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Author:

Li, Guodong (Li, Guodong.) | Li, Zhuoxin (Li, Zhuoxin.) | Li, Hui (Li, Hui.) | Shi, Yaowu (Shi, Yaowu.)

Indexed by:

EI Scopus SCIE

Abstract:

A novel Er-doped Mg-Zn-Al solder was developed by using ultrasonic vibration technology. The inclusions in the solder were analyzed. The microstructure of the solder and its soldering lap joint was investigated, and the shear strength of the joint was measured. It was found that the inclusions in the solder decreased greatly, the alpha-Mg phase and Al3Er compound were broken up into granular structure after ultrasonic vibration treatment. The alpha-Mg phase and Al3Er compound in the soldered joint showed similar structure as that of the original solder. The average shear strength of the soldered joints by using the ultrasonic treated filler metal was almost 1.25 times as large as that soldered by the traditional one. (C) 2014 Elsevier B.V. All rights reserved.

Keyword:

Microstructure Ultrasonic treatment Magnesium alloy solder Mechanical property Inclusions

Author Community:

  • [ 1 ] [Li, Guodong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Li, Zhuoxin]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Li, Hui]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Shi, Yaowu]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Li, Guodong]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

MATERIALS LETTERS

ISSN: 0167-577X

Year: 2014

Volume: 136

Page: 59-62

3 . 0 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:341

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 6

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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