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Author:

Lei, Jun (Lei, Jun.) (Scholars:雷钧) | Zhang, Chuanzeng (Zhang, Chuanzeng.) | Yang, Qingsheng (Yang, Qingsheng.) (Scholars:杨庆生) | Wang, Yue-Sheng (Wang, Yue-Sheng.)

Indexed by:

EI Scopus SCIE

Abstract:

The shielding and amplification effects of multiple inclusions and microcracks on the tip or the growth path of a main crack under dynamic loading are investigated using numerical simulations. The simulations employ a combined numerical tool based on the time-domain boundary element method together with the sub-region technique for multi-regions, the maximum circumferential stress criterion for crack-growth direction and discrete modelling for the crack propagation. New elements of constant length are added to the moving crack-tip to simulate the growth at an adaptable time-step according to the crack propagation criterion. Of particular interest is the study of the effects of the sizes and positions of inclusions and microcracks and the material combinations on the dynamic stress intensity factors and the crack growth path. The numerical results demonstrate the crack-tip shielding and amplification effects of inclusions and micro-cracks.

Keyword:

Time-domain boundary element method Microcracks Dynamic crack problems Inclusions Shieldingand amplification effects

Author Community:

  • [ 1 ] [Lei, Jun]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China
  • [ 2 ] [Yang, Qingsheng]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang, Chuanzeng]Univ Siegen, Dept Civil Engn, D-57068 Siegen, Germany
  • [ 4 ] [Wang, Yue-Sheng]Beijing Jiaotong Univ, Inst Engn Mech, Beijing 100044, Peoples R China

Reprint Author's Address:

  • 雷钧

    [Lei, Jun]Beijing Univ Technol, Dept Engn Mech, Beijing 100124, Peoples R China

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Source :

INTERNATIONAL JOURNAL OF FRACTURE

ISSN: 0376-9429

Year: 2010

Issue: 2

Volume: 164

Page: 271-283

2 . 5 0 0

JCR@2022

ESI Discipline: ENGINEERING;

JCR Journal Grade:3

CAS Journal Grade:4

Cited Count:

WoS CC Cited Count: 5

SCOPUS Cited Count: 6

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 11

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