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Author:

Feng, Shiwei (Feng, Shiwei.) (Scholars:冯士维) | Hu, Peifeng (Hu, Peifeng.) | Zhang, Guangchen (Zhang, Guangchen.) | Guo, Chunsheng (Guo, Chunsheng.) | Xie, Xuesong (Xie, Xuesong.) | Chen, Tangsheng (Chen, Tangsheng.)

Indexed by:

CPCI-S EI Scopus

Abstract:

In this paper, the linear relationship of forward Schottky junction voltage of AlGaN/GaN HEMT with temperature was investigated. It was used as temperature sensitive parameter to determine the channel temperature at its normal working state by fast switch circuit technique. The regress of tested data was used to reduce the scatter error too. The thermal resistance constitution was extracted from the transient heating response curves.

Keyword:

reliability electrical method HEMT channel temperature

Author Community:

  • [ 1 ] [Feng, Shiwei]Beijing Univ Technol, Sch Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 2 ] [Hu, Peifeng]Beijing Univ Technol, Sch Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 3 ] [Zhang, Guangchen]Beijing Univ Technol, Sch Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 4 ] [Guo, Chunsheng]Beijing Univ Technol, Sch Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 5 ] [Xie, Xuesong]Beijing Univ Technol, Sch Elect Informat & Control Engn, Beijing 100124, Peoples R China
  • [ 6 ] [Chen, Tangsheng]Nanjing Elect Device Inst, Nanjing 210016, Peoples R China

Reprint Author's Address:

  • 冯士维

    [Feng, Shiwei]Beijing Univ Technol, Sch Elect Informat & Control Engn, Beijing 100124, Peoples R China

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Source :

26TH ANNUAL IEEE SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM, PROCEEDINGS 2010

ISSN: 1065-2221

Year: 2010

Page: 165-169

Language: English

Cited Count:

WoS CC Cited Count: 9

SCOPUS Cited Count: 11

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 5

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