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Abstract:
无论是环境的要求还是作为竞争的筹码,无铅钎料在表面组装领域中的应用已经是不可回避.然而无铅化仍然存在材料、工艺、设备、系统兼容等问题.在解决材料及电子产品可靠性的同时,无铅产品需要开创我国自己的品牌.
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Source :
家电科技
ISSN: 1672-0172
Year: 2005
Issue: 1
Page: 41-43
Cited Count:
WoS CC Cited Count: 0
SCOPUS Cited Count:
ESI Highly Cited Papers on the List: 0 Unfold All
WanFang Cited Count: 23
Chinese Cited Count:
30 Days PV: 9
Affiliated Colleges: