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学者姓名：季凌飞
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Abstract ：
Significance Hard and brittle materials possess excellent mechanical, optical, and chemical properties. However, the demand for efficient and high-precision processing drives continuous innovation in modern processing technologies. Laser processing plays an increasingly important role in high-precision cutting and shaping of these materials due to its high flexibility, precision, and non-contact nature. In this study, we overview the current research and progress on the key technologies of laser high-precision cutting and shaping of hard and brittle materials, particularly focusing on applications involving large thickness/large length ratio, multi-dimensional components, and composite cutting and forming. In addition, we discuss the challenges and prospects of this technology, aiming to provide theoretical guidance and a technical foundation for the advancement of related industries. Progress We first discuss the fundamental interaction between lasers and brittle materials. We elaborate on the laser processing of large thickness brittle materials, high-precision cutting of multi-dimensional components, and composite cutting and forming technologies. Besides, we analyze the technical principles, advantages, and application examples of these technologies, which lays a solid foundation for innovations in laser cutting of hard and brittle materials. For the laser cutting of materials with large thickness or a high length-to-diameter ratio, methods such as non-destructive close piercing, multi-focal distribution spherical aberration correction, Bessel beam modulation, and laser filamentation have been successfully applied to address issues like heat accumulation, beam aberration, and energy loss. These methods enable high-precision cutting of thick, hard, and brittle materials, including the machining of complex structures that are challenging for traditional methods. In multi-dimensional structure cutting, the application of computer numerical control (CNC) technology enables precise multi-dimensional laser cutting and structuring. The closed-loop feedback system, with high-precision positioning and trajectory control, plays a crucial role in achieving accurate multi-dimensional cutting and forming. Laser composite cutting and forming technologies significantly improve cutting accuracy and quality by integrating laser techniques with other processing methods. Coupling laser processing with mechanical methods, liquid assistance, chemical etching, and optical far-field-induced near-field breakdown (O-FIB) effectively reduces thermal damage, microcracks, and recast layers. These composite methods not only increase processing efficiency but also expand the range of applications for hard and brittle materials, enabling more intricate multi-dimensional structures. The progress of laser high-precision cutting methods enhances the machining accuracy and efficiency of hard and brittle materials, broadening their application prospects in fields such as precision instruments, artificial intelligence, and bioengineering. With continuous advancements, laser cutting and shaping technologies will play a more significant role in future micro/nano- manufacturing. Conclusions and Prospects Laser cutting technology is widely used in industrial manufacturing due to its ability to enhance machining accuracy and efficiency while minimizing thermal effects. We systematically review recent advances in laser high-precision cutting and shaping of hard and brittle materials. By integrating cutting-edge techniques such as chemical etching, multiphoton absorption, and liquid-assisted methods, laser cutting effectively mitigates issues like thermal stress and microcracking. Particularly for complex structures and large-thickness materials, innovative approaches such as Bessel beams, multi-focus technology, and far-field-induced near-field enhancement further improve cutting performance and precision. As new materials, including composites and functional materials, emerge, laser cutting technology continues to expand in its applications. Further exploration of the interaction between lasers and various materials, as well as optimization of processes tailored to new material requirements, is necessary. The deep integration of laser technology with intelligent manufacturing and automation will provide a powerful momentum for the future development of high-end equipment.
