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Author:

Song, M. (Song, M..) | Du, K. (Du, K..) | Wen, S. P. (Wen, S. P..) | Nie, Z. R. (Nie, Z. R..) (Scholars:聂祚仁) | Ye, H. Q. (Ye, H. Q..)

Indexed by:

EI Scopus SCIE

Abstract:

Using in situ transmission electron microscopy and electron tomography, we have studied the healing process of submicron-scale voids embedded in a cold-rolled Al-Mg-Er alloy. The results show that voids are healed successfully within 50 min at a relatively low temperature of 453 K. Quantitative analysis of the in situ micrographs reveals that the void-healing process involves several stages: an initial fast-healing stage, then a slow-healing stage, and finally a rapid healing near the end. The different healing rates are likely related to varying surface curvatures due to the evolution of void geometry during the healing process. Because the voids are embedded inside Al alloy grains, lattice diffusion is considered to dominate the entire healing process. Mg enrichment was observed at the healed voids immediately after the healing. This indicates that the faster diffusion of Mg atoms in the Al matrix enhances void healing in the Al-Mg-Er alloy. Post-mortem experiments verify that voids in bulk cold-rolled Al-Mg-Er alloy can also be healed by 1 h of annealing at 473 K, consistent with the in situ experiments. The fatigue crack growth resistance and plasticity of the cold-rolled Al alloy are improved significantly after annealing at 473 K. (C) 2014 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Keyword:

Al-Mg-Er alloy In situ Electron tomography Transmission electron microscopy (TEM) Void healing

Author Community:

  • [ 1 ] [Song, M.]Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
  • [ 2 ] [Du, K.]Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
  • [ 3 ] [Ye, H. Q.]Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China
  • [ 4 ] [Wen, S. P.]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100022, Peoples R China
  • [ 5 ] [Nie, Z. R.]Beijing Univ Technol, Sch Mat Sci & Engn, Beijing 100022, Peoples R China

Reprint Author's Address:

  • [Du, K.]Chinese Acad Sci, Inst Met Res, Shenyang Natl Lab Mat Sci, Shenyang 110016, Peoples R China

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Source :

ACTA MATERIALIA

ISSN: 1359-6454

Year: 2014

Volume: 69

Page: 236-245

9 . 4 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:341

JCR Journal Grade:1

CAS Journal Grade:1

Cited Count:

WoS CC Cited Count: 28

SCOPUS Cited Count: 29

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 4

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