In　this　paper,　the　damage　fracture　of　solder　joints　in　board　level　electronic　package　subjected　to　drop　impact　loadings　was　numerically　simulated　by　the　finite　element　method　and　the　cohesive　zone　model.　The　solder-Cu　pad　interface　was　modeled　by　cohesive　zone　elements.　The　results　show　that　fracture　initiates　at　the　edge　of　the　PCB　side　and　the　damage　of　solder　joint　is　affected　greatly　by　the　used　material　constitutive　model　in　the　simulation.