Keyword ：
laser cutting laser cutting hard and brittle materials hard and brittle materials high precision machining high precision machining
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| GB/T 7714 | Ji, Lingfei , Zhang, Sen , Lin, Zhenyuan et al. Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited) [J]. | ACTA OPTICA SINICA , 2025 , 45 (2) . |
| MLA | Ji, Lingfei et al. "Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited)" . | ACTA OPTICA SINICA 45 . 2 (2025) . |
| APA | Ji, Lingfei , Zhang, Sen , Lin, Zhenyuan , Fan, Jinshuai , Zhang, Wenlong , Yao, Tianran et al. Key Technology and Application of Laser High⁃Precision Cutting and Shaping of Hard and Brittle Materials (Invited) . | ACTA OPTICA SINICA , 2025 , 45 (2) . |
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Abstract ：
通过飞秒激光单脉冲实验，探究了偏振方向（0°、45°、90°、135°）对x-切铌酸锂（LN）晶体损伤阈值的影响，发现材料损伤阈值呈现明显的偏振依赖性，90°偏振方向的损伤阈值低于其他偏振方向。通过第一性原理计算，确认了飞秒激光引起的隧穿电离主要导致Nb—O键断裂。而当入射偏振角度为90°时，易导致更多的Nb—O键断裂，在该偏振方向上的损伤阈值降低。该研究有助于更深入地理解超快激光在LN晶体表面的烧蚀过程，对LN晶体表面功能性器件激光制备有重要的参考价值。
Keyword ：
第一性原理 第一性原理 损伤阈值 损伤阈值 偏振 偏振 铌酸锂 铌酸锂 飞秒激光 飞秒激光
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| GB/T 7714 | 温亚楠 , 林真源 , 季凌飞 . 偏振方向对x-切铌酸锂损伤阈值影响规律（特邀） [J]. | 激光与光电子学进展 , 2024 , 61 (11) : 154-159 . |
| MLA | 温亚楠 et al. "偏振方向对x-切铌酸锂损伤阈值影响规律（特邀）" . | 激光与光电子学进展 61 . 11 (2024) : 154-159 . |
| APA | 温亚楠 , 林真源 , 季凌飞 . 偏振方向对x-切铌酸锂损伤阈值影响规律（特邀） . | 激光与光电子学进展 , 2024 , 61 (11) , 154-159 . |
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Abstract ：
Objective Epoxy removal is an important step when testing the performance of electronic components, and laser ablation is expected to be an ideal method for the efficient and non-destructive removal of epoxy resin because of its precision and control. This study reports the results of the systematic investigation of the influence of a 532 nm laser on the ablation of epoxy resin under different laser parameters using a response surface methodology. A multi-response surface model that considers the effects of the laser fluence, scanning speed, and scanning spacing on the removal rate and roughness during the laser ablation of epoxy resin is established using the central composite design method. The effects of single and multiple factors on the laser ablation of epoxy resin are analyzed. The results indicate that the optimal ranges for the laser fluence, scanning speed, and scanning spacing are 11.20?11.28 J/cm(2), 224?240 mm/s, and 1.50?1.55 mu m, respectively, which result in a removal rate of 1620?1628 mu m(3)/s and roughness range of 5.7?5.8 mu m. The optimal parameters are the laser fluence of 11.20 J/cm(2), scanning speed of 234 mm/s, and scanning spacing of 1.50 mu m. The study results confirm that optimized ceramic components inside electronic devices have lower surface damage, based on a comparative analysis of the micro-morphology, elastic modulus, and element content results of epoxy resin samples before and after parameter optimization. These results have significant value and meaning for the non-destructive testing of electronic components through accurate and efficient epoxy resin ablation. Methods A nanosecond laser with a wavelength of 532 nm, pulse width of 6 ns, and repetition frequency of 100 Hz is used to perform ablation tests on epoxy resin-coated electronic devices. Taking the laser fluence, scanning speed, and scanning spacing as input factors, and the roughness and removal rate as output responses, a mathematical?physical regression model of the removal rate and roughness with the above laser parameters is established using three-factor five-level full-response central composite design experiments. In addition, the process parameters needed to obtain the optimal removal effect are obtained, with the reliability of the model proven through validation experiments. The microscopic morphology of the samples after the removal of the epoxy resin is observed and analyzed using scanning electron microscope (SEM). The roughness and removal rate of the samples are measured and calculated using laser confocal microscope, and the elasticity modulus of the electronic device surface after removing the epoxy resin is measured using atomic force microscope (AFM). The parameter combination of smaller laser fluence (11.20?11.40 J/cm(2)), faster scanning speed (200?240 mm/s), and appropriate scanning spacing (approximately 1.50 mu m) allows the laser to ablate the epoxy resin in a more moderate way, which results in a smaller roughness (Fig. 4). The average elastivity modulus of the electronic device surface after the removal of the epoxy resin is (318.0 +/- 10.5)GPa, and after optimizing the parameters, the laser ablation does no damage to the mechanical properties (Fig. 6). Results and Discussions The calculation results show that the optimum removal rate during the laser ablation is obtained with a laser fluence of 11.60?11.80 J/cm(2), scanning speed of 160?180 mm/s, and scanning spacing of 1.50?2.00 mu m (Fig. 3). In this case, increasing the laser fluence increases the energy absorption rate of the epoxy resin, and decreasing the scanning speed increases the interaction time between the laser and material. In addition, decreasing the scanning spacing increases the overlap rate of the spot between rows and the energy of the laser irradiation per unit area. As shown by the SEM images, the