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Author:

陈继民 (陈继民.) (Scholars:陈继民)

Indexed by:

CQVIP PKU CSCD

Abstract:

介绍了激光微加工技术的特点,与其它微加工技术相比,激光微加工具有非接触、有选择性加工、热影响区域小、高精度与高重复率等优点,既可以通过去除方式,也可以通过材料堆积进行微加工成型.综述了几种常用的激光微加工技术及其发展趋势,微机电系统(MEMS)技术的进一步成熟,必将带动激光微技术快速发展.

Keyword:

加成 去除 激光微技术 微成型

Author Community:

  • [ 1 ] [陈继民]北京工业大学

Reprint Author's Address:

  • 陈继民

Email:

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Source :

激光与光电子学进展

ISSN: 1006-4125

Year: 2006

Issue: 9

Volume: 43

Page: 25-29

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: 27

Chinese Cited Count:

30 Days PV: 11

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