• Complex
  • Title
  • Keyword
  • Abstract
  • Scholars
  • Journal
  • ISSN
  • Conference
搜索

Author:

Xia, Guofeng (Xia, Guofeng.) | Qin, Fei (Qin, Fei.) (Scholars:秦飞) | Gao, Cha (Gao, Cha.) | An, Tong (An, Tong.) | Zhu, Wenhui (Zhu, Wenhui.)

Indexed by:

EI Scopus SCIE

Abstract:

A design of experiment (DOE) methodology based on numerical simulation is presented to improve thermal fatigue reliability of multirow quad flat nonlead (QFN) packages. In this method, the influences of material properties, structural geometries, and temperature cycling profiles on thermal fatigue reliability are evaluated, a L-27(3(8)) orthogonal array is built based on Taguchi method to figure out optimized factor combination design for promoting thermal fatigue reliability. Analysis of variance (ANOVA) is carried out to examine the influence of factors on the thermal fatigue reliability and to find the significant factors. Anand constitutive model is adopted to describe the viscoplastic behavior of lead-free solder Sn3.0Ag0.5Cu. The stress and strain in solder joints under temperature cycling are studied by 3D finite element (FE) model. The modified Coffin-Manson model is employed to predict the fatigue life of solder joints. Results indicate that the coefficients of thermal expansion (CTE) of printed circuit board (PCB), the height of solder joint, and CTE of epoxy molding compound (EMC) have critical influence on thermal fatigue life of solder joints. The fatigue life of multirow QFN package with original design is 767 cycles, which can be substantially improved by 5.43 times to 4165 cycles after the optimized factor combination design based on the presented method.

Keyword:

DOE numerical simulation electronics package thermal fatigue life

Author Community:

  • [ 1 ] [Xia, Guofeng]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 2 ] [Qin, Fei]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 3 ] [Gao, Cha]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 4 ] [An, Tong]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China
  • [ 5 ] [Zhu, Wenhui]Tianshui Hua Tian Technol Co Ltd, Packaging Technol Res Inst, Tianshui 741000, Peoples R China

Reprint Author's Address:

  • [Xia, Guofeng]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Beijing 100124, Peoples R China

Email:

Show more details

Related Keywords:

Related Article:

Source :

JOURNAL OF ELECTRONIC PACKAGING

ISSN: 1043-7398

Year: 2013

Issue: 4

Volume: 135

1 . 6 0 0

JCR@2022

ESI Discipline: ENGINEERING;

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 4

SCOPUS Cited Count: 5

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 7

Online/Total:406/10596295
Address:BJUT Library(100 Pingleyuan,Chaoyang District,Beijing 100124, China Post Code:100124) Contact Us:010-67392185
Copyright:BJUT Library Technical Support:Beijing Aegean Software Co., Ltd.