The　potential　of　Zn4Al3Mg-xIn　alloys　to　replace　Pb-containing　solders　by　high-temperature　soldering　was　studied.　The　microstructure,　thermal　behavior,　and　wettability　of　Zn4Al3Mg-xIn　solders　were　investigated　by　scanning　electron　microscopy,　X-ray　diffraction,　differential　scanning　calorimetry　(DSC),　and　spreading　tests.　The　influence　of　In　content　on　the　microstructure　and　characteristics　of　the　solders　was　explored.　Small　additions　of　In　result　in　grain　boundary　segregation　because　of　the　limited　solid　solubility　of　In　in　other　phases,　and　thereby　lead　to　more　complicated　microstructure　of　Zn4Al3Mg-xIn　alloys.　DSC　measurements　showed　that　the　onset　of　melting　of　the　Zn4Al3Mg-xIn　alloys　decreased　with　increasing　In　content,　while　the　melting　peak　became　broader.　The　electrical　conductivity　values　of　ZnAlMg-xIn　solders　were　of　the　same　order　of　magnitude　as　those　of　a　conventional　Pb-5(wt%)Sn　solders.　The　wettability　of　Zn4Al3Mg-xIn　solders　over　Cu　substrate　was　also　improved　with　increasing　In　content.