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Author:

薛河 (薛河.) | 吕涛 (吕涛.) | 史耀武 (史耀武.)

Indexed by:

CQVIP PKU CSCD

Abstract:

利用模拟焊接接头试样三点弯曲试验的方式,就焊接接头强度组配对其断裂性能的影响进行了研究,结果发现:焊接接头强度组配的不同对其断裂韧性和裂纹扩展驱动力都有不同程度的影响.

Keyword:

裂纹尖端张开位移 三点弯曲 断裂韧性 强度组配 裂纹扩展驱动力

Author Community:

  • [ 1 ] 西安交通大学
  • [ 2 ] 北京工业大学

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Source :

西安交通大学学报

Year: 1998

Issue: 11

Page: 3-5

Cited Count:

WoS CC Cited Count: 0

SCOPUS Cited Count:

ESI Highly Cited Papers on the List: 0 Unfold All

WanFang Cited Count:

Chinese Cited Count:

30 Days PV: 13

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