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Author:

Tian, Hui (Tian, Hui.) | Wang, Yi (Wang, Yi.) | Ma, Lin (Ma, Lin.) | Liu, Min (Liu, Min.) | Suo, Hongli (Suo, Hongli.) (Scholars:索红莉)

Indexed by:

Scopus SCIE

Abstract:

Texture and microstructure evolution during recrystallization of a heavily cold-rolled Ni9W alloy were investigated using x-ray diffraction and electron back-scattered diffraction. Brass, S and random orientations dominated the recrystallization process because the fractions of cube, Copper, and Goss orientations were low. Nearly all of the Brass and a part of the S orientation were consumed during recrystallization. Some of the S orientation was recrystallized grains, which grew during annealing and remained after the primary recrystallization. A large number of grains with other random orientations were formed as they had a significant size and fraction advantage during recrystallization. The evolution of microstructure and texture during recrystallization demonstrated that the cube grains did not have a size advantage compared with the noncube grains, which lead to the formation of a rough recrystallization cube texture in the Ni9W alloy after annealing.

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Author Community:

  • [ 1 ] [Tian, Hui]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Wang, Yi]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Ma, Lin]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Liu, Min]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Suo, Hongli]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 6 ] [Tian, Hui]Tsinghua Univ, Dept Thermal Engn, Beijing 100084, Peoples R China

Reprint Author's Address:

  • 索红莉

    [Suo, Hongli]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

JOURNAL OF MATERIALS RESEARCH

ISSN: 0884-2914

Year: 2016

Issue: 16

Volume: 31

Page: 2438-2444

2 . 7 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:305

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 5

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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