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Author:

Tian Hui (Tian Hui.) | Suo Hong Li (Suo Hong Li.) (Scholars:索红莉) | Liang Ya Ru (Liang Ya Ru.) | Zhao Yue (Zhao Yue.) | Ma Lin (Ma Lin.) | Meng Yi Chen (Meng Yi Chen.) | Grivel, Jean-Claude (Grivel, Jean-Claude.) | Yi Ning (Yi Ning.)

Indexed by:

CPCI-S EI Scopus

Abstract:

Cube texture formation of Cu-33 at.%Ni alloy substartes and CeO2 buffer layer prepared by chemical solution deposition on the textured substrate were investigated by electron back scattered diffraction (EBSD) and XRD technics systematically. The results shown that a strong cube textured Cu-33at.%Ni alloy substrate with the cube texture fraction of 99.8 % (< 10 degrees) was obtained after annealing at 1000 degrees C for 1 h. The full width half maximum (FWHM) values for the X-ray (111) phi-scan and (002) omega-scan in this substrate were 7.31 degrees and 5.51 degrees, respectively. Furthermore, the cube texture fraction of epitaxially grown CeO2 buffer layer was 95 % (<10 degrees), and the FWHM values of phi-scan and omega-scan being 6.98 degrees and 5.92 degrees, respectively.

Keyword:

XRD Cu-33 at.%Ni alloy substages CeO2 buffer layer EBSD Cube texture

Author Community:

  • [ 1 ] [Tian Hui]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Suo Hong Li]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Liang Ya Ru]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Ma Lin]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Meng Yi Chen]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 6 ] [Yi Ning]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China
  • [ 7 ] [Tian Hui]Tech Univ Denmark, Dept Energy Convers & Storage, DK-4000 Roskilde, Denmark
  • [ 8 ] [Zhao Yue]Tech Univ Denmark, Dept Energy Convers & Storage, DK-4000 Roskilde, Denmark
  • [ 9 ] [Grivel, Jean-Claude]Tech Univ Denmark, Dept Energy Convers & Storage, DK-4000 Roskilde, Denmark

Reprint Author's Address:

  • [Tian Hui]Beijing Univ Technol, Coll Mat Sci & Engn, Beijing 100124, Peoples R China

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Source :

ADVANCES IN MATERIALS AND MATERIALS PROCESSING IV, PTS 1 AND 2

ISSN: 1022-6680

Year: 2014

Volume: 887-888

Page: 345-,

Language: English

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 7

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