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Author:

杨柳 (杨柳.) | 宇慧平 (宇慧平.)

Abstract:

  本文基于内聚力模型,使用有限元分析软件ANSYS 对切割过程进行了模拟仿真。结果表明,内聚力(CZM)模型可以很好地模拟切割过程,切割时的最大等效应力发生在与刀尖相接处的切屑处。

Keyword:

仿真分析 内聚力模型(CZM) 芯片

Author Community:

  • [ 1 ] [杨柳]北京工业大学
  • [ 2 ] [宇慧平]北京工业大学

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Source :

Year: 2016

Page: 103-105

Language: Chinese

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count: -1

Chinese Cited Count:

30 Days PV: 6

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