The　motivation　of　this　study　is　tried　to　explore　the　relationship　between　resistance　changes　and　microstructure　evolution　of　eutectic　SnBi　solder　joints　under　10(4)　A/cm(2)　of　current　density　and　50　A　degrees　C　of　ambient　temperature.　A　novel　type　of　one-dimensional　solder　joints　was　employed　to　achieve　a　true　uniform　distribution　of　current　density,　and　a　real-time　data　acquisition　system　was　employed　to　investigate　the　voltage　changes　of　the　eutectic　SnBi　solder　joints　during　electromigration　process.　This　study　suggested　that　the　resistance　remained　initially　due　to　the　interaction　between　coarsened　phase　and　Joule　heating　effect,　and　then　increased　due　to　the　formation　of　continuous　Bi-rich　phase　at　anode　interface,　finally　remained　again　due　to　the　phase　segregation　of　Bi-　and　Sn-rich　phases.