The　in-situ　measurement　of　the　stress　evolution　at　the　anode　and　cathode　interfaces　of　the　Cu/3.0Ag0.5Cu/Cu　solder　joints　with　current　density　of　4　x　10(3)　A/cm(2)　at　room　temperature　by　X-ray　diffraction　technique　was　investigated.　The　experimental　results　showed　that　the　stress　evolution　at　the　interfaces　was　a　very　complicated　process　during　current　stressing,　which　owed　to　many　influencing　factors　such　as　Joule　heating　effect,　stress　relaxation,　electromigration　force　and　so　on.　After　current　stressing,　the　whiskers　and　hillocks　were　formed　at　the　interface　of　the　anode　side　which　was　as　a　mode　of　relieving　compressive　stress.　It　was　found　that　a　uniform　Cu6Sn5　intermetallic　compound　layer　was　formed　at　the　anode　interface　after　polishing　the　solder　joint.