surface of the laser-removed epoxy resin sample is relatively clean and tidy after the optimization of the parameters (Fig. 5). The elasticity modulus measured via AFM is (318.0 +/- 10.5)GPa, which demonstrates the low laser-induced damage to an electronic component during the removal of epoxy resin. Conclusions A mathematical-physical model of the laser ablation of epoxy resin is established by adopting the response surface method, and the effects of the process parameters and their interaction on the removal rate and roughness during the laser ablation of epoxy resin are systematically investigated. This leads to the optimum theoretical laser parameters for obtaining the maximum removal rate and minimum roughness. The calculation results show that the optimized removal rate and roughness during laser ablation are obtained at a laser fluence range of 11.20?11.28 J/cm(2), scanning speed range of 224?240 mm/s, and scanning spacing range of 1.50?1.55 mu m. The obtained removal rate has a range of 1620?1628 mu m(3)/s, and the roughness has a range of 5.7?5.8 mu m. The optimal combination of parameters includes a laser fluence of 11.20 J/cm(2), scanning speed of 234 mm/s, and scanning spacing of 1.50 mu m. The morphologies and mechanical properties of the removed epoxy resin samples before and after process optimization also confirm the feasibility of the method. These study results have important research value and significance for the efficient removal of epoxy resin via laser ablation and the development of nondestructive testing methods for electronic components.
Keyword ：
central composite design central composite design response surface methodology response surface methodology epoxy resin epoxy resin laser technique laser technique non-destructive ablation non-destructive ablation
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| GB/T 7714 | Wang, Guanqiang , Lin, Zhenyuan , Sun, Weigao et al. Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology [J]. | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2024 , 51 (24) . |
| MLA | Wang, Guanqiang et al. "Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology" . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG 51 . 24 (2024) . |
| APA | Wang, Guanqiang , Lin, Zhenyuan , Sun, Weigao , Ji, Lingfei . Optimization of Laser Ablation Process of Epoxy Resin by Response Surface Methodology . | CHINESE JOURNAL OF LASERS-ZHONGGUO JIGUANG , 2024 , 51 (24) . |
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Abstract ：
Ultrafast laser lift-off is an important step in manufacturing flexible electronic display devices. To improve the picosecond laser lift-off transfer quality of micro light emitting diodes (micro-LEDs), the response surface methodology (RSM) is employed for the optimization of multiple laser processing parameters, including laser power, scanning speed, spot diameter, and scanning distance. Transfer yield and residual stress are chosen as the performance evaluation metrics, as well as the lifted-off device element composition and transfer quality under different process parameters are characterized. The optimized maximum transfer yield is 95.84% and the minimum residual tensile stress is 0.589 GPa, which is less than 0.5% prediction error of the optimum transfer yield (95.67-95.74%) and residual stress (0.588-0.592 GPa) for ultrafast laser lift-off of micro-LEDs based on the central composite design of RSM, indicating the reliable guidance ability of this model. It develops a new way for quality improvement of the ultrafast laser lift-off process for micro-LEDs.
Keyword ：
micro-LED micro-LED Ultrafast laser Ultrafast laser laser transfer laser transfer response surface methodology response surface methodology
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| GB/T 7714 | Sun, Weigao , Wang, Guanqiang , Ji, Lingfei et al. Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs [J]. | MATERIALS AND MANUFACTURING PROCESSES , 2024 , 40 (4) : 567-578 . |
| MLA | Sun, Weigao et al. "Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs" . | MATERIALS AND MANUFACTURING PROCESSES 40 . 4 (2024) : 567-578 . |
| APA | Sun, Weigao , Wang, Guanqiang , Ji, Lingfei , Lin, Zhenyuan . Response surface methodology assisted optimization of ultrafast laser lift-off micro-LEDs . | MATERIALS AND MANUFACTURING PROCESSES , 2024 , 40 (4) , 567-578 . |
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Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire are studied experimentally and numerically. Relative brightness and spatial distribution of the filamentary plasma string are characterized by time-resolved luminescence images. The whole filamentary plasma string is composed of a leading plasma string with stronger brightness and a tailing plasma string with weaker brightness. The numerical analysis shows that the different characteristics of filamentary plasma string are related to the two types of spatiotemporal evolution stages. The pivotal role of avalanche ionization for different spatiotemporal evolution stages is revealed. The filamentary plasma string induced by single pulse has a guiding significance for the subsequent pulse nonlinear propagation and the material modification; all the above provides basic information for the multi-pulse filamentation and the laser-induced filamentation processing of sapphire.
