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Abstract：
The microstructures and mechanical properties of SnAgCu+xCo (x=0, 0.1, 0.2, 0.45 and 1.0) composite solder joint were investigated. The effects of Co element on the undercooling degrees and solidifying phases of solder joints were researched by Differential Scanning Calorimetry (DSC). Experimental results indicate that the thicknesses of intermetallic compound layers in SnAgCu+xCo (x=0.1, 0.2) composite solders were thinner than that of the Sn-3.0Ag-0.5Cu solder. After 150 degrees C aging for 500 h, the shear strengths of all SnAgCu+xCo composite solder joints were higher than that of the Sn-3.0Ag-0.5Cu solder joint. It suggests that the Co element could improve the service reliability of SnAgCu solder joint. Besides, Co could increase solder＇s solidifying point and decrease undercooling degrees effectively. In a word, the mechanical properties and service reliabilities of Sn-3.0Ag-0.5Cu-0.2Co composite solder joint is optimal.
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RARE METAL MATERIALS AND ENGINEERING
ISSN： 1002-185X
Year： 2010
Volume： 39
Page： 341-345
0 . 7 0 0
JCR@2022
ESI Discipline： MATERIALS SCIENCE;
JCR Journal Grade：4
CAS Journal Grade：4
Cited Count：
WoS CC Cited Count： 2
SCOPUS Cited Count：
ESI Highly Cited Papers on the List： 0 Unfold All
WanFang Cited Count：
Chinese Cited Count：
30 Days PV： 8
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