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Author:

Pei, Mingde (Pei, Mingde.) | Wang, Bo (Wang, Bo.) (Scholars:王波) | Tang, Yunhui (Tang, Yunhui.) | Song, Xuemei (Song, Xuemei.) | Yan, Hui (Yan, Hui.) | Zhang, Xiaoxue (Zhang, Xiaoxue.)

Indexed by:

EI Scopus SCIE

Abstract:

Superhydrophobic copper films with hierarchically sandbeach-like morphologies were grown on Si substrates using direct current (DC) sputtering. After the surfaces were hydrophobized with 1-Octadecanethiol (ODT), the surfaces became superhydrophobic. The substrate temperature during sputtering played a key role in the formation of the surface morphology. The films exhibited long-term stability in the temperature range of 25 to 100 degrees C. The underwater stability of the surfaces was also characterized by studying the water contact behavior on the immersed surfaces under different static pressures. After immersion in different depth in water, the film surfaces changed from superhydrophobic even to superhydrophilic, due to the water trapped in the surface structures. A model was proposed to explain such change in the surface wettability. (C) 2013 Elsevier B. V. All rights reserved.

Keyword:

Superhydrophobicity Sputtering Contact angle Copper

Author Community:

  • [ 1 ] [Pei, Mingde]Beijing Univ Technol, Dept Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Wang, Bo]Beijing Univ Technol, Dept Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Tang, Yunhui]Beijing Univ Technol, Dept Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Song, Xuemei]Beijing Univ Technol, Dept Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Yan, Hui]Beijing Univ Technol, Dept Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 6 ] [Zhang, Xiaoxue]Tampere Univ Technol, Dept Mat Sci, Lab Ceram Mat, FI-33101 Tampere, Finland
  • [ 7 ] [Zhang, Xiaoxue]UCL, Dept Chem, London WC14 0AJ, England

Reprint Author's Address:

  • 王波

    [Wang, Bo]Beijing Univ Technol, Dept Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

THIN SOLID FILMS

ISSN: 0040-6090

Year: 2013

Volume: 548

Page: 313-316

2 . 1 0 0

JCR@2022

ESI Discipline: MATERIALS SCIENCE;

JCR Journal Grade:2

CAS Journal Grade:3

Cited Count:

WoS CC Cited Count: 8

SCOPUS Cited Count: 9

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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