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Author:

Guo Chun-Sheng (Guo Chun-Sheng.) | Wan Ning (Wan Ning.) | Ma Wei-Dong (Ma Wei-Dong.) | Zhang Yan-Feng (Zhang Yan-Feng.) | Xiong Cong (Xiong Cong.) | Feng Shi-Wei (Feng Shi-Wei.) (Scholars:冯士维)

Indexed by:

EI Scopus SCIE PKU CSCD

Abstract:

For avoiding the invalid acceleration experiments caused by the changes of the failure mechanism, the relationship of the failure mechanism consistency and the parameters of degradation data distribution in the early stage under different accelerated stress levels has been derived. Conditions for judging the failure mechanism consistency are also given as follows: firstly, the shape parameters of failure distribution has a uniform distribution m(i) = m, i = 1,2,3, . . . ; secondly, the dimension parameter eta(i) follows the equation eta(i) = AF(i).eta. A method to rapidly discriminate the consistency of failure mechanism under different experimental stresses in the early stage was obtained, and the invalid acceleration experiments caused by the changes of the failure mechanism could be avoided. Finally, theoretical degenerate data in the early stage of the accelerated test and the initial degenerate data of the MCM thick-film resistor were used for estimating, Weibull distribution parameter, and the consistency of failure mechanism degradation was also judged.

Keyword:

failure mechanism consistency Weibull distribution constant temperature stress accelerated test

Author Community:

  • [ 1 ] [Guo Chun-Sheng]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Wan Ning]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Ma Wei-Dong]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Zhang Yan-Feng]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Xiong Cong]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 6 ] [Feng Shi-Wei]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing 100124, Peoples R China

Reprint Author's Address:

  • [Guo Chun-Sheng]Beijing Univ Technol, Coll Elect Informat & Control Engn, Beijing 100124, Peoples R China

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Source :

ACTA PHYSICA SINICA

ISSN: 1000-3290

Year: 2013

Issue: 6

Volume: 62

1 . 0 0 0

JCR@2022

ESI Discipline: PHYSICS;

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 1

SCOPUS Cited Count: 13

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 9

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