Competition between precipitation and segregation of Sc and its effects on thermal stability of Al-Cu-Mg-Ag alloys - Details

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Abstract：

The　competition　between　precipitation　and　segregation　of　Sc　and　its　effects　on　thermal　stability　of　Al-Cu-Mg-Ag　alloys　were　investigated　in　this　paper.　Al-Cu-Mg-Ag-Sc　has　good　thermal　stability　due　to　the　precipitation　of　Al3Sc　phases,　but　no　segregation　of　Sc　atoms　on　the　interface　of　the　phases　and　the　transformed　θ＇　phases.　Al-Cu-Mg-Ag-Si-Sc　alloy　has　the　best　thermal　stability　due　to　Sc　atoms　segregate　to　the　θ＇　phase　thus　inhibit　the　growth　of　the　θ＇　phase.　©　2021　Elsevier　B.V.

Keyword：

Aluminum alloys Silver alloys Magnesium alloys Precipitation (chemical) Silicon alloys Thermodynamic stability Microstructure Copper alloys Metallurgy Scandium alloys Phase transitions Binary alloys

Author Community：

[ 1 ] [Li, Bo]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 2 ] [Liang, Shangshang]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 3 ] [Wen, Shengping]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 4 ] [Zhao, Zhihao]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 5 ] [Wu, Xiaolan]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 6 ] [Wang, Wei]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 7 ] [Gao, Kunyuan]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 8 ] [Huang, Hui]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China
[ 9 ] [Nie, Zuoren]Faculty of Materials and manufacturing, Beijing University of Technology, Beijing; 100124, China

Reprint Author's Address：

文胜平
[wen, shengping]faculty of materials and manufacturing, beijing university of technology, beijing; 100124, china

Email：

wensp@bjut.edu.cn

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Source ：

Materials Letters

ISSN： 0167-577X

Year： 2021

Volume： 297

3 . 0 0 0

JCR@2022

ESI Discipline： MATERIALS SCIENCE;

ESI HC Threshold：116

JCR Journal Grade：2

Cited Count：

WoS CC Cited Count： 0

SCOPUS Cited Count： 22

ESI Highly Cited Papers on the List： 0 Unfold All

WanFang Cited Count：

Chinese Cited Count：

30 Days PV： 7

Affiliated Colleges：

材料科学与工程学院本学院/部未明确归属的数据

建筑与城市规划学院本学院/部未明确归属的数据

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