Cu20Sn6 phase were mainly column grain. After an aging time of 11 min for the 550C group, the grain morphology of alpha(Cu) included in a two-phase microstructure (Cu41Sn11 &alpha(Cu)) mainly exhibited dendritic properties at the grain boundary of Cu41Sn11, its crack tendency broke the hardenability of single grains for the Cu41Sn11 phase, which resulted in a decline in strength from 107 MPa to 42 MPa for Cu41Sn11 &alpha(Cu) compared to the Cu41Sn11 phase. Nevertheless, for the joints treated at 600C after an aging time of 7 min, the dispersion of alpha(Cu) particles mainly followed granular shapes within the one large Cu20Sn6 grain in the two-phase microstructure ( Cu20Sn6 &alpha(Cu)). This blocked the extension of dislocation, which finally led to an enhancement in strength for the Cu20Sn6 & alpha(Cu) phase (51 MPa) compared to the Cu20Sn6 phase (73 MPa).
Keyword ：
Aging treatment Aging treatment Grain morphology variation Grain morphology variation Mechanical properties Mechanical properties Intermetallic compounds Intermetallic compounds Microstructure evolution Microstructure evolution
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| GB/T 7714 | Zhang, Hu , Li, Xiaoyan , Yao, Peng et al. Microstructure evolution and mechanical properties of Cu-Sn intermetallic joints subjected to high-temperature aging [J]. | MATERIALS CHARACTERIZATION , 2022 , 186 . |
| MLA | Zhang, Hu et al. "Microstructure evolution and mechanical properties of Cu-Sn intermetallic joints subjected to high-temperature aging" . | MATERIALS CHARACTERIZATION 186 (2022) . |
| APA | Zhang, Hu , Li, Xiaoyan , Yao, Peng , Wen, Linjie , Zhu, Yangyang , He, Xi et al. Microstructure evolution and mechanical properties of Cu-Sn intermetallic joints subjected to high-temperature aging . | MATERIALS CHARACTERIZATION , 2022 , 186 . |
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Abstract ：
Purpose This study aims to analyse the changes in the microstructure and grain orientation of the full Cu3Sn solder joint (Cu/Cu3Sn/Cu) during isothermal aging at 420 degrees C. Design/methodology/approach The Cu3Sn solder joint was fabricated through soldering Cu/Sn/Cu structure and then aged at 420 degrees C. The microstructure evolution and grain orientation were studied by observing the cross-section and top-view surfaces of solder joints. Findings Original Cu3Sn solder joint initially transformed into the full Cu(41)Sn(11)solder joint (Cu/Cu41Sn11/Cu) at 10 h and finally into the full alpha(Cu) solder joint (Cu/alpha(Cu)/Cu) at 150 h during aging. Micro-voids formed in the center of the solder joint interface during the conversion of Cu(41)Sn(11)to alpha(Cu), resulting in lower reliability of the solder joint. Cu3Sn and Cu41Sn11 grains presented a column-like shape, while alpha(Cu) presented an irregular shape. The average grain sizes of interfacial phases first increased and then decreased during aging. Original Cu3Sn solder joint exhibited two main textures: [100]//TD and [203]//TD. For Cu41Sn11, the preferred orientation of [111]//TD was found in the early nucleation stage, while the orientation of the formed full Cu41Sn11 solder joint was dispersed. Furthermore, alpha(Cu) grains exhibited {100} preferred orientation. Originality/value Few researchers focused on the process of microstructure and grain orientation changes during high-temperature (> 300 degrees C) aging of Cu3Sn solder joint. To bridge the research gap, a high-temperature aging experiment was conducted on Cu3Sn solder joints.
Keyword ：
Thermal aging Thermal aging Grain orientation Grain orientation Microstructure evolution Microstructure evolution Electronic packaging Electronic packaging Cu3Sn solder joint Cu3Sn solder joint IMC IMC
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| GB/T 7714 | Yang, Gangli , Li, Xiaoyan , Han, Xu et al. Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2022 , 35 (1) : 44-50 . |
| MLA | Yang, Gangli et al. "Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint" . | SOLDERING & SURFACE MOUNT TECHNOLOGY 35 . 1 (2022) : 44-50 . |
| APA | Yang, Gangli , Li, Xiaoyan , Han, Xu , Li, Shanshan . Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2022 , 35 (1) , 44-50 . |
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Abstract ：
2A97 is the third-generation aluminum-lithium (Al-Li) alloy developed by China. However, the fine equiaxed zone (FEQZ) of weld is the weakest area of its joint, which severely limits its practical application in the aerospace field. In this study, the macro- and microscopic characteristics of weld and the formation mechanism of the microstructure under the condition of non-autogenous laser welding (NLW) were investigated. The results showed that the droplet transition behavior varied with the change in the content of low-boiling-temperature elements of filler metals. The porosity imperfection in 2A97-T3 via NLW was relatively serious, which could be modified by using ER2319 filler metal. The addition of Zr in the equiaxed zone resulted in effective refinement of the equiaxed dendrite. Furthermore, it also led to the alternate distribution of coarse and fine equiaxed dendrites. The distribution of FEQZ was affected by the flow of the weld pool and concentrated at the four corners of the weld. Moreover, its morphology and distribution ranges were influenced significantly by the welding parameters and filler metals.
