The　reliability　of　lead　free　electronic　devices　depends　strongly　on　the　reliability　of　the　soldered　joints　while　the　later　one　was　controlled,　mainly,　by　the　formation　and　growth　of　the　interfacial　intermetallic　compounds　(IMCs)　between　the　solder　matrix　and　the　substrates.　The　morphological　features,　microstructural　evolutions　and　growth　kinetics　of　the　IMCs　on　the　interfacial　of　SnAgCu/Cu　soldered　joints,　under　as　soldered　and　isothermal　aging　condition,　were　investigated.　The　three-dimensional　IMCs　feature　was　explored　by　etch　the　solder　matrix　out　of　the　SnAgCu/Cu　interface.　The　phases　of　IMCs　were　identified　by　energy　dispersive　X-ray　(EDX).　The　thickness　of　the　IMCs　was　measured　by　element　mapping　and　phase　constitution　analysis.　The　SnAgCu/Cu　soldered　joints　were　isothermal　aged　at　125C,　150C　and　175C　respectively.　The　corresponding　IMCs　growth　rate　was　formulated　according　to　the　data　from　various　aging　time.　The　growth　kinetic　of　the　IMCs　was　analyzed　in　the　framework　of　diffusion　principles.　The　tensile　strength　of　the　joint　was　evaluated　by　in-situ　tensile　test　and　the　fracture　mechanism　was　analyzed　in　accordingly.　It　was　found　that　Cu6Sn5　was　formed　at　the　solder　and　Cu　interface　during　reflowing.　With　the　increase　of　aging　time,　the　grain　size　of　the　interfacial　Cu6Sn5　increased　and　its　morphology　was　changed　from　scallop-like　to　needle-Re　and　then　to　rod-like　and　finally　to　particles.　The　rod-like　Ag3Sn　phase　was　formed　at　the　interface　of　solder　and　Cu6Sn5　layer　with　the　increase　of　the　aging　time.　The　growth　of　the　IMCs　was　found　follows　Arrhenius＇s　diffusion　model　and　the　corresponding　diffusion　factor　and　active　energy　were　obtained　by　data　fitting.　The　IMCs　growth　rate　was　found　increases　with　the　increase　of　the　aging　temperature.　The　fracture　site　of　the　soldered　joints　was　changed　from　the　solder　matrix　to　the　interfacial　COW　layer　with　the　increase　of　the　aging　time.