Keyword ：
Nonlinear ionization Nonlinear ionization Picosecond laser Picosecond laser Spatiotemporal evolution Spatiotemporal evolution Filamentary plasma string Filamentary plasma string Sapphire Sapphire
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| GB/T 7714 | Yan, Tianyang , Ji, Lingfei , Sun, Weigao . Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire [J]. | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING , 2022 , 128 (1) . |
| MLA | Yan, Tianyang et al. "Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire" . | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING 128 . 1 (2022) . |
| APA | Yan, Tianyang , Ji, Lingfei , Sun, Weigao . Characteristics and formation mechanism of filamentary plasma string induced by single picosecond laser pulse in sapphire . | APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING , 2022 , 128 (1) . |
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Abstract ：
Laser-induced backside wet etching is a promising technology to process sapphire substrate. However, the conventional working media including toxic organic and heavy metal salt solutions is not environmentally friendly. In this paper, the backside wet etching of sapphire substrate with ink as a working solution by laser induced carbothermal reduction is achieved. Raman and XRD analyses demonstrate that ink can provide a stable carbon source and the carbothermal reduction of sapphire occurs during the etching. Numerical calculation reveals that the deposition of the carbon layer plays a crucial role in heating the sapphire to the temperature triggering the carbothermal reduction. The grooves etched by the laser-induced carbothermal reduction have smooth walls and good shape reproducibility. The linearly increase in etching depth with pulse number at the same laser fluence. The high-quality etching based on the carbothermal reduction as the etching mechanism is beneficial for fabricating microstructures on sapphire.
Keyword ：
Carbon deposition Carbon deposition Backside wet etching Backside wet etching Carbothermal reduction Carbothermal reduction Sapphire Sapphire
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| GB/T 7714 | Yan, Tianyang , Ji, Lingfei , Hong, Minghui . Backside wet etching of sapphire substrate by laser-induced carbothermal reduction [J]. | OPTICS AND LASER TECHNOLOGY , 2022 , 149 . |
| MLA | Yan, Tianyang et al. "Backside wet etching of sapphire substrate by laser-induced carbothermal reduction" . | OPTICS AND LASER TECHNOLOGY 149 (2022) . |
| APA | Yan, Tianyang , Ji, Lingfei , Hong, Minghui . Backside wet etching of sapphire substrate by laser-induced carbothermal reduction . | OPTICS AND LASER TECHNOLOGY , 2022 , 149 . |
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Abstract ：
<正>激光制造技术，是一种基于激光与物质相互作用的先进制造手段，具有低成本、高精度、高自由度等特点。通过调控加工模式和参数，激光加工可以实现二维或三维跨尺度微纳结构的控型制造或功能材料的控性制备，突破了传统制造方法在空间和时间上的局限性。近年来，激光制造技术逐渐向“设计-制造-器件”一体化方向发展，在物联网、人工智能、医疗器械、航空航天、生物制造等多个前沿科学领域展现出新的应用前景。本专题主要从方法和应用两个方面介绍激光制造技术的现状与发展趋势。
Keyword ：
激光制造技术 激光制造技术 飞秒激光 飞秒激光 微纳制造 微纳制造
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| GB/T 7714 | 徐凯臣 , 季凌飞 , 吴志刚 . 激光制造技术与新应用专题导读 [J]. | 光电工程 , 2022 , 49 (02) : 5-6 . |
| MLA | 徐凯臣 et al. "激光制造技术与新应用专题导读" . | 光电工程 49 . 02 (2022) : 5-6 . |
| APA | 徐凯臣 , 季凌飞 , 吴志刚 . 激光制造技术与新应用专题导读 . | 光电工程 , 2022 , 49 (02) , 5-6 . |
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Abstract ：
采用脉宽为10 ps、频率为200 kHz、波长为1064 nm的皮秒激光在硅表面扫描会自成形微孔结构，通过改变脉冲能量密度、扫描速度和扫描次数，实验研究了微孔的演变规律。结果表明：不同参数对微孔的影响可以归纳为脉冲能量密度和单位面积内有效脉冲数。随着脉冲能量密度的增加，微孔逐渐向沟槽两侧移动，由初始的随机排列演变成一维线性均匀排列；随着单位面积内有效脉冲数的增加，边缘两侧微孔数量由少变多，尺寸由小变大，最终消失。通过模拟温度场分析了不同温度下材料相变和表面张力的变化，发现在表面张力的驱动下液相硅凝固形成凸起，凸起导致激光能量不均匀沉积，最终形成微孔。这表明微孔自成形的物理机理为激光诱导材料相...
