In　this　paper,　the　effects　ofxGe　(x　=　0,　0.002,　0.005,　0.01%)　on　the　melting　point,　spreadability,　wettability,　microstructure,　and　mechanical　properties　of　Sn-32Pb-18Cd　solder　alloys　were　investigated.　The　experiment　results　showed　that　the　addition　of　Ge　could　increase　the　spreading　area　and　wetting　properties.　The　microstructures　of　solder　alloy　after　reflowing　were　mainly　composed　of　Pb　phase　and　beta-Sn　phases,　and　the　Cd　element　was　distributed　in　the　matrix.　The　addition　of　Ge　could　enhance　the　tensile　strength　and　ductility.　When　the　Ge　content　was　equal　to　0.005%,　the　maximum　elongation　reached　53.70%.