We　synthesized　an　epoxy　matrix　composite　adhesive　containing　aluminum　nitride　(AlN)　powder,　which　was　used　for　thermal　interface　materials　(TIM)　in　high　power　devices.　The　experimental　results　revealed　that　adding　AlN　fillers　into　epoxy　resin　was　an　effective　way　to　boost　thermal　conductivity　and　maintain　electrical　insulation.　We　also　discovered　a　proper　coupling　agent　that　reduced　the　viscosity　of　the　epoxy-AlN　composite　by　AlN　surface　treatment　and　increased　the　solid　loading　to　60　vol　%.　For　the　TIM　sample　made　with　the　composite　adhesive,　we　obtained　a　thermal　conductivity　of　2.70　W/(m　K),　which　was　approximately　13　times　larger　than　that　of　pure　epoxy.　The　dielectric　strength　of　the　TIM　was　10　to　11　kV/mm,　which　was　large　enough　for　applications　in　high　power　devices.　Additionally,　the　thermal　and　insulating　properties　of　the　TIM　did　not　degrade　after　thermal　shock　testing,　indicating　its　reliability　for　use　in　power　devices.　(C)　2011　Wiley　Periodicals,　Inc.　J　Appl　Polym　Sci,　2012