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| GB/T 7714 | Shao, Yingkai , Li, Xiaoyan , Chen, Li et al. Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy [J]. | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE , 2021 , 52 (3) : 1413-1423 . |
| MLA | Shao, Yingkai et al. "Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy" . | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE 52 . 3 (2021) : 1413-1423 . |
| APA | Shao, Yingkai , Li, Xiaoyan , Chen, Li , He, Enguang . Study on Microstructure Formation in Non-autogenous Laser Welded 2A97 Al-Li Alloy . | METALLURGICAL AND MATERIALS TRANSACTIONS B-PROCESS METALLURGY AND MATERIALS PROCESSING SCIENCE , 2021 , 52 (3) , 1413-1423 . |
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Abstract ：
Purpose This study aims to investigate the effect of ultrasound on interfacial microstructures and growth kinetics of intermetallic compounds (IMCs) at different temperatures. Design/methodology/approach To investigate the effect of ultrasound on IMCs growth quantitatively, the cross-sectional area of IMCs layers over a confirmed length was obtained for calculating the thickness of the IMCs layer. Findings The generation of dimensional difference in normal direction between Cu6Sn5 and its adjacent Cu6Sn5, formation of bossed Cu6Sn5 and non-interfacial Cu6Sn5 in ultrasonic solder joints made the interfacial Cu6Sn5 layer present a non-scallop-like morphology different from that of traditional solder joints. At 260 degrees C and 290 degrees C, the Cu3Sn layer presented a wave-like shape. In contrast, at 320 degrees C, the Cu3Sn in ultrasonic solder joints consisted of non-interfacial Cu3Sn and interfacial Cu3Sn with a branch-like shape. The Cu6Sn5/Cu3Sn boundary and Cu3Sn/Cu interface presented a sawtooth-like shape under the effect of ultrasound. The predominant mechanism of ultrasonic-assisted growth of Cu6Sn5 growth at 260 degrees C, 290 degrees C and 320 degrees C involved the grain boundary diffusion accompanied by grain coarsening. The Cu3Sn growth was controlled by volume diffusion during the ultrasonic soldering process at 260 degrees C and 290 degrees C. The diffusion mechanism of Cu3Sn growth transformed to grain boundary diffusion accompanied by grain coarsening when the ultrasonic soldering temperature was increased to 320 degrees C. Originality/value The microstructural evolution and growth kinetics of IMCs in ultrasonically prepared ultrasonic solder joints at different temperatures have rarely been reported in previous studies. In this study, the effect of ultrasound on microstructural evolution and growth kinetics of IMCs was systematically investigated.
Keyword ：
Growth kinetics Growth kinetics Activation energy Activation energy Mechanism Mechanism Ultrasounds Ultrasounds Intermetallic compounds Intermetallic compounds
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| GB/T 7714 | Han, Xu , Li, Xiaoyan , Yao, Peng . Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 34 (2) : 79-87 . |
| MLA | Han, Xu et al. "Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process" . | SOLDERING & SURFACE MOUNT TECHNOLOGY 34 . 2 (2021) : 79-87 . |
| APA | Han, Xu , Li, Xiaoyan , Yao, Peng . Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 34 (2) , 79-87 . |
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In this study, the concept of fine equiaxed band (FEQB) was proposed for the first time, and the distribution range of the fine equiaxed zone (FEQZ) was redefined. Characterization techniques including scanning electron microscopy, electron backscattered diffraction, energy dispersive spectroscopy, and transmission electron microscopy were employed to analyse the microstructures, orientations, micro-segregations, and precipitates within the grain of the FEQZ. The results indicate the existence of tiny precipitates, mainly T-1 and theta' along with a small amount of delta' within the randomly oriented fine equiaxed grain with spherical morphology, and no obvious dendrite structure was observed. The micro-segregation of Cu and Mg occurred at the grain boundaries, resulting in the generation of intermetallic phases at grain boundaries derived mainly by eutectic action. The dominant intermetallic phase enveloping that grain is T-1, and a small amount of plate-like precipitate S' is formed at the junction of three or more grains. The bands formed by these closely connected grains are called FEQB. Furthermore, the region covered by the FEQBs is called FEQZ. (C) 2021 Elsevier B.V. All rights reserved.
