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Author:

Zhang, Qiang (Zhang, Qiang.) | Yang, Qing-Sheng (Yang, Qing-Sheng.) (Scholars:杨庆生)

Indexed by:

EI Scopus SCIE

Abstract:

Shape memory polymers (SMPs) are a novel class of shape memory materials which can store a deformed (temporary) shape and recover an original (permanent) shape under a shape memory thermomechanical loading-unloading cycle. The deformation mechanisms of SMPs are very complicated, but the SMPs also have a lot of advantages and the widespread application value and prospect. So developing proper constitutive models that describe thermomechanical properties of SMPs and the shape memory effect is very challenging and of great theoretical and application value. Based on the deformation mechanisms and considerable experimental investigations of SMPs, researchers have developed many constitutive models. This article investigates the deformation mechanism and introduces the recent research advance of the constitutive models of thermal-sensitive SMPs. Special emphases are given on the micromechanical constitutive relations in which the deformation is considered being based on the microstructure of the SMPs. Finally, the lack of research and prospects for further research are discussed. (C) 2011 Wiley Periodicals, Inc. J Appl Polym Sci 123: 1502-1508, 2012

Keyword:

stimuli-sensitive polymers thermomechanical properties constitutive modeling

Author Community:

  • [ 1 ] [Zhang, Qiang]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Numer Simulat Ctr Engn, Beijing, Peoples R China
  • [ 2 ] [Yang, Qing-Sheng]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Numer Simulat Ctr Engn, Beijing, Peoples R China

Reprint Author's Address:

  • 杨庆生

    [Yang, Qing-Sheng]Beijing Univ Technol, Coll Mech Engn & Appl Elect Technol, Numer Simulat Ctr Engn, Beijing, Peoples R China

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Source :

JOURNAL OF APPLIED POLYMER SCIENCE

ISSN: 0021-8995

Year: 2012

Issue: 3

Volume: 123

Page: 1502-1508

3 . 0 0 0

JCR@2022

ESI Discipline: CHEMISTRY;

JCR Journal Grade:2

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 32

SCOPUS Cited Count: 33

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 6

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