Keyword ：
皮秒激光扫描 皮秒激光扫描 自成形 自成形 微孔结构 微孔结构 激光光学 激光光学 硅 硅
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| GB/T 7714 | 李鑫 , 张彤 , 季凌飞 et al. 皮秒激光扫描硅材料微孔自成形行为及机理研究 [J]. | 激光与光电子学进展 , 2022 , 59 (01) : 233-240 . |
| MLA | 李鑫 et al. "皮秒激光扫描硅材料微孔自成形行为及机理研究" . | 激光与光电子学进展 59 . 01 (2022) : 233-240 . |
| APA | 李鑫 , 张彤 , 季凌飞 , 张犁天 . 皮秒激光扫描硅材料微孔自成形行为及机理研究 . | 激光与光电子学进展 , 2022 , 59 (01) , 233-240 . |
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Abstract ：
具有深微孔结构的铌酸锂晶体可以成为具有优良光波选择性调制功能的光子晶体器件。然而，目前使用的聚焦离子束刻蚀、化学刻蚀或常规激光制孔等方法很难获得光子晶体所需的高深径比微孔。本文基于飞秒脉冲高峰值功率、超短脉宽的基本特点，通过对光束进行贝塞尔整形以及对光束与铌酸锂晶体的相互作用进行调控和研究，用飞秒单脉冲在铌酸锂晶体内部一步制备出深径比约为700∶1的大面积均匀微孔阵列。测试结果表明，设计并制备的高深径比微孔阵列光子晶体结构对450～510 nm波长范围内的光束具有明显的选择透过性。
Keyword ：
超快激光 超快激光 激光技术 激光技术 贝塞尔光束 贝塞尔光束 光子晶体 光子晶体 深径比 深径比 铌酸锂 铌酸锂
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| GB/T 7714 | 孙伟高 , 季凌飞 , 郑锦灿 et al. 飞秒贝塞尔光束直写铌酸锂高深径比光子晶体结构 [J]. | 中国激光 , 2022 , 49 (10) : 151-159 . |
| MLA | 孙伟高 et al. "飞秒贝塞尔光束直写铌酸锂高深径比光子晶体结构" . | 中国激光 49 . 10 (2022) : 151-159 . |
| APA | 孙伟高 , 季凌飞 , 郑锦灿 , 温亚楠 , 王冠强 . 飞秒贝塞尔光束直写铌酸锂高深径比光子晶体结构 . | 中国激光 , 2022 , 49 (10) , 151-159 . |
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Nanogrooves with a minimum feature size down to 30 nm (lambda/26) can be formed directly on silicon surface by irradiation from two orthogonal polarized 1064 nm/10 ns fiber laser beams. The creation of such small nanogrooves is attributed to surface thermal stress during resolidification and supercooling with the double laser beams' irradiation. By varying the pulse number and laser fluence, the feature size of narrow grooves on silicon surface can be tuned. The experimental results and numerical calculation of surface thermal behaviors indicated that the high repetition rate of the nanosecond laser leads to the incubation effect and different silicon optical and thermal properties during laser irradiation. Resolution on this scale should be attractive in nanolithography, particularly considering that this method is available in far field and in ambient air.
Keyword ：
thermal stress thermal stress nanocreation nanocreation nanosecond laser nanosecond laser silicon silicon
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| GB/T 7714 | Lin, Zhenyuan , Ji, Lingfei , Hong, Minghui . Approximately 30 nm Nanogroove Formation on Single Crystalline Silicon Surface under Pulsed Nanosecond Laser Irradiation [J]. | NANO LETTERS , 2022 , 22 (17) : 7005-7010 . |
| MLA | Lin, Zhenyuan et al. "Approximately 30 nm Nanogroove Formation on Single Crystalline Silicon Surface under Pulsed Nanosecond Laser Irradiation" . | NANO LETTERS 22 . 17 (2022) : 7005-7010 . |
| APA | Lin, Zhenyuan , Ji, Lingfei , Hong, Minghui . Approximately 30 nm Nanogroove Formation on Single Crystalline Silicon Surface under Pulsed Nanosecond Laser Irradiation . | NANO LETTERS , 2022 , 22 (17) , 7005-7010 . |
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