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Author:

Wang, Yuezong (Wang, Yuezong.) | Ma, Guodong (Ma, Guodong.) | Zhang, Chenchen (Zhang, Chenchen.)

Indexed by:

EI Scopus SCIE

Abstract:

An electromagnetic-driven microgripper is designed for the automatic process of gripping micro-coil wire under the guidance of Stereo Light Microscope (SLM) visual system. The diameter of the wire is about 50-70 mu m. Stress analyze with the ANSYS simulation software helps to obtain stress and safety factor contours of the upper and lower clamp arm when the microgripper grips wires. Simulation results show the correctness and reliability of the design. The microgripper clamping force is up to 0.9 N by theoretical calculation. Test results show that this gripper achieves a displacement of 1.1 mm. Functional test for the wire traction microgripper has been done under the guidance of SLMvisual system. The wire traction microgripper is placed in three-dimensional platform, and the three-dimensional platform moves microgripper in the SLM object space close to the clamped object. Positioning accuracy error is determined by repeated positioning precision experiments on three-dimensional platform by the laser displacement sensor. Automatic process of gripping the micro-coil wire is observed and recorded in the SLM visual system to verify performance of the microgripper structure design.

Keyword:

stress analysis Electromagnetic-driven ANSYS simulation microgripper

Author Community:

  • [ 1 ] [Wang, Yuezong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Ma, Guodong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang, Chenchen]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Ma, Guodong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF APPLIED ELECTROMAGNETICS AND MECHANICS

ISSN: 1383-5416

Year: 2015

Issue: 2

Volume: 47

Page: 389-397

0 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

ESI HC Threshold:174

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 6

SCOPUS Cited Count: 4

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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