In　this　work,　a　silver-capsuled　composite　particle　at　micro-size　has　been　facilely　developed　for　electrostatic　patterning　of　copper　layers　on　flexible　substrates,　with　high　performance　across　manufacturing　scalability,　printing　resolution　and　speed,　and　production　affordability　to　end　users.　Herein,　we　launched　a　capping　method　for　designing　the　particle　as　decorated　with　PVP　capped　silver　ion　as　catalytic　precursor　all　in　one　wet　environment,　in　which　the　catalytic　ion　is　successfully　reduced　and　uniformly　distributed　when　mixed　with　the　primary　particle.　In　further　combination　with　an　air　plasma　treatment　on　the　surface　of　a　flexible　polyimide　film,　the　toner　particle　can　be　successfully　electrostatically　developed　and　fused　onto　the　substrates　with　retained　lateral　printing　quality.　We　disclose　a　process　of　passing　the　patterned　substrates　through　a　gentle　exposure　to　a　sulfur　acid　solution　for　promoting　electroless　deposition　of　copper　layer.　The　obtained　copper　tracks　have　electrical　conductivity　of　similar　to　10(-)Omega　cm　with　controllable　thickness　up　to　about　40　mu　m,　which　is　feasible　for　applications　in　wearable　electronics,　embedded　systems,　and　implanted　biomedical　devices.　(C)　2016　Elsevier　Ltd.　All　rights　reserved.