Keyword ：
Electron backscattered diffraction Electron backscattered diffraction Fine equiaxed zone Fine equiaxed zone Precipitate Precipitate Al-Li-Cu-Mg alloy Al-Li-Cu-Mg alloy
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| GB/T 7714 | Shao, Yingkai , Li, Xiaoyan , Chen, Li et al. New insights into fine equiaxed zone of laser-welded 2A97 Al-Li alloy [J]. | JOURNAL OF ALLOYS AND COMPOUNDS , 2021 , 895 . |
| MLA | Shao, Yingkai et al. "New insights into fine equiaxed zone of laser-welded 2A97 Al-Li alloy" . | JOURNAL OF ALLOYS AND COMPOUNDS 895 (2021) . |
| APA | Shao, Yingkai , Li, Xiaoyan , Chen, Li , He, Enguang . New insights into fine equiaxed zone of laser-welded 2A97 Al-Li alloy . | JOURNAL OF ALLOYS AND COMPOUNDS , 2021 , 895 . |
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Abstract ：
Purpose This study aims to investigate the interfacial microstructures of ultrasonic-assisted solder joints at different soldering times. Design/methodology/approach Solder joints with different microstructures are obtained by ultrasonic-assisted soldering. To analyze the effect of ultrasounds on Cu6Sn5 growth during the solid-liquid reaction stage, the interconnection heights of solder joints are increased from 30 to 50 mu m. Findings Scallop-like Cu6Sn5 nucleate and grow along the Cu6Sn5/Cu3Sn interface under the traditional soldering process. By comparison, some Cu6Sn5 are formed at Cu6Sn5/Cu3Sn interface and some Cu6Sn5 are randomly distributed in Sn when ultrasonic-assisted soldering process is used. The reason for the formation of non-interfacial Cu6Sn5 has to do with the shock waves and micro-jets produced by ultrasonic treatment, which leads to separation of some Cu6Sn5 from the interfacial Cu6Sn5 to form non-interfacial Cu6Sn5. The local high pressure generated by the ultrasounds promotes the heterogeneous nucleation and growth of Cu6Sn5. Also, some branch-like Cu3Sn formed at Cu6Sn5/Cu3Sn interface render the interfacial Cu3Sn in ultrasonic-assisted solder joints present a different morphology from the wave-like or planar-like Cu3Sn in conventional soldering joints. Meanwhile, some non-interfacial Cu3Sn are present in non-interfacial Cu6Sn5 due to reaction of Cu atoms in liquid Sn with non-interfacial Cu6Sn5 to form non-interfacial Cu3Sn. Overall, full Cu3Sn solder joints are obtained at ultrasonic times of 60 s. Originality/value The obtained microstructure evolutions of ultrasonic-assisted solder joints in this paper are different from those reported in previous studies. Based on these differences, the effects of ultrasounds on the formation of non-interfacial IMCs and growth of interfacial IMCs are systematically analyzed by comparing with the traditional soldering process.
Keyword ：
Interface Interface Microstructure Microstructure Ultrasound Ultrasound IMCs IMCs Soldering time Soldering time
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| GB/T 7714 | Han, Xu , Li, Xiaoyan , Yao, Peng et al. Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints [J]. | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 33 (4) : 206-214 . |
| MLA | Han, Xu et al. "Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints" . | SOLDERING & SURFACE MOUNT TECHNOLOGY 33 . 4 (2021) : 206-214 . |
| APA | Han, Xu , Li, Xiaoyan , Yao, Peng , Chen, Dalong . Influence of ultrasounds on interfacial microstructures of Cu-Sn solder joints . | SOLDERING & SURFACE MOUNT TECHNOLOGY , 2021 , 33 (4) , 206-214 . |
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Abstract ：
在温度为120℃，电流密度分别为1×10~4、1.2×10~4、1.6×10~4 A/cm~2情况下对焊点通电，研究电迁移作用下Cu/Cu_3Sn/Cu焊点微观形貌演变规律以及剪切性能的变化情况，。结果表明，在电流密度为1×10~4 A/cm~2时通电80 h，焊点中部出现蜂窝状空洞，随着通电时间增加，空洞面积不断变大，形成长条状空洞；进一步增加通电时间，在Cu_3Sn层中间产生贯穿界面的裂纹状缺陷。增大电流密度，空洞等缺陷的形成时间大大缩短。利用剪切试验机测试不同电迁移实验条件下焊点的剪切强度，发现随着通电时间增加，焊点剪切强度不断下降，并且空洞面积越大，剪切强度下降幅度越大。
Keyword ：
电迁移 电迁移 剪切强度 剪切强度 Cu/Cu3Sn/Cu焊点 Cu/Cu3Sn/Cu焊点 微观形貌 微观形貌 空洞 空洞
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| GB/T 7714 | 徐刘峰 , 李晓延 , 姚鹏 et al. 电迁移对全Cu_3Sn焊点形貌及剪切性能的影响 [J]. | 热加工工艺 , 2020 , (23) : 8-11,15 . |
| MLA | 徐刘峰 et al. "电迁移对全Cu_3Sn焊点形貌及剪切性能的影响" . | 热加工工艺 23 (2020) : 8-11,15 . |
| APA | 徐刘峰 , 李晓延 , 姚鹏 , 韩旭 . 电迁移对全Cu_3Sn焊点形貌及剪切性能的影响 . | 热加工工艺 , 2020 , (23) , 8-11,15 . |
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