This　paper　uses　the　finite　element　method　to　establish　a　three-dimensional　finite　element　model　of　a　ceramic　column　grid　array　(CCGA)　package　flat　cover　and　T-cover　structure.　The　stress　distribution　of　CCGA　package　sealing　cover　under　three　random　vibration　loads　(acceleration　root　mean　square　values　of　53.5　m/s(2),　92.6　m/s(2),　119.5　m/s(2))　is　analyzed,　and　the　flat　cover　and　T-shaped　cover　are　respectively　determined.　The　dangerous　position　of　the　plate　structure,　the　initial　position　of　the　crack　and　the　crack　propagation.　The　results　show　that　the　flat　cover　plate　is　prone　to　cracks　at　the　four　corners　of　the　interface　between　sealing　cover　and　solder,　and　the　T-shaped　cover　plate　is　liable　to　cracks　in　the　middle　of　the　edge　of　the　interface　between　sealing　cover　and　solder.