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Author:

张成印 (张成印.) | 逄燕 (逄燕.) | 刘赵淼 (刘赵淼.) (Scholars:刘赵淼)

Abstract:

本文采用数值模拟软件CFD-ACE,运用RNGk-ε湍流模型模拟研究了不同传热介质条件情况下微通道热沉的表面温升情况,并比较了不同冷却介质对微通道热沉散热性能的影响。

Keyword:

RNGk-ε湍流模型 表面温升 微通道热沉 数值模拟

Author Community:

  • [ 1 ] 北京工业大学机电学院

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Source :

Year: 2010

Language: Chinese

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 10

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