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Author:

王佩 (王佩.) | 林平分 (林平分.)

Indexed by:

CQVIP

Abstract:

针对SoC设计中IP核复用问题提出了一种高性能VCI/AMBA AHB封装电路的前端设计方法.通过对两种标准的功能和时序分析比较得出设计方案后,使用硬件描述语言实现功能,并通过搭建测试环境进行验证,仿真结果表明符合设计要求.在TSMC 0.13μm工艺下对电路进行综合,综合后时序、面积、功耗均达到了很好的优化.

Keyword:

片上系统 AHB总线 VCI标准 封装电路

Author Community:

  • [ 1 ] [王佩]北京工业大学
  • [ 2 ] [林平分]北京工业大学

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Source :

微处理机

ISSN: 1002-2279

Year: 2009

Issue: 5

Volume: 30

Page: 16-19,23

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 1

Chinese Cited Count:

30 Days PV: 13

Affiliated Colleges:

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