Nanopastes　based　on　noble　metals　for　low　temperature　bonding　are　currently　of　great　interest.　We　have　developed　Ag　nanowire　and　nanoplate　composite　paste.　Copper-copper　joining　has　been　achieved　using　solid　state　sintering　of　nanopastes.　We　show　that　an　enhanced　bonding　strength　can　be　achieved　by　integrating　Ag　nanoplates　into　Ag　nanowire　pastes.　Ag　nanowire　and　nanoplate　composite　pastes　are　capable　of　being　a　low-temperature　interconnect　material　potentially　for　interconnection　in　lead-free　microcircuits,　flexible　electronic　packaging　and　sensing　applications.