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Author:

Guo, Shi-Jun (Guo, Shi-Jun.) | Yang, Qing-Sheng (Yang, Qing-Sheng.) (Scholars:杨庆生) | He, X. Q. (He, X. Q..) | Liew, K. M. (Liew, K. M..)

Indexed by:

EI Scopus SCIE

Abstract:

Molecular dynamics (MD) method was used to study mechanical properties of copper-graphite composite interface. Mode I fracture of the interface of copper-graphite composite was modeled by considering fixed and free boundary conditions, which means slipping constraint conditions for atomic layers in the composite. The stress near crack tip and the energy changes of the system are obtained. Then a cohesive traction-separation law of copper-graphite interface can also be obtained by using the MD simulation. For the purpose of comparisons, a modeling of interfacial fracture of the composite by using a zero-thickness cohesive finite element (CFE) was carried out. It is found that there is a stress concentration but no singularity for the normal stress at the crack tip in interface obtained by using the present MD simulation and CFE method. While in the interface away from the crack tip, the obtained stress is consistent with the solution of classical interfacial fracture mechanics. (C) 2013 Published by Elsevier Ltd.

Keyword:

Metal-matrix composites Interface Fracture Nano-structures MD simulation

Author Community:

  • [ 1 ] [Guo, Shi-Jun]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China
  • [ 2 ] [Yang, Qing-Sheng]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China
  • [ 3 ] [He, X. Q.]City Univ Hong Kong, Dept Civil & Architectural Engn, Kowloon, Hong Kong, Peoples R China
  • [ 4 ] [Liew, K. M.]City Univ Hong Kong, Dept Civil & Architectural Engn, Kowloon, Hong Kong, Peoples R China

Reprint Author's Address:

  • [He, X. Q.]City Univ Hong Kong, Dept Civil & Architectural Engn, Tat Chee Ave, Kowloon, Hong Kong, Peoples R China

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Source :

COMPOSITES PART B-ENGINEERING

ISSN: 1359-8368

Year: 2014

Volume: 58

Page: 586-592

1 3 . 1 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

ESI HC Threshold:341

JCR Journal Grade:1

CAS Journal Grade:2

Cited Count:

WoS CC Cited Count: 42

SCOPUS Cited Count